SHINGLED SOLAR CELL MODULE
A high efficiency configuration for a solar cell module comprises solar cells arranged in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency.
1 . A method comprising:
scribing a first scribe line on a wafer; and
separating the wafer along the first scribe line utilizing a vacuum to provide a solar cell strip.
2 . A method as in claim 1 wherein the scribing comprises laser scribing.
3 . A method as in claim 2 wherein the separating comprises applying the vacuum between a surface of the wafer and a curved surface.
4 . A method as in claim 3 wherein the curved surface comprises a vacuum manifold.
5 . A method as in claim 4 wherein the wafer is supported on a belt moving to the vacuum manifold, and the vacuum is applied through the belt.
6 . A method as in claim 5 wherein the separating comprises:
orienting the first scribe line at an angle relative to the vacuum manifold; and
beginning a cleaving at one end of the first scribe line.
7 . A method as in claim 6 wherein the angle is substantially perpendicular.
8 . A method as in claim 6 wherein the angle is other than substantially perpendicular.
9 . A method as in claim 3 further comprising applying an uncured electrically conductive adhesive bonding material.
10 . A method as in claim 9 wherein the first scribe line and the uncured electrically conductive adhesive bonding material are on a same surface of the wafer.
11 . A method as in claim 10 wherein the laser scribing avoids curing the uncured conductive adhesive bonding material by selecting a laser power and/or a distance between the first scribe line and the uncured conductive adhesive bonding material.
12 . A method as in claim 10 wherein the same surface is opposite a wafer surface supported by a belt moving the wafer to the curved surface.
13 . A method as in claim 12 wherein the curved surface comprises a vacuum manifold.
14 . A method as in claim 9 wherein the applying occurs after the scribing.
15 . A method as in claim 9 wherein the applying occurs after the separating.
16 . A method as in claim 9 wherein the applying comprises screen printing.
17 . A method as in claim 9 wherein the applying comprises ink jet printing.
18 . A method as in claim 9 wherein the applying comprises depositing using a mask.
19 . A method as in claim 3 wherein the first scribe line is between,
a first metallization pattern on a surface of the wafer along a first outside edge, and
a second metallization pattern on the surface of the wafer along a second outside edge.
20 . A method as in claim 19 wherein the wafer further comprises a third metallization pattern on the surface of the semiconductor wafer not proximate to the first outside edge or to the second outside edge, and the method further comprises:
scribing a second scribe line between the third metallization pattern and the second metallization pattern, such that the first scribe line is between the first metallization pattern and the third metallization pattern; and
separating the wafer along the second scribe line to provide another solar cell strip.
21 . A method as in claim 20 wherein a distance between the first scribe line and the second scribe line forms a width defining an aspect ratio of between about 1:2 and about 1:20 with a length of the wafer comprising about 125 mm or about 156 mm.
22 . A method as in claim 19 wherein the first metallization pattern comprises a finger pointing toward the second metallization pattern.
23 . A method as in claim 22 wherein the first metallization pattern further comprises a bus bar intersecting the finger.
24 . A method as in claim 23 wherein the bus bar is within 5 mm of the first outside edge.
25 . A method as in claim 22 further comprising uncured electrically conductive adhesive bonding material in contact with the finger.
26 . A method as in claim 19 wherein the first metallization pattern comprises a discrete contact pad.
27 . A method as in claim 19 further comprising printing or electroplating the first metallization pattern on the wafer.
28 . A method as in claim 3 further comprising:
arranging the solar cell strip in a first super cell comprising at least nineteen solar cell strips each having a breakdown voltage of at least 10V, with long sides of adjacent solar cell strips overlapping the electrically conductive adhesive bonding material disposed in between; and
curing the electrically conductive bonding material to bond adjacent overlapping solar cell strips electrically connected in series.
29 . A method as in claim 28 wherein the arranging comprises forming a layered structure including an encapsulant, the method further comprising laminating the layered structure.
30 . A method as in claim 29 wherein the curing occurs at least partially during the laminating
31 . A method as in claim 29 wherein the curing occurs distinct from the laminating.
32 . A method as in claim 29 wherein the encapsulant comprises a thermoplastic olefin polymer.
33 . A method as in claim 29 wherein the layered structure comprises:
a white backing sheet; and
darkened stripes on the white backing sheet.
34 . A method as in claim 28 wherein the arranging comprises confining a spreading of the electrically conductive adhesive bonding material using a metallization pattern feature.
35 . A method as in claim 34 wherein metallization pattern feature is on a front surface of the solar cell strip.
36 . A method as in claim 34 wherein metallization pattern feature is on a back surface of the solar cell strip.
37 . A method as in claim 28 further comprising applying the electrically conductive adhesive bonding material between the first super cell and an interconnect connecting a second super cell in series.
38 . A method as in claim 28 further comprising forming a ribbon conductor between a single bypass diode of the first super cell, the single bypass diode located in a first junction box of a first solar module in mating arrangement with a second junction box of a second solar module.
39 . A method as in claim 28 wherein:
the solar cell strip includes a first chamfered corner;
a long side of an overlapping solar cell strip of the plurality of solar cell strips, does not include a second chamfered corner; and
a width of the solar cell strip is greater than a width of the overlapping solar cell strip, such that the solar cell strip and the overlapping solar cell strip have approximately a same area.
40 . A method as in claim 28 wherein:
the solar cell strip includes a first chamfered corner;
a long side of an overlapping solar cell strip of the plurality of solar cell strips, includes a second chamfered corner; and
the long side of the overlapping solar cell strip of the plurality of solar cell strips, overlaps a long side of the solar cell strip not including the first chamfered corner.