Solar cells with improved lifetime, passivation and/or efficiency
View Patent ↗A method of fabricating a solar cell can include forming a dielectric region on a silicon substrate. The method can also include forming an emitter region over the dielectric region and forming a dopant region on a surface of the silicon substrate. In an embodiment, the method can include heating the silicon substrate at a temperature above 900 degrees Celsius to getter impurities to the emitter region and drive dopants from the dopant region to a portion of the silicon substrate.
1. A solar cell, the solar cell, having a front side which faces the sun during normal operation and a back side opposite the front side, the solar cell comprising:
a dielectric region over a silicon substrate, wherein a portion of the silicon substrate has a dopant concentration of approximately less than or equal to 20×10 18 cm −3 ;
a first emitter region having metal impurities formed over the dielectric region; and
a first metal contact formed over the first emitter region;
a second emitter region having metal impurities formed over the dielectric region, wherein the second emitter region is formed at least partially over the first emitter region, and wherein the first and second emitter regions are formed on a same side of the solar cell: and
a second metal contact formed over the second emitter region.
2. The solar cell of claim 1 , wherein the first emitter region and the first metal contact are formed on the hack side of the solar cell.
3. The solar cell of claim 1 , wherein the first emitter region and the first metal contact are formed on the front side of the solar cell.
4. The solar cell of claim 1 , wherein the portion of the silicon substrate having a dopant concentration of approximately less than or equal to 20×10 18 cm −3 is on the front side of the solar cell.
5. The solar cell of claim 1 , wherein the first emitter region, is a doped polysilicon region.