Sputter tool
Sputter tools are described. In one embodiment, an apparatus to support a wafer includes a pallet having a depression to receive the wafer. The pallet includes an opening below the depression, and an edge in the depression is to support the wafer over the opening. A cover at least partially covers the opening. In one example, the cover may be a plate with one or more holes, and a pipe may be located below each of the holes in the cover. In one embodiment, a wafer-processing system includes a processing chamber and a pallet with a depression to receive a wafer. The pallet has an opening below the depression, and an edge in the depression supports the wafer over the opening. In one such embodiment, a cover at least partially covers the opening. According to one embodiment, an energy-absorbing material is disposed below the opening in the pallet.
1. An apparatus to support a wafer in a wafer-processing system, the apparatus comprising:
a cathode;
a pallet comprising:
a plurality of depressions to receive a corresponding plurality of wafers in a wafer processing region of the pallet,
wherein the pallet further comprises a corresponding opening below each of the plurality of depressions, and
wherein an edge in each of the depressions is to support the corresponding wafer over the corresponding opening; and
a plurality of covers to at least partially cover each of the corresponding openings, the plurality of covers separated from the cathode, wherein the cathode is above the wafer processing region of the pallet, and the wafer processing region of the pallet is above the plurality of covers, each of the plurality of covers is located between vertically opposing beveled edges, and wherein the cathode comprises targets of material for sputtering into the wafer processing region.
2. The apparatus of claim 1 , wherein each of the plurality of covers is disposed in the corresponding depression over the corresponding opening and below the corresponding wafer.
3. The apparatus of claim 2 , wherein each of the plurality covers comprises a plate with one or more holes.
4. The apparatus of claim 3 , further comprising:
a pipe below each of the one or more holes in each of the plurality covers.
5. The apparatus of claim 1 , wherein each of the plurality covers comprises a metal plate.
6. The apparatus of claim 1 , wherein each of the plurality covers is supported on the edge in the corresponding depression in a plane below the corresponding wafer.
7. The apparatus of claim 1 , wherein:
the edge in each of the plurality of depressions comprises a lip with a downward slanted top surface sized to support the corresponding wafer.
8. The apparatus of claim 7 , wherein each of the plurality of covers is coupled to the lip in a position lower than the corresponding wafer to form a gap between the corresponding cover and the corresponding wafer.
9. The apparatus of claim 1 , further comprising one or more walls along outer edges of the pallet, wherein the one or more walls extend above a top surface of the pallet.
10. The apparatus of claim 1 , further comprising a stand in each of the plurality of depressions to support the corresponding wafer in the corresponding depression, wherein the stand has a height to form a gap between a bottom of the corresponding depression and the corresponding wafer.
11. The apparatus of claim 1 , further comprising metal fingers in each of the plurality of depressions to ground the corresponding wafer.
12. The apparatus of claim 1 , further comprising a heating element to heat the pallet.
13. The apparatus of claim 1 , wherein each of the corresponding openings comprises a hole through an entire thickness of the pallet, and wherein the hole is sized to receive a pedestal to load and unload the corresponding wafer.
14. The apparatus of claim 1 , wherein the cathode is positioned on a side of the supported wafers opposite a side facing the plurality of covers.
15. A wafer-processing system comprising:
a processing chamber;
a cathode;
a pallet comprising:
a plurality of depressions to receive a corresponding plurality of wafers in a wafer processing region of the pallet,
wherein the pallet further comprises a corresponding opening below each of the plurality of depressions, and
wherein an edge in each of the depressions is to support the corresponding wafer over the corresponding opening; and
a plurality of covers to at least partially cover each of the corresponding openings, the plurality of covers separated from the cathode, wherein the cathode is above the wafer processing region of the pallet, and the wafer processing region of the pallet is above the plurality of covers, each of the plurality of covers is located between vertically opposing beveled edges, and wherein the cathode comprises targets of material for sputtering into the wafer processing region.
16. The wafer-processing system of claim 15 , wherein the wafer-processing system is a sputter deposition system, and wherein the system further comprises:
one or more targets above the pallet; and
a carrier to carry the pallet through the system.
17. The wafer-processing system of claim 15 , wherein each of the plurality of covers is disposed in the corresponding depression over the corresponding opening and below the corresponding wafer.
18. The wafer-processing system of claim 15 , wherein each of the plurality of covers comprises a plate with one or more holes.
19. The wafer-processing system of claim 15 , wherein the cathode is positioned on a side of the supported wafers opposite a side facing the plurality of covers.