System and method for metallization and reinforcement of glass substrates

1. A system for backside metallization and reinforcement of a glass substrate, said system comprising:

a. the glass substrate comprising:

i. a plurality of through-holes extending from a top surface to the bottom surface of the glass substrate, wherein each of the holes comprise a top end, a bottom end, and a sidewall; and

ii. at least one interior layer disposed inside the hole; wherein the interior layer comprises at least one metallized layer; wherein the metallized layer comprises at least one conductive type material; wherein the hole is substantially filled with at least one conductive type material; wherein at least one metallized layer substantially occupies the volume of the hole after firing and curing the glass substrate, wherein the hole is hermetic, and wherein the hole has a low resistivity;

b. a plurality of backside metallized pads, wherein the backside metallized pads is disposed on the bottom surface of the glass substrate;

c. a plurality of under-bump metallization (UBM) pads enclosing the backside metallized pads; and

d. a sacrificial substrate, said sacrificial substrate comprising:

i. a sacrificial layer comprising a top surface and a bottom surface, wherein an opaque film coats the top surface, the bottom surface, or both the top surface and the bottom surface of the sacrificial layer; and

ii. an adhesive applied to the top surface of the sacrificial layer;

 wherein the adhesive binds the sacrificial layer to the bottom surface of the glass substrate, whereby the sacrificial substrate protects the backside metallized pads and UBM pads, whereby the reinforcing substrate reinforces the glass substrate to provide support during handling and processing of the glass substrate.

2. The system of claim 1 , wherein a plurality of bumps is disposed on the UBM pads.

3. The system of claim 1 , wherein a plurality of redistribution layers is applied to the bottom surface of the glass substrate prior to applying the backside metallized pads.

4. The system of claim 1 , wherein the backside metallized pads cover the bottom ends of the through-holes.

5. The system of claim 1 , wherein the backside metallized pads are patterned.

6. The system of claim 1 , wherein the backside metallized pads completely cover the bottom surface of the glass substrate.

7. The system of claim 1 , wherein the backside metallized pads partially cover the bottom surface of the glass substrate.

8. The system of claim 1 , wherein the sacrificial substrate is detachable.

9. The system of claim 8 , wherein the glass substrate is cleaned after detaching from the sacrificial substrate.

10. The system of claim 1 , wherein the sacrificial substrate is reusable.

11. The system of claim 1 , wherein the conductive type material comprises:

a. at least one metal;

b. at least one glass frit composition;

c. at least one resin; and

d. at least one non-conductive inert additive.

12. The system of claim 1 , wherein at least one layer of plating is disposed on the UBM pads.

13. The system of claim 12 , wherein a first layer of plating comprises Ti, Ni, or Al.

14. The system of claim 13 , wherein a second layer of plating comprises Cu or Au.

15. The system of claim 14 , wherein a third layer of plating comprises electroless and immersion metals.

16. The system of claim 15 , wherein the electroless and immersion metals is electroless nickel immersion gold (ENIG) or electroless nickel/immersion palladium/immersion gold (ENIPIG).

17. A system for backside metallization and reinforcement of a glass substrate, said system comprising:

a. the glass substrate comprising:

i. a plurality of through-holes extending from a top surface to the bottom surface of the glass substrate, wherein each of the holes comprise a top end, a bottom end, and a sidewall; and

ii. at least one interior layer disposed inside the hole; wherein the interior layer comprises at least one metallized layer; wherein the metallized layer comprises at least one conductive type material; wherein the hole is substantially filled with at least one conductive type material; wherein at least one metallized layer substantially occupies the volume of the hole after firing and curing the glass substrate, wherein the hole is hermetic, and wherein the hole has a low resistivity;

b. a plurality of backside metallized pads, wherein the backside metallized pads is disposed on the bottom surface of the glass substrate;

c. a plurality of under-bump metallization (UBM) pads enclosing the backside metallized pads;

d. a plurality of bumps disposed on the UBM pads; and

e. a sacrificial substrate, said sacrificial substrate comprising:

i. a sacrificial layer comprising a top surface and a bottom surface, wherein an opaque film coats the bottom surface of the sacrificial layer; and

ii. a adhesive applied to the top surface of the sacrificial layer, wherein the adhesive binds the sacrificial layer to the bottom surface of the glass substrate;

whereby the sacrificial substrate protects the backside metallized pads and UBM pads, whereby the sacrificial substrate reinforces the glass substrate to provide support during handling and processing of the glass substrate.

18. The system of claim 17 , wherein the sacrificial substrate is detachable.

19. The system of claim 17 , wherein the conductive type material comprises:

a. at least one metal;

b. at least one glass frit composition;

c. at least one resin; and

d. at least one non-conductive inert additive.

20. The system of claim 17 , wherein at least one layer of plating is disposed on the UBM pads.