System for effectively transfering heat from electronic devices and method for forming the same
View Patent ↗A system for transferring heat by free convective flows of coolant inside a flexible container is disclosed. The flexible container is able to fully conform with the surface of base and heat sources, and the coolant filled inside the flexible container can easily create free convective flows in a narrow gap for continuously and efficiently remove the heat from the heat sources. A method for forming a heat transfer module is disclosed. The flexible container can be placed on the heat sources and then being inflated by the coolant to fully conform with the surface of base and heat sources. Alternatively, the inflated flexible container is being pressed to fully conform with the surface of base and heat sources during assembly of the heat transfer module.
1. A method for forming a heat transfer module, the method comprising:
disposing a flexible container on a heat source surface of at least one heat source placed on a base, wherein the flexible container is substantially flat, and the heat source surface of the at least one heat source is separate from a surface of the base;
inflating the flexible container with a coolant, such that the inflated flexible container is conformably in contact with the surface of the base and the heat source surface of the at least one heat source;
mounting an outer case over the surface of the base and the heat source surface of the at least one heat source, such that the inflated flexible container is confined in a space between the outer case and the surface of the base;
draining air from the space between the outer case and the surface of the base to enhance the shape of the inflated flexible container in conformity with the surface of the base and the heat source surface of the at least one heat source; and
sealing the inflated flexible container, such that the flexible container completely encloses the coolant and the coolant remains inside the flexible container, the sealing of the inflated flexible container including sealing the inflated flexible container prior to the mounting of the outer case,
wherein the heat source surface of the at least one heat source has a different level of height from the surface of the base in a direction.
2. The method of claim 1 , wherein the draining comprises placing the heat transfer module in a negative pressure chamber.
3. The method of claim 1 , further comprising:
creating free convective flows of the coolant within the inflated flexible container to transfer heat away from the heat source surface of the at least one heat source to surroundings.
4. A method for forming a heat transfer module, the method comprising:
providing a base with at least one heat source placed thereon, wherein the at least one heat source has a heat source surface separate from a surface of the base;
inflating a flexible container with a coolant to form an inflated balloon;
pressing the inflated balloon against the surface of the base and the heat source surface of the at least one heat source, such that the inflated balloon is conformably in contact with the surface of the base and the heat source surface of the at least one heat source, the pressing of the inflated balloon against the surface of the base and the heat source surface of the at least one heat source comprising mounting an outer case over the surface of the base and the heat source surface of the at least one heat source, such that the inflated balloon is confined in a space between the outer case and the surface of the base;
draining air from the space between the outer case and the surface of the base to enhance the shape of the inflated balloon in conformity with the surface of the base and the heat source surface of the at least one heat source; and
sealing the inflated flexible container, such that the flexible container completely encloses the coolant and the coolant remains inside the flexible container, the sealing of the inflated flexible container including sealing the inflated flexible container prior to the mounting of the outer case,
wherein the heat source surface of the at least one heat source has a different level of height from the surface of the base in a direction.
5. The method of claim 4 , wherein the draining comprises placing the heat transfer module in a negative pressure chamber.