Method for back-drilling a through-hole onto a printed circuit board (PCB)
View Patent ↗An approach for through-hole component soldering for a PCB, and a resulting PCB assembly, that eliminates protruding solder joints, is provided. The approach comprises back-drilling, from a bottom surface of a PCB, one or more through-holes, wherein each back-drilled through-hole is back-drilled to a depth partially through the PCB and at a diameter that is larger than the diameter of the through hole. Solder paste is applied to the PCB. The components are placed on the PCB, inserting each pin into a corresponding through-hole. The PCB is passed through a solder process, whereby, within each through-hole having a component pin inserted therein, the solder paste is wicked into the through-hole, and forms a solder joint with the respective pin. Each solder joint of a back-drilled through-hole is situated within the through-hole in a manner whereby the solder joint does not protrude beyond the bottom surface of the PCB.
1. A method comprising:
back-drilling, from a bottom surface of a printed circuit board (PCB), one or more component through-holes in the PCB, thereby creating one or more back-drilled through-holes with each of the one or more back-drilled through-holes having a through-hole portion and a back-drilled portion, wherein:
each back-drilled through-hole is back-drilled to a depth partially through the PCB at a second diameter that is larger than a first diameter of the through-hole;
applying solder paste to at least one side of the PCB, wherein the solder paste is applied at least to the bottom surface of the PCB, whereby the solder paste is forced into at least the back-drilled portion of each back-drilled through-hole;
placing one or more components on a top surface of the PCB, inserting each pin of each component into a corresponding through-hole; and
passing the PCB through a solder process, whereby, within each through-hole of the PCB having a component pin inserted therein, the solder paste is wicked into the through-hole, and forms a solder joint with the respective pin;
wherein, for each of the one or more back-drilled through-holes, the solder joint partially fills the back-drilled portion of the back-drilled through hole and
the solder joint does not protrude beyond the bottom surface of the PCB.
2. The method according to claim 1 , wherein each back-drilled through-hole is back-drilled to a depth of approximately 20% of an overall depth of the through-hole.
3. The method according to claim 1 , wherein each back-drilled through-hole is back-drilled at the second diameter that is approximately 200% of the first diameter of the through hole.
4. The method according to claim 1 , wherein the through-holes of the PCB are plated one of before or after performing the back-drilling step.
5. A method comprising:
back-drilling, from a bottom surface of a printed circuit board (PCB), one or more component through-holes in the PCB, wherein:
each back-drilled through-hole is back-drilled to a depth partially through the PCB at a second diameter that is larger than a first diameter of the through hole;
applying solder paste to at least to the bottom surface of the PCB, whereby the solder paste is forced into at least a back-drilled portion of each back-drilled through-hole;
placing one or more components on a top surface of the PCB, inserting each pin of each component into a corresponding through-hole; and
passing the PCB through a solder process, whereby, within each through-hole of the PCB having a component pin inserted therein, the solder paste is wicked into the through-hole, and forms a solder joint with the respective pin;
wherein, for each of the one or more back-drilled through-holes, the solder joint partially fills the back-drilled portion of the back-drilled through hole and
the solder joint does not protrude beyond the bottom surface of the PCB.
6. A method comprising:
producing a printed circuit board (PCB);
drilling through-holes through the PCB for mounting pin-in-hole (PIH) components onto the PCB, wherein the through-holes are of a first diameter;
plating the through-holes of the PCB;
back-drilling, from a bottom surface of the PCB, one or more of the through-holes in the PCB, thereby creating one or more back-drilled through-holes with each of the one or more back-drilled through-holes having a through-hole portion and a back-drilled portion, wherein:
each back-drilled through-hole is back-drilled to a depth partially through the PCB at a second diameter that is larger than the first diameter;
applying solder paste to at least one side of the PCB, wherein the solder paste is applied at least to the bottom surface of the PCB, whereby the solder paste is forced into at least the back-drilled portion of each back-drilled through-hole;
placing one or more PIH components on a top surface of the PCB and inserting each pin of each component into a corresponding through-hole; and
passing the PCB through a solder process, whereby, within each through-hole of the PCB having a component pin inserted therein, the solder paste is wicked into the through-hole, and forms a solder joint with the respective pin;
wherein, for each of the one or more back-drilled through-holes, the solder joint partially fills the back-drilled portion of the back-drilled through hole and the solder joint does not protrude beyond the bottom surface of the PCB.
7. The method according to claim 6 , wherein each back-drilled through-hole is back-drilled to a depth of approximately 20% of an overall depth of the through-hole.
8. The method according to claim 6 , wherein the second diameter of the back-drilled portion of each back-drilled through-hole is approximately 200% of the first diameter of the through-hole.
9. The method according to claim 6 , wherein the plating step is performed before the back-drilling step.