IP Library Granted Patent US 10,140,232
Granted Patent B2
US 10,140,232 · App. 14/572,913 · Granted Nov 27, 2018

Peripheral component interface (PCI) system and method for expanding PCI nodes in an information handling system

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Quick Facts
Patent No.
US 10,140,232
App. No.
14/572,913
Granted
Nov 27, 2018
Kind
B2
Abstract

An information handling system (IHS), peripheral component interface (PCI) system and method for expanding PCI nodes in an IHS. The PCI system includes a primary PCI node. The primary PCI node has a PCI switch communicatively coupled to a processor via a system interconnect. The PCI switch is communicatively coupled to several PCI devices. A communication module is communicatively coupled to the PCI switch. A PCI expansion node is communicatively coupled to the primary PCI node via a PCI bus and a sideband bus. The IHS executes firmware that enables expansion of the IHS by configuring the primary PCI node to recognize the one or more interconnected PCI expansion nodes and integrate the functions of the interconnected PCI expansion nodes into an expanded PCI subsystem. The primary PCI node and PCI expansion node can be substantially identical IHSs, having the same motherboards and chassis.

Claims (80)

1. An information handling system (IHS) comprising:

a primary peripheral component interface (PCI) node having:

a first PCI switch communicatively coupled to a first processor via a first system interconnect, the first PCI switch communicatively coupled to a plurality of first PCI devices;

a first communication module communicatively coupled to the first PCI switch; and

a first base motherboard controller (BMC), the first BMC configured to control power and thermal functions of the first PCI devices;

a first PCI expansion node interconnected and communicatively coupled to the primary PCI node via a first PCI bus and a first sideband bus, the first PCI expansion node comprising a local BMC that controls local power and thermal functions of the expansion node a second PCI switch communicatively coupled to a second communication module via a second system interconnect, the second PCI switch communicatively coupled to a plurality of second PCI devices, wherein side band signals communicated on the first sideband bus enable the primary PCI node to access errors, inventory, and diagnostics of the plurality of second PCI devices coupled to the first PCI expansion node, wherein the local BMC is a separate device from the first BMC and locally controls power, thermal and diagnostics for the first PCI expansion node independently of the primary PCI node;

a processor communicatively coupled to the primary PCI node via a first system interconnect and controlling input/output operations involving the primary PCI node; and

firmware executing within the IHS that enables PCI-based expansion of the IHS by configuring the primary PCI node to recognize each interconnected PCI expansion node and integrate functions of the interconnected PCI expansion nodes into an expanded PCI subsystem.

2. The information handling system of claim 1 , wherein

the second communication module is communicatively coupled to the second PCI switch via the second system interconnect and communicatively coupled to the first communication module via both the first PCI bus and the sideband bus.

3. The information handling system of claim 2 , wherein the first sideband bus is utilized to communicate data corresponding to the second PCI devices in the first PCI expansion node to the primary PCI node.

4. The information handling system of claim 3 , wherein the data corresponding to the second PCI devices includes at least one of:

thermal management data;

power management data;

PCI device data;

error data; and

diagnostic data.

5. The information handling system of claim 2 , further comprising:

a third communication module communicatively coupled to the second PCI switch, the third communication module adapted to communicate with a second PCI expansion node via a second PCI bus and a second sideband bus.

6. The information handling system of claim 5 , wherein the second PCI expansion node further comprises:

a third PCI switch communicatively coupled to a fourth communication module via a third system interconnect and communicatively coupled to a plurality of third PCI devices; and

the fourth communication module communicatively coupled to the third PCI switch and communicatively coupled to the third communication module via the second PCI bus and the second sideband bus.

7. The information handling system of claim 1 , wherein the firmware further configures the IHS to:

trigger the first PCI expansion node to transmit data regarding a plurality of second PCI devices to the primary PCI node via the first sideband bus;

receive data regarding the second PCI devices; and

determine at least one PCI device characteristic associated with the second PCI devices from the received data.

8. The information handling system of claim 7 , wherein the firmware further configures the IHS to:

receive, via the sideband bus, diagnostic data regarding the second PCI devices;

determine an error condition associated with at least one of the second PCI devices; and

display the error condition.

9. The information handling system of claim 1 , wherein the primary PCI node and the first PCI expansion node each have substantially identical chassis and motherboard.

10. A peripheral component interface (PCI) system comprising:

a primary PCI node having:

a first PCI switch communicatively coupled to a first processor via a first system interconnect, the first PCI switch communicatively coupled to a plurality of first PCI devices;

a first communication module communicatively coupled to the first PCI switch; and

a first base motherboard controller (BMC), the first BMC configured to control power and thermal functions of the first PCI devices;

a first PCI expansion node interconnected and communicatively coupled to the primary PCI node via a first PCI bus and a first sideband bus, the first PCI expansion node comprising a local BMC that controls local power and thermal functions of the expansion node a second PCI switch communicatively coupled to a second communication module via a second system interconnect, the second PCI switch communicatively coupled to a plurality of second PCI devices, wherein side band signals communicated on the first sideband bus enable the primary PCI node to access errors, inventory, and diagnostics of the plurality of second PCI devices coupled to the first PCI expansion node, wherein the local BMC is a separate device from the first BMC and locally controls power, thermal and diagnostics for the first PCI expansion node independently of the primary PCI node; and

firmware executing within an information handling system (IHS) housing the PCI system that enables expansion of the IHS by configuring the primary PCI node to recognize one or more interconnected PCI expansion nodes and integrate the functions of the one or more interconnected PCI expansion nodes into an expanded PCI subsystem.

