Electronic package, package carrier, and method of manufacturing package carrier

1. A method of manufacturing a package carrier, comprising:

providing a holding substrate and a conductive layer, wherein the conductive layer is formed on the holding substrate;

forming an insulating pattern on the conductive layer, wherein the insulating pattern exposes a portion of the conductive layer;

providing a supporting board;

detachably fixing the insulating pattern in the supporting board;

removing the holding substrate after the step of detachably fixing the insulating pattern in the supporting board, wherein the conductive layer remains after the holding substrate is removed; and

patterning the conductive layer to form a wiring layer after the step of removing the holding substrate.

2. The method of manufacturing the package carrier according to claim 1 , wherein the insulating pattern is a solder mask layer.

3. The method of manufacturing the package carrier according to claim 1 further comprising forming a bonding material on the portion of the conductive layer exposed by the insulating pattern.

4. The method of manufacturing the package carrier according to claim 3 , wherein the bonding material is a solder layer, metallic layer or organic solderability preservatives (OSP) layer.

5. The method of manufacturing the package carrier according to claim 1 , wherein the supporting board includes a bonding layer, and the step of detachably fixing the insulating pattern in the supporting board further comprises fixing the insulating pattern in the bonding layer.

6. The method of manufacturing the package carrier according to claim 1 , wherein the supporting board includes a depression pattern aligned to the insulating pattern, and the step of detachably fixing the insulating pattern in the supporting board further comprises fixing the insulating pattern in the depression pattern.

7. The method of manufacturing the package carrier according to claim 6 , wherein the step of fixing the insulating pattern in the depression pattern includes fitting the insulating pattern into the depression pattern.

8. The method of manufacturing the package carrier according to claim 6 , wherein the insulating pattern has a thickness larger than or equal to a depth of the depression pattern.

9. The method of manufacturing the package carrier according to claim 6 , wherein the insulating pattern has a thickness less than a depth of the depression pattern.

10. The method of manufacturing the package carrier according to claim 6 further comprising forming the supporting board, wherein the step of forming the supporting board comprises:

providing an imprint template having an imprinting pattern; and

laminating a metal layer on a plastic board by the imprint template, wherein the imprinting pattern is transferred into the metal layer to form the depression pattern.

11. The method of manufacturing the package carrier according to claim 10 , wherein a thermal process is performed to cure the plastic board while the metal layer is being laminated on the plastic board.

12. The method of manufacturing the package carrier according to claim 1 , wherein the holding substrate includes a main plate and a release layer, and the release layer is interposed between the main plate and the conductive layer.

13. The method of manufacturing the package carrier according to claim 1 , further comprising forming a protective layer on the wiring layer after the wiring layer is formed.

14. The method of manufacturing the package carrier according to claim 1 , further comprising changing a surface roughness of the wiring layer after the wiring layer is formed.

15. The method of manufacturing the package carrier according to claim 1 , further comprising:

disposing an electronic component on the wiring layer;

forming a molding layer encapsulating the electronic component on the wiring layer; and

separating the insulating pattern from the supporting board after the step of forming the molding layer.

16. The method of manufacturing the package carrier according to claim 15 , further comprising dicing the supporting board, the insulating pattern and the wiring layer to form a plurality of the substrate strips before the step of disposing the electronic component on the wiring layer, wherein the electronic component is disposed on one of the substrate strips.

17. The method of manufacturing the package carrier according to claim 16 further comprising dicing the substrate strip after the step of separating the insulating pattern from the supporting board.

18. A package carrier, comprising:

a wiring layer including at least one connecting pad and at least one mounting pad, wherein the mounting pad is used for disposing an electronic component, and the connecting pad is used for electrically connecting the electronic component;

an insulating pattern stacked on and connected to the wiring layer;

a supporting board comprising:

a plastic board; and

a metal layer laminated on the plastic board and having a depression pattern aligned to the insulating pattern, wherein the insulating pattern is fixed in the depression pattern, and the metal layer is interposed between the insulating pattern and the plastic board.

19. An electronic package, comprising:

a package carrier comprising:

a wiring layer including at least one connecting pad and at least one mounting pad; and

an insulating pattern stacked on and connected to the wiring layer;

a supporting board comprising:

a plastic board; and

a metal layer laminated on the plastic board and having a depression pattern aligned to the insulating pattern, wherein the insulating pattern is fixed in the depression pattern, and the metal layer is interposed between the insulating pattern and the plastic board;

an electronic component disposed on the mounting pad and electrically connected to the at least one connecting pad, wherein the wiring layer is interposed between the electronic component and the insulating pattern; and

a molding layer covering the wiring layer and the electronic component.