IP Library Granted Patent US 10,240,030
Granted Patent B2
US 10,240,030 · App. 14/558,141 · Granted Mar 26, 2019

Article comprising a high flow polyetherimide composition

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Quick Facts
Patent No.
US 10,240,030
App. No.
14/558,141
Granted
Mar 26, 2019
Kind
B2
Abstract

Molded articles having a maximum thickness of 3 centimeters and including a polyetherimide composition are described. The polyetherimide compositions include 60 to 99.9 weight percent of a polyetherimide having a weight average molecular weight of 5,000 to 80,000 Daltons, and 0.1 to 40 weight percent of an aryl phosphate having a molecular weight from 500 to 1,200 Daltons, wherein weight percent is based on the total weight of the composition. The compositions have a melt flow at least 10% greater than the melt flow of the same polyetherimide composition without the aryl phosphate, measured according to ASTM D1238 at 337° C. under a 6.7 kilogram load.

Claims (42)

1. A molded article having a maximum thickness of 3 cm, comprising a polyetherimide composition, the composition comprising,

60 to 99.9 weight percent of a polyetherimide having a weight average molecular weight of 5,000 to 80,000 Daltons; and

0.1 to 40 weight percent of an aryl phosphate having a molecular weight from 500 to 1,200 Daltons;

wherein weight percent is based on the total weight of the composition;

wherein the polyetherimide composition excludes aryl phosphates having a molecular weight greater than 2,000 Daltons;

wherein thermoplastic polymers other than the polyetherimide are excluded from the composition;

wherein the composition has a melt volume-flow rate of greater than or equal to 5.0 cc/10 minutes at 337° C. using a 6 minute equilibration time and a 6.7 kilogram load, and a melt volume-flow rate using an 18 minute equilibration time of less than 30% higher than the 6 minute melt volume-flow rate measured under the same conditions.

2. The molded article of claim 1 , wherein a molded sample of the polyetherimide composition has a tensile modulus of at least 3,800 MPa, measured according to ASTM D638.

3. The molded article of claim 1 , wherein a molded sample of the polyetherimide composition has a percent transmission greater than or equal to 55%, and has a percent haze less than or equal to 5%, measured at 3.2 millimeters according to ASTM D1003.

4. The molded article of claim 1 , wherein a molded sample of the polyetherimide composition has a total average flame out time of less than or equal to 3.6 seconds measured according to Underwriters Laboratory test bulletin UL94 using 1.6 millimeter samples.

5. The molded article of claim 1 , wherein the composition has a glass transition temperature of greater than or equal to 190° C.

6. The molded article of claim 1 , wherein the polyetherimide comprises units of the formula

wherein

R is a C 2-20 hydrocarbon group,

T is —O— or a group of the formula —O—Z—O— wherein the divalent bonds of the —O— or the —O—Z—O— group are in the 3,3′, 3,4′, 4,3′, or the 4,4′ positions, and

Z is an aromatic C 6-24 monocyclic or polycyclic group optionally substituted with 1 to 6 C 1-8 alkyl groups, 1-8 halogen atoms, or a combination comprising at least one of the foregoing.

7. The molded article of claim 6 , wherein R is a divalent group of the formula

wherein

Q 1 is —O—, —S—, —C(O)—, —SO 2 —, —SO—, —C y H 2y — and a halogenated derivative thereof wherein y is an integer from 1 to 5, or —(C 6 H 10 ) z — wherein z is an integer from 1 to 4; and Z is a group derived from a dihydroxy compound of the formula

wherein

R a and R b are each independently a halogen atom or a monovalent C 1-6 alkyl group;

p and q are each independently integers of 0 to 4;

c is 0 to 4; and

X a is a single bond, —O—, —S—, —S(O)—, —SO 2 —, —C(O)—, or a C 1-18 organic bridging group.

8. The molded article of claim 6 , wherein each R is independently meta-phenylene, para-phenylene, or a combination comprising at least one of the foregoing, and Z is 4,4′-diphenylene isopropylidene.

9. The molded article of claim 1 , wherein the polyetherimide comprises a polyetherimide sulfone.

10. The molded article of claim 1 , having a total chlorine and bromine content of 100 ppm or less and a total sodium content of 1000 ppm or less.

11. The molded article of claim 1 , wherein the aryl phosphate comprises bisphenol A diphosphates, resorcinol diphosphates, biphenol diphosphates, hydroquinone diphosphates, acetophenone bisphenol diphosphates, dihydroxy diphenyl ether diphosphates, or a combination comprising at least one of the foregoing.

12. The molded article of claim 1 , wherein the aryl phosphate is an aryl phosphate having one oxygen atom linkage for each aryl ring in the phosphate structure, and wherein the polyetherimide composition has a change in melt flow at 340° C. over 30 minutes of less than 15% of the original melt flow value.

13. The molded article of claim 12 , wherein the aryl phosphate comprises bisphenol A bis(diphenyl phosphate).

14. The molded article of claim 1 , wherein the aryl phosphate has a boiling point at atmospheric pressure of greater than or equal to 300° C.

15. The molded article of claim 1 comprising,

95 to 99.9 weight percent of the polyetherimide; and

0.1 to 5 weight percent of the aryl phosphate.

16. The molded article of claim 1 , further comprising 1 to 50 weight percent of a reinforcing filler comprising glass fiber, carbon fiber, titanium dioxide, clay, talc, mica, silica, mineral filler, wollastonite, glass spheres, flaked glass, milled glass, carbon black and combinations comprising at least one of the foregoing.

17. The molded article of claim 16 , wherein the filler is an E-glass fiber having a diameter of 5 to 20 micrometers.

18. The molded article of claim 17 wherein the filler has 100 ppm or less of elements selected from the group consisting of mercury, lead, cadmium, tin, antimony, arsenic and thallium.

19. The molded article of claim 16 , wherein a molded sample of the polyetherimide composition has a tensile modulus of at least 7,000 MPa, measured according to ASTM D568.

20. The molded article of claim 1 , further comprising 0.01 to 3.0 weight percent of a silica.

21. The molded article of claim 1 , wherein the article is an electrical connector, a circuit board or circuit board component, a computer, a display screen, a communication device, or a component of a hand-held electronic device.

22. The molded article of claim 1 , wherein the molded article has a length that is at least 10 times the thickness.

23. The molded article of claim 1 , wherein the polyetherimide is prepared in the absence of a catalyst.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE THE APPLICATION NUMBER 15039474 PREVIOUSLY RECORDED AT REEL: 054528 FRAME: 0467. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 23, 2021
From: SABIC GLOBAL TECHNOLOGIES B.V.
To: SHPP GLOBAL TECHNOLOGIES B.V.
Reel/Frame 057453/0680 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2020
From: SABIC GLOBAL TECHNOLOGIES B.V.
To: SHPP GLOBAL TECHNOLOGIES B.V.
Reel/Frame 054528/0467 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2014
From: GALLUCCI, ROBERT RUSSELL; APPEL, PAMELA J.
To: SABIC GLOBAL TECHNOLOGIES B.V.
Reel/Frame 034565/0285 →