IP Library Granted Patent US 9,407,015
Granted Patent B1
US 9,407,015 · App. 14/585,111 · Granted Aug 2, 2016

Automatic power disconnect device

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Quick Facts
Patent No.
US 9,407,015
App. No.
14/585,111
Granted
Aug 2, 2016
Kind
B1
Abstract

Systems and methods are disclosed for automatically disconnecting a power source in an electronic device. A data storage device is disclosed comprising a printed circuit board (PCB) and an electrical connector secured to the PCB, the electrical connector including a power pin having a power input contact portion configured to receive power from a communication interface connector, a substantially straight portion connected between the power input contact portion and a bend in the power pin, and an output arm connected between the bend at a first end and a power output contact portion at a second end, the power output contact portion being configured to be electrically coupled to the PCB via an electrical connection medium. The bend causes the output arm to lift away from the PCB when a bond between the power output contact portion and the electrical connection medium is broken.

Claims (19)

1. A data storage device comprising:

a printed circuit board (PCB);

an electrical connector at least partially secured to the PCB, the electrical connector comprising:

a housing; and

a power pin disposed at least partially within the housing, the power pin comprising:

a power input contact portion configured to receive power from a communication interface connector;

a substantially straight portion lying in a plane substantially parallel to a top surface of the PCB, the straight portion being connected between the power input contact portion and a bend in the power pin; and

an output arm connected between the bend at a first end and an at least partially curved power output contact portion at a second end, the power output contact portion being configured to be electrically coupled to the PCB via an electrical connection medium; and

an integrated circuit (IC) chip mounted on the PCB;

wherein the data storage device is configured to transmit power received through the power pin to the IC chip via the electrical connection medium and one or more conductive traces of the PCB; and

wherein the bend causes the output arm to lift away from the PCB when a bond between the power output contact portion and the electrical connection medium is broken.

2. The data storage device of claim 1 , wherein when the output arm lifts away from the PCB, the data storage device is further configured to cease transmitting power to the IC chip through the power pin.

3. The data storage device of claim 1 , wherein the output arm is substantially straight in a portion connected between the bend and the power output contact portion.

4. The data storage device of claim 1 , wherein the power output contact portion is substantially hook-shaped.

5. The data storage device of claim 1 , wherein the output arm is curved away from the surface of the PCB.

6. The data storage device of claim 1 , wherein the power pin includes one or more additional bends configured to cause the bond between the power output contact portion and the electrical connection medium to be broken when the electrical connection medium becomes at least partially melted.

7. The data storage device of claim 1 , wherein the electrical connection medium comprises solder, wherein electrical current in the power pin that is greater than a threshold level causes the connection medium to at least partially melt.

8. The data storage device of claim 7 , wherein the electrical connection medium comprises low-fusion solder having a melting point below approximately 180° C.

9. The data storage device of claim 1 , wherein the output arm is shaped to produce potential energy in a direction substantially away from the PCB when the output arm is pressed in a direction towards the top surface of the PCB, such that when the connection medium melts, the output arm has a tendency to lift away from the PCB, thereby breaking an electrical connection with the PCB.

Assignments (8)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 038744 FRAME 0481 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058982/0556 →
RELEASE OF SECURITY INTEREST Recorded Mar 5, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 045501/0714 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038744/0481 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038744/0281 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038722/0229 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2015
From: RICE, ALAN P.; PRATAMA, ANDRE; WILSON, JEFFREY ALAN; FELFELI, FIROUZ
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 036804/0513 →