Circuit board
Circuit boards and methods for their manufacture are disclosed. The circuit boards carry high-speed signals using conductors formed to include lengthwise channels. The channels increase the surface area of the conductors, and therefore enhance the ability of the conductors to carry high-speed signals. In at least some embodiments, a discontinuity also exists between the dielectric constant within the channels and just outside the channels, which is believed to reduce signal loss into the dielectric material.
1. A circuit board, comprising:
a first board dielectric layer;
a second board dielectric layer that is located adjacent the first board dielectric layer;
a first local dielectric region that is located within the first board dielectric layer and adjacent the second board dielectric layer;
a second local dielectric region that is located within the second board dielectric layer and adjacent at least the first local dielectric region within the first board dielectric layer; and
a pair of differential conductors that are each located within at least one of the first board dielectric layer and the second board dielectric layer, within at least one of the first local dielectric region and the second local dielectric region, such that the pair of differential conductors are positioned immediately adjacent both the first local dielectric region and the second local dielectric region,
wherein the first local dielectric region and the second local dielectric region are configured with dielectric constants that are different than dielectric constants of the first board dielectric layer and the second board dielectric layer such that crosstalk between the pair of differential conductors and a third conductor located within at least one of the first board dielectric layer and the second board dielectric layer is reduced.
2. The circuit board of claim 1 , wherein the second board dielectric layer is located between the pair of differential conductors.
3. The circuit board of claim 1 , wherein the second local dielectric region extends between the pair of differential conductors.
4. The circuit board of claim 1 , wherein the second local dielectric region includes a second local dielectric region first portion that is located between a first differential conductor of the pair of differential conductors and the second board dielectric layer, and a second local dielectric region second portion that is located between a second differential conductor of the pair of differential conductors and the second board dielectric layer; and
wherein a first differential conductor of the pair of different conductors includes a first differential conductor side, the second differential conductor of the pair of differential conductors includes a second differential conductor side that faces the first differential conductor side, the first local dielectric region that is located between each of the pair of differential conductors and the first board dielectric layer extends beyond each of the first differential conductor side and the second differential conductor side, and the second local dielectric region first portion is coplanar with the first differential conductor side and the second local dielectric region second portion is coplanar with the second differential conductor side.
5. The circuit board of claim 1 , wherein each of the pair of differential conductors defines a channel that is located adjacent the second local dielectric region.
6. The circuit board of claim 1 , wherein the dielectric constant of the first local dielectric region is equal to the dielectric constant of the second local dielectric region.
7. The circuit board of claim 1 , wherein the dielectric constant of each of the first local dielectric region and the second local dielectric region is in the range of 2.0 to 3.6, and wherein the dielectric constant of each of the first board dielectric layer and the second board dielectric layer is in the range of 3.9 to 4.1.
8. The circuit board of claim 1 , wherein the dielectric constant of each of the first local dielectric region and the second local dielectric region are different, and the dielectric constant of each of the first board dielectric layer and the second board dielectric layer are different.
9. A circuit board, comprising:
a first conductor and a second conductor that are configured to operate as a differential conductor pair, wherein a channel is defined along the length of each of the first conductor and the second conductor; and
a first local dielectric region that is located adjacent a second local dielectric region, wherein the first conductor and the second conductor are located within at least one of the first local dielectric region and the second local dielectric region and immediately adjacent both the first local dielectric region and the second local dielectric region;
wherein the first local dielectric region and the second local dielectric region are configured with a dielectric constant that is different than dielectric constants of at least one board dielectric layer that is located immediately adjacent the first local dielectric region and the second local dielectric region such that crosstalk between the differential conductor pair and a third conductor that is not included in the differential conductor pair is reduced when the first conductor and a second conductor are operating as the differential conductor pair.
10. The circuit board of claim 9 , wherein the at least one adjacent board dielectric layer is located between the first conductor and the second conductor.
11. The circuit board of claim 9 , wherein the second local dielectric region extends between the first conductor and the second conductor.
12. The circuit board of claim 9 , wherein the first conductor includes a first conductor side, the second conductor includes a second conductor side that faces the first conductor side, the first local dielectric region extends beyond the first conductor side and the second conductor side, and a first portion of the second local dielectric region is coplanar with the first conductor side, and a second portion of the second local dielectric region is coplanar with the second conductor side.
13. The circuit board of claim 9 , wherein the dielectric constant of each at least one local dielectric region is the same.
14. The circuit board of claim 9 , wherein the dielectric constant of each at least one local dielectric region is in the range of 2.0 to 3.6, and wherein the dielectric constant of each at least one adjacent board dielectric layer is in the range of 3.9 to 4.1.
15. The circuit board of claim 9 , wherein the dielectric constant of each of the first local dielectric region and the second local dielectric region are different.
16. A method for fabricating a circuit board, comprising:
providing a first board dielectric layer;
forming a first local dielectric region and a second local dielectric region on the first board dielectric layer;
forming a first conductor on the first local dielectric region and a second conductor on the second local dielectric region to provide a pair of differential conductors;
forming a third local dielectric region on the first conductor and a fourth local dielectric region on the second conductor; and
providing a second board dielectric layer on the first board dielectric layer, the third local dielectric region, and the fourth local dielectric region;
wherein the first local dielectric region, the second local dielectric region, the third local dielectric region, and the fourth local dielectric region are configured with dielectric constants that are different than dielectric constants of the first board dielectric layer and the second board dielectric layer such that crosstalk in the pair of differential conductors is reduced.
17. The method of claim 16 , wherein the second board dielectric layer is located between the first conductor and the second conductor.
18. The method of claim 16 , wherein the third local dielectric region and the fourth local dielectric region extend between the first conductor and the second conductor.
19. The method of claim 16 , wherein the first conductor includes a first conductor side, the second conductor includes a second conductor side that faces the first conductor side, the first local dielectric region extends beyond the first conductor side, the second local dielectric region extends beyond the second conductor side, the third local dielectric region is substantially coplanar with the first conductor side, and the fourth local dielectric region is substantially coplanar with the second conductor side.
20. The method of claim 16 , wherein the first conductor defines a channel that is located adjacent the third local dielectric region and the second conductor defines a channel that is located adjacent the fourth local dielectric region.
21. The method of claim 16 , wherein the dielectric constant of the first local dielectric region, the second dielectric region, the third dielectric region, and the fourth dielectric region are approximately equal.
22. The method of claim 16 , wherein the dielectric constant of each of the first local dielectric region, the second local dielectric region, the third dielectric region, and the fourth dielectric is in the range of 2.0 to 3.6, and wherein the dielectric constant of each of the first board dielectric layer and the second board dielectric layer is in the range of 3.9 to 4.1.