FLEXIBLE ASSEMBLY MACHINE, SYSTEM AND METHOD
An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module.
1 . A pick and place head comprising:
a nozzle configured to pick up a component;
an attachment mechanism for attaching the pick and place head to a continuous circuitous track such that the pick and place head is movable along the continuous circuitous track; and
a position sensing system for sensing the position of the pick and place head with respect to the continuous circuitous track in two or more dimensions.
2 . The pick and place head of claim 1 , wherein the component is an electronic component and wherein the nozzle is configured to place the component on a printed circuit board.
3 . The pick and place head of claim 1 , wherein the position sensing system is configured to sense the position of the attachment mechanism with respect to the track.
4 . The pick and place head of claim 3 , further comprising a spindle, wherein the position sensing system is configured to sense the position of the spindle with respect to the track.
5 . The pick and place head of claim 1 , wherein the position sensing system includes two sensors for determining rotation of the pick and place head in a first plane.
6 . The pick and place head of claim 5 , wherein the position sensing system includes two sensors for determining rotation of the pick and place head in a second plane that is perpendicular to the first plane.
7 . The pick and place head of claim 1 , wherein the position sensing system provides sub-micron measurement accuracy.
8 . The pick and place head of claim 1 , wherein the position sensing system further includes a sub-micron linear encoder read head that senses the position of the pick and place head with respect to the track.
9 . The pick and place head of claim 4 , wherein the position sensing system includes six proximity sensors that continuously sense the position of the spindle with respect to the track in three perpendicular or substantially perpendicular axes.
10 . A method comprising:
providing a pick and place head;
attaching the pick and place head to a continuous circuitous track such that the pick and place head is movable along the continuous circuitous track;
sensing, by the pick and place head, the position of the pick and place head with respect to the continuous circuitous track in two or more dimensions;
picking up, by the pick and place head on the track, a component; and
placing, by the pick and place head on the track, the component on an electronic assembly.
11 . The method of claim 10 , wherein the component is an electronic component and wherein the electronic assembly is a printed circuit board.
12 . The method of claim 10 , sensing the position of an attachment mechanism of the pick and place head with respect to the track, wherein the attachment mechanism is configured to attach the pick and place head to the continuous circuitous track.
13 . The method of claim 12 , wherein the pick and place further includes a spindle, and wherein the method further comprises sensing the position of the spindle with respect to the track.
14 . The method of claim 10 , further comprising determining a rotation of the pick and place head in a first plane.
15 . The method of claim 14 , further comprising determining a second rotation of the pick and place head in a second plane that is perpendicular to the first plane.
16 . The method of claim 10 , further comprising sensing the position of the pick and place head with sub-micron measurement accuracy.
17 . The method of claim 10 , further comprising continuously sensing the position of the spindle with respect to the track in three perpendicular or substantially perpendicular axes.
18 . A pick and place head comprising:
a spindle configured to pick up and place a component;
an attachment mechanism for attaching the pick and place head to a continuous circuitous track such that the pick and place head is movable along the continuous circuitous track; and
a position sensing system for sensing the position of the pick and place head with respect to the continuous circuitous track in two or more dimensions.
19 . The pick and place head of claim 18 , wherein the component is an electronic component and wherein the spindle is configured to place the component on a printed circuit board.
20 . The pick and place head of claim 18 , wherein the position sensing system is configured to sense the position of the attachment mechanism with respect to the track.