11. The PCI system of claim 10 , wherein

the second communication module is communicatively coupled to the second PCI switch via the second system interconnect and communicatively coupled to the first communication module via both the first PCI bus and the sideband bus.

12. The PCI system of claim 11 , wherein the first sideband bus enables data corresponding to the second PCI devices in the first PCI expansion node to be communicated to the primary PCI node.

13. The PCI system of claim 12 , wherein the data corresponding to the second PCI devices includes at least one of:

thermal management data;

power management data;

PCI device data;

error data; and

diagnostic data.

14. The PCI system of claim 11 , further comprising:

a third communication module communicatively coupled to the second PCI switch, the third communication module adapted to communicate with a second PCI expansion node via a second PCI bus and a second sideband bus.

15. The PCI system of claim 14 , wherein the second PCI expansion node further comprises:

a third PCI switch communicatively coupled to a fourth communication module via a third system interconnect and communicatively coupled to a plurality of third PCI devices;

the fourth communication module communicatively coupled to the third PCI switch and communicatively coupled to the third communication module via the second PCI bus and the second sideband bus.

16. The PCI system of claim 10 , wherein the firmware further configures the system to:

trigger the first PCI expansion node to transmit data regarding a plurality of second PCI devices to the primary PCI node via the first sideband bus;

receive data regarding the second PCI devices; and

determine at least one PCI device characteristic associated with the second PCI devices from the received data.

17. The PCI system of claim 16 , wherein the firmware further configures the system to:

receive, via the sideband bus, diagnostic data regarding the second PCI devices;

determine an error condition associated with at least one of the second PCI devices; and

display the error condition.

18. The PCI system of claim 10 , wherein the primary PCI node and the first PCI expansion node each have identical chassis and motherboards.

19. A computer implemented method for expanding PCI nodes in an information handling system (IHS), the method comprising:

providing a first PCI expansion node interconnected and communicatively coupled to a primary PCI node via a first PCI bus and a first sideband bus,

the primary PCI node having: a first PCI switch communicatively coupled to a first processor via a first system interconnect, the first PCI switch communicatively coupled to a plurality of first PCI devices; a first communication module communicatively coupled to the first PCI switch; and a first base motherboard controller (BMC), the first BMC configured to control power and thermal functions of the first PCI devices; and

the first PCI expansion node comprising a local BMC that controls local power and thermal functions of the expansion node a second PCI switch communicatively coupled to a second communication module via a second system interconnect, the second PCI switch communicatively coupled to a plurality of second PCI devices, wherein side band signals communicated on the first sideband bus enable the primary PCI node to access errors, inventory, and diagnostics of the plurality of second PCI devices coupled to the first PCI expansion node, wherein the local BMC is a separate device from the first BMC and locally controls power, thermal and diagnostics for the first PCI expansion node independently of the primary PCI node;

triggering the first PCI expansion node to transmit, to the primary PCI node via a first sideband bus, data regarding the plurality of PCI devices in the PCI expansion node;

receiving data regarding the second PCI devices at the primary PCI node;

generating an inventory of the PCI devices coupled to the PCI expansion node;

enabling the primary PCI node to access the PCI devices in the PCI expansion node; and

controlling, via the primary PCI node, the PCI devices in the first PCI expansion node.

20. The method of claim 19 , wherein the received data comprises at least one of:

thermal management data;

power management data;

PCI device inventory data;

error data; and

diagnostic data.

21. The method of claim 19 , further comprising:

receiving diagnostic data and error data regarding the second PCI devices;

determining an error condition associated with at least one of the second PCI devices; and

displaying the error condition.

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
RELEASE OF REEL 035104 FRAME 0043 (NOTE) Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; COMPELLENT TECHNOLOGIES, INC.
Reel/Frame 040027/0123 →
RELEASE OF REEL 035103 FRAME 0809 (TL) Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; COMPELLENT TECHNOLOGIES, INC.
Reel/Frame 040027/0934 →
RELEASE OF REEL 035103 FRAME 0536 (ABL) Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; COMPELLENT TECHNOLOGIES, INC.
Reel/Frame 040016/0864 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (NOTES) Recorded Feb 26, 2015
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; COMPELLENT TECHNOLOGIES, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035104/0043 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (ABL) Recorded Feb 26, 2015
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; COMPELLENT TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035103/0536 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Feb 26, 2015
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; COMPELLENT TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 035103/0809 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2014
From: HARTMAN, COREY DEAN; GENZ, CURTIS
To: DELL PRODUCTS, L.P.
Reel/Frame 034524/0858 →