Moisture resistant polyimide compositions
View Patent ↗The invention relates to a moisture resistant composition comprising: a) from 20 to 80 weight percent based on the total weight of the composition of a polyetherimide copolymer made from a monomer mixture comprising 3,3′ bisphenol-A dianhydride (BPADA), and 4,4′-diaminodiphenyl sulfone (DDS); b) from 5 to 75 weight percent based on the total weight of the composition of polyetheretherketone (PEEK); and c) from 0 to 30 weight percent based on the total weight of the composition of a filler. The invention relates to a reflector substrate comprising a moisture resistant layer metalized with a reflective layer, wherein the moisture resistant layer comprising the moisture resistant composition. The invention relates to a method for producing a metalized coating without a primer comprising applying a reflective layer directly to a moisture resistant layer in the absence of a primer, wherein the moisture resistant layer comprises the moisture resistant composition.
1. A composite article comprising a moisture resistant polymeric substrate layer; said polymeric substrate layer being directly bonded to a metal layer in the absence of a primer between the polymeric substrate layer and the metal layer, wherein the moisture resistant polymeric substrate layer consists essentially of:
a) 25 weight percent based on the total weight of the substrate layer of a polyetherimide made from a monomer mixture comprising 3,3′ bisphenol-A dianhydride (BPADA), and 4,4′-diaminodiphenyl sulfone (DDS);
b) 66 weight percent based on the total weight of the substrate layer of polyetheretherketone (PEEK); and
c) 9 weight percent based on the total weight of the substrate layer of a silica filler; and,
a metal layer bonded directly to the polymeric substrate layer in the absence of a primer between the polymeric substrate layer and the metal layer.
2. The composite article according to claim 1 , wherein the metal layer is selected from the group consisting of silver, aluminum, and combinations thereof.
3. The composite article of claim 1 , wherein the substrate layer is a light emitting diode.
4. The composite article of claim 1 , wherein the polyetherimide of component a) is made from a monomer mixture consisting of 3,3 bisphenol-A dianhydride (BPADA), and 4,4′-diaminodiphenyl sulfone (DDS).
5. The composite article of claim 1 , wherein the metal layer comprises a solder.
6. The composite article of claim 5 , wherein the solder comprises a lead free solder.
7. The composite article of claim 1 , wherein the composite article is placed in proximity to the jet engine wash of the jet engine of the aircraft.
8. The composite article of claim 1 , wherein the metal layer a reflective layer.