IP Library Granted Patent US 9,166,129
Granted Patent B2
US 9,166,129 · App. 14/584,009 · Granted Oct 20, 2015

Batwing LED with remote phosphor configuration

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Quick Facts
Patent No.
US 9,166,129
App. No.
14/584,009
Granted
Oct 20, 2015
Kind
B2
Abstract

A lens is formed over one or more light-emitting devices disposed over a substrate. The lens includes a trench that circumferentially surrounds the one or more light-emitting devices. The trench is filled with a phosphor-containing material.

Claims (32)

1. A method, comprising:

forming a lens over one or more light-emitting devices disposed over a substrate, wherein the lens includes a trench that circumferentially surrounds the one or more light-emitting devices; and

filling the trench with a phosphor-containing material.

2. The method of claim 1 , further comprising: forming a reflective component over the lens.

3. The method of claim 2 , wherein the reflective component comprises metal particles in a gel.

4. The method of claim 2 , the lens further comprising an upper surface which is formed to have a concave portion, and wherein the reflective component is formed over the concave portion.

5. The method of claim 1 , wherein the forming of the lens comprises:

dispensing a lens precursor material over the one or more light-emitting devices and over the substrate; and

pressing a lens mold against the lens precursor material, wherein the lens mold contains a trench that defines the trench of the lens.

6. The method of claim 5 , wherein the forming of the lens further comprises curing the lens precursor material.

7. The method of claim 5 , wherein the lens mold includes one or more openings.

8. The method of claim 5 , wherein the pressing of the lens mold is performed in a vacuum environment.

9. The method of claim 1 , wherein the filling of the trench is performed such that the phosphor-containing material further contains a glue.

10. The method of claim 1 , wherein the phosphor-containing material is a viscous liquid, and wherein the filling of the trench comprises: flowing the viscous liquid into the trench by vibration.

11. The method of claim 1 , wherein the filling of the trench comprises submerging the lens along with the substrate into a liquid medium containing the phosphor-containing material.

12. A method, comprising:

forming a lens over one or more light-emitting diodes (LEDs) disposed over a packaging substrate by using an injection molding process, wherein the lens includes a first trench that encircles the one or more LEDs in a top view; and

filling the first trench with a mixture that contains a phosphor and a glue.

13. The method of claim 12 , wherein the forming is formed such that the lens has a concave upper recess, and wherein the method further comprises forming a reflective material over the concave upper recess.

14. The method of claim 12 , wherein the forming of the lens comprises:

dispensing a lens precursor material over the one or more LEDs and over the package substrate;

pressing a lens mold against the lens precursor material, wherein the lens mold contains a second trench that corresponds with the first trench of the lens; and

thereafter curing the lens precursor material.

15. The method of claim 14 , wherein the lens mold includes one or more openings in addition to the second trench.

16. The method of claim 14 , wherein the pressing of the lens mold is performed in vacuum.

17. A method, comprising:

dispensing a lens precursor material over one or more light-emitting devices disposed over a substrate;

forming a trench in the lens precursor material by a mold, the trench being formed to circumferentially surround the one or more light-emitting devices; and

filling the trench with a phosphor-containing material.

18. The method of claim 17 , further comprising curing the lens precursor material.

19. The method of claim 17 , further comprising: forming a reflector over a portion of an upper surface of the lens precursor material.

20. The method of claim 17 , wherein the forming of the trench is performed in a vacuum environment.

Assignments (4)
CHANGE OF NAME Recorded Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →
CHANGE OF NAME Recorded Nov 24, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037158/0101 →
MERGER Recorded Nov 24, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037158/0154 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2014
From: CHEN, CHING-YI; TANG, YU-SHENG; YANG, HAO-YU; CHEN, HSIN-HUNG; SHIH, TZU-WEN
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 034592/0137 →