IP Library Granted Patent US 10,181,382
Granted Patent B2
US 10,181,382 · App. 14/558,892 · Granted Jan 15, 2019

Solid electrolytic capacitor

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Quick Facts
Patent No.
US 10,181,382
App. No.
14/558,892
Granted
Jan 15, 2019
Kind
B2
Abstract

A solid electrolytic capacitor includes a capacitor element and a plated layer. The capacitor element has a predetermined surface and outer peripheral surface other than the predetermined surface. The capacitor element includes an anode body, an anode lead wire and a cathode layer. The predetermined surface is perpendicular to a predetermined direction. The anode lead wire extends from the anode body along the predetermined direction through the predetermined surface. The cathode layer includes a solid electrolyte layer and forms the outer peripheral surface and a part of the predetermined surface. The plated layer completely covers the outer peripheral surface and the part of the predetermined surface.

Claims (21)

1. A solid electrolytic capacitor comprising:

a capacitor element having a predetermined surface and an outer peripheral surface other than the predetermined surface and said capacitor element includes an anode body, an anode lead wire and a cathode layer, the predetermined surface being perpendicular to a predetermined direction, the anode lead wire extending from the anode body along the predetermined direction through the predetermined surface, the cathode layer including a solid electrolyte layer and forming the outer peripheral surface and a part of the predetermined surface; and

a plated layer completely covering the outer peripheral surface and the part of the predetermined surface.

2. The solid electrolytic capacitor as recited in claim 1 , wherein:

the capacitor element further includes a dielectric layer;

the dielectric layer has a first part and a second part, the first part being formed on the anode body, the second part being formed on the anode lead wire;

the cathode layer is formed, at least, on the first part of the dielectric layer; and

the plated layer is formed all over the cathode layer.

3. The solid electrolytic capacitor as recited in claim 2 , wherein the cathode layer is formed all over the first part of the dielectric layer and extends over at least a part of the second part of the dielectric layer.

4. The solid electrolytic capacitor as recited in claim 2 , wherein:

the capacitor element further includes an insulative section;

the insulative section is formed on the second part of the dielectric layer; and

the cathode layer is formed all over the first part of the dielectric layer and the insulative section.

5. The solid electrolytic capacitor as recited in claim 4 , wherein the cathode layer comprises a conductive section which is formed on the insulative section and is connected to the solid electrolytic layer.

6. The solid electrolytic capacitor as recited in claim 4 , wherein the insulative section is positioned around a root of the anode lead wire.

7. The solid electrolytic capacitor as recited in claim 3 , wherein the capacitor element further includes an insulative separator which is formed on the cathode layer and neighbors on the plated layer in the predetermined direction.

8. The solid electrolytic capacitor as recited in claim 1 , wherein the cathode layer further includes a conductive layer which is formed on the solid electrolyte layer.

9. The solid electrolytic capacitor as recited in claim 8 , wherein the conductive layer comprises a graphite paste layer which is formed, at least, on the solid electrolytic layer.

10. The solid electrolytic capacitor as recited in claim 8 , wherein the conductive layer comprises an electrolytic polymerization layer which is formed, at least, on the solid electrolytic layer.

11. The solid electrolytic capacitor as recited in claim 1 , wherein the part of the predetermined surface has an area equal to or more than 10% of a total area of the predetermined surface.

12. The solid electrolytic capacitor as recited in claim 1 , wherein the part of the predetermined surface has an area equal to or more than 50% of a total area of the predetermined surface.

Assignments (7)
CHANGE OF ADDRESS Recorded Jun 6, 2024
From: TOKIN CORPORATION
To: TOKIN CORPORATION
Reel/Frame 067643/0209 →
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: BANK OF AMERICA, N.A.
To: KEMET CORPORATION,; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
Reel/Frame 047450/0926 →
CHANGE OF NAME Recorded Jun 20, 2017
From: NEC TOKIN CORPORATION
To: TOKIN CORPORATION
Reel/Frame 042928/0347 →
SECURITY AGREEMENT Recorded May 22, 2017
From: KEMET CORPORATION; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 042523/0639 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 034356 FRAME 0714. ASSIGNOR(S) HEREBY CONFIRMS THE THE INVENTORS HAVE ASSIGNED PATENT RIGHTS TO NEC TOKIN CORPORATION AS INDICATED ON THE DOCUMENT ORIGINALLY FILED AND ATTACHED.. Recorded Dec 4, 2014
From: ARAKI, KENJI; KONO, TAKASHI; MIHARA, TAKASHI
To: NEC TOKIN CORPORATION
Reel/Frame 034572/0994 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2014
From: ARAKI, KENJI; KONO, TAKASHI; MIHARA, TAKASHI
To: KEMET ELECTRONICS CORPORATION
Reel/Frame 034356/0714 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2014
From: SAIKI, YOSHIHIKO
To: KEMET ELECTRONICS CORPORATION
Reel/Frame 034356/0765 →