Media substrate gripper including a plurality of snap-fit fingers
View Patent ↗One aspect of an assembly configured to grip a substrate includes a gripper including a first finger and a second finger, a first chuck body snap-fit to the first finger, and a second chuck body snap-fit to the second finger.
1. An assembly configured to grip a substrate, the assembly comprising:
a gripper including a first finger and a second finger;
a first adapter coupled to the first finger using a first screw mechanism;
a second adapter coupled to the second finger using a second screw mechanism;
a first chuck body snap-fit to the first finger; and
a second chuck body snap-fit to the second finger.
2. The assembly of claim 1 , wherein:
the first chuck body includes a first recess configured to receive the first adapter when the first chuck body is coupled to the first adapter; and
the second chuck body includes a second recess configured to receive the second adapter when the second chuck body is coupled to the second adapter.
3. The assembly of claim 2 , wherein:
the first adapter includes a first external contour and the first recess of the first chuck body is formed with a shape matching the external contour of the first adapter; and
the second adapter includes a second external contour and the second recess of the second chuck body is formed with a shape matching the second external contour of the second adapter.
4. The assembly of claim 2 , further comprising:
a mount snap-fit to the gripper; and
a shaft coupled to the mount.
5. The assembly of claim 4 , further comprising a third adapter coupled to the gripper, wherein the mount includes a third recess configured to receive the third adapter when the mount is coupled to the gripper.
6. The assembly of claim 1 , wherein:
the first chuck body includes a first chamfer surface configured to engage with the substrate; and
the second chuck body includes a second chamfer surface configured to engage with the substrate.
7. The assembly of claim 6 , wherein the first finger and the second finger are configured to move in opposing directions with respect to one another when supplied with compressed air causing the first chamfer surface and the second chamfer surface to mechanically grip the substrate.
8. A substrate polishing apparatus, comprising:
a supporting base configured to support a plurality of substrates; and
a device configured to unload the plurality of substrates off of the supporting base, the device comprising:
a plurality of gripper assemblies each configured to grip a substrate, each gripper assembly comprising:
a gripper including a first finger and a second finger;
a first adapter coupled to the first finger using a first screw mechanism;
a second adapter coupled to the second finger using a second screw mechanism;
a first chuck body snap-fit to the first finger; and
a second chuck body snap-fit to the second finger.
9. The apparatus of claim 8 , wherein:
the first chuck body includes a first recess configured to receive the first adapter when the first chuck body is coupled to the first finger; and
the second chuck body includes a second recess configured to receive the second adapter when the second chuck body is coupled to the second finger.
10. The apparatus of claim 9 , wherein:
the first adapter includes a first external contour and the first recess of the first chuck body is formed with a shape matching the external contour of the first adapter; and
the second adapter includes a second external contour and the second recess of the second chuck body is formed with a shape matching the second external contour of the second adapter.
11. The apparatus of claim 9 , further comprising:
a mount snap-fit to the gripper; and
a shaft coupled to the mount.
12. The apparatus of claim 11 , further comprising a third adapter coupled to the gripper, wherein the mount includes a third recess configured to receive the third adapter when the mount is coupled to the gripper.
13. The apparatus of claim 8 , wherein:
the first chuck body includes a first chamfer surface configured to engage with the substrate; and
the second chuck body includes a second chamfer surface configured to engage with the substrate.
14. The apparatus of claim 13 , wherein the first finger and the second finger are configured to move in opposing directions with respect to one another when supplied with compressed air causing the first chamfer surface and the second chamfer surface to mechanically grip the substrate.
15. An assembly configured to receive a plurality of substrates during a recording media fabrication process, the assembly comprising:
a base comprising a first adapter and a second adapter; and
a mount comprising a plurality of curved grooves each configure to retain a substrate, a first recess and a second recess, the mount coupled to the first adapter and the second adapter,
wherein the first recess is positioned around the first adapter and the second recess is positioned around the second adapter.
16. The assembly of claim 15 , wherein:
the first adapter includes a first external contour and the first recess of the mount is formed with a shape matching the external contour of the first adapter; and
the second adapter includes a second external contour and the second recess of the mount is formed with a shape matching the second external contour of the second adapter.