Semiconductor device with oxide semiconductor film
To provide a semiconductor device including a transistor in which an oxide semiconductor is used and on-state current is high. In a semiconductor device including a first transistor provided in a driver circuit portion and a second transistor provided in a pixel portion, the first transistor and the second transistor have different structures. Furthermore, the first transistor and the second transistor are transistors having a top-gate structure in which conductive films serving as a gate electrode, a source electrode, and a drain electrode do not overlap. Furthermore, in an oxide semiconductor film, an impurity element is contained in a region which does not overlap with the gate electrode, the source electrode, and the drain electrode.
1. A semiconductor device comprising:
a first transistor comprising:
a first gate electrode over an insulating surface;
a first insulating film over the first gate electrode;
a first oxide semiconductor film over the first insulating film;
a pair of first conductive films in contact with the first oxide semiconductor film;
a second insulating film over the first oxide semiconductor film; and
a second gate electrode over the second insulating film,
a second transistor comprising:
a second oxide semiconductor film over the first insulating film;
a pair of second conductive films in contact with the second oxide semiconductor film;
the second insulating film over the second oxide semiconductor film; and
a third gate electrode over the second insulating film,
wherein the first oxide semiconductor film comprises an impurity element in a first region that does not overlap with the second gate electrode and the pair of first conductive films, and
wherein the second oxide semiconductor film comprises the impurity element in a second region that does not overlap with the third gate electrode and the pair of second conductive films.
2. The semiconductor device according to claim 1 ,
wherein the first oxide semiconductor film and the second oxide semiconductor film each have a multilayer structure including a first film and a second film, and
wherein the first film differs from the second film in an atomic ratio of metal elements.
3. The semiconductor device according to claim 1 ,
wherein the first oxide semiconductor film and the second oxide semiconductor film each have a multilayer structure in which a first film, a second film, and a third film are stacked, and
wherein the second film differs from the first film and the third film in an atomic ratio of metal elements.
4. The semiconductor device according to claim 1 ,
wherein, in the first oxide semiconductor film, an impurity element concentration of the first region is higher than an impurity element concentration of a third region overlapping with the second gate electrode and is higher than or equal to 1×10 18 atoms/cm 3 and lower than or equal to 1×10 22 atoms/cm 3 , and
wherein, in the second oxide semiconductor film, an impurity element concentration of the second region is higher than an impurity element concentration of a fourth region overlapping with the third gate electrode and is higher than or equal to 1×10 18 atoms/cm 3 and lower than or equal to 1×10 22 atoms/cm 3 .
5. The semiconductor device according to claim 1 ,
wherein, in the first oxide semiconductor film, a hydrogen concentration of the first region is higher than a hydrogen concentration of a third region overlapping with the second gate electrode and is higher than or equal to 8×10 19 atoms/cm 3 , and
wherein, in the second oxide semiconductor film, a hydrogen concentration of the second region is higher than a hydrogen concentration of a fourth region overlapping with the third gate electrode and is higher than or equal to 8×10 19 atoms/cm 3 .
6. The semiconductor device according to claim 1 ,
wherein the impurity element is at least one of hydrogen, boron, carbon, nitrogen, fluorine, aluminum, silicon, phosphorus, chlorine, and a rare gas element.
7. The semiconductor device according to claim 1 , further comprising a film containing hydrogen,
wherein the film is in contact with the first region and the second region.
8. The semiconductor device according to claim 7 , wherein the film is a nitride insulating film.
9. The semiconductor device according to claim 1 ,
wherein the pair of first conductive films and the pair of second conductive films comprise metal silicide or metal silicide-nitride.
10. The semiconductor device according to claim 1 ,
wherein the first transistor is provided in a driver circuit portion, and
wherein the second transistor is provided in a pixel portion.
11. A semiconductor device comprising:
a first transistor comprising:
a first oxide semiconductor film over an insulating surface;
a pair of first conductive films in contact with the first oxide semiconductor film;
a first insulating film over the first oxide semiconductor film; and
a first gate electrode over the first insulating film,
a second transistor comprising:
a second oxide semiconductor film over the insulating surface;
a pair of second conductive films in contact with the second oxide semiconductor film;
the first insulating film in contact with the second oxide semiconductor film; and
a second gate electrode over the first insulating film,
wherein the first oxide semiconductor film comprises an impurity element in a first region that does not overlap with the first gate electrode and the pair of first conductive films,
wherein the second oxide semiconductor film comprises the impurity element in a second region that does not overlap with the second gate electrode and the pair of second conductive films,
wherein the first oxide semiconductor film comprises a first film and a second film over the first film, and
wherein the second oxide semiconductor film differs from the first film in an atomic ratio of metal elements.
12. The semiconductor device according to claim 11 ,
wherein the atomic ratio of metal elements of the second oxide semiconductor film is the same as an atomic ratio of metal elements of the second film.
13. The semiconductor device according to claim 11 ,
wherein an edge portion of the second film is positioned on an outer side than an edge portion of the first film.
14. The semiconductor device according to claim 11 ,
wherein the first transistor comprises a third gate electrode and a second insulating film between the insulating surface and the first oxide semiconductor film.
15. The semiconductor device according to claim 11 ,
wherein, in the first oxide semiconductor film, an impurity element concentration of the first region is higher than an impurity element concentration of a third region overlapping with the first gate electrode and is higher than or equal to 1×10 18 atoms/cm 3 and lower than or equal to 1×10 22 atoms/cm 3 , and
wherein, in the second oxide semiconductor film, an impurity element concentration of the second region is higher than an impurity element concentration of a fourth region overlapping with the second gate electrode and is higher than or equal to 1×10 18 atoms/cm 3 and lower than or equal to 1×10 22 atoms/cm 3 .
16. The semiconductor device according to claim 11 ,
wherein, in the first oxide semiconductor film, a hydrogen concentration of the first region is higher than a hydrogen concentration of a third region overlapping with the first gate electrode and is higher than or equal to 8×10 19 atoms/cm 3 , and
wherein, in the second oxide semiconductor film, a hydrogen concentration of the second region is higher than a hydrogen concentration of a fourth region overlapping with the second gate electrode and is higher than or equal to 8×10 19 atoms/cm 3 .
17. The semiconductor device according to claim 11 ,
wherein the impurity element is at least one of hydrogen, boron, carbon, nitrogen, fluorine, aluminum, silicon, phosphorus, chlorine, and a rare gas element.
18. The semiconductor device according to claim 11 , further comprising a film containing hydrogen,
wherein the film is in contact with the first region and the second region.
19. The semiconductor device according to claim 18 , wherein the film is a nitride insulating film.
20. The semiconductor device according to claim 11 ,
wherein the pair of first conductive films and the pair of second conductive films comprise metal silicide or metal silicide-nitride.
21. The semiconductor device according to claim 11 ,
wherein the first transistor is provided in a driver circuit portion, and
wherein the second transistor is provided in a pixel portion.