IP Library Granted Patent US 10,240,989
Granted Patent B2
US 10,240,989 · App. 14/586,017 · Granted Mar 26, 2019

Magnetoelastic sensor using strain-induced magnetic anisotropy to measure the tension or compression present in a plate

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Quick Facts
Patent No.
US 10,240,989
App. No.
14/586,017
Granted
Mar 26, 2019
Kind
B2
Abstract

A magnetoelastic sensor. The magnetoelastic sensor uses strain-induced magnetic anisotropy to measure the tension or compression present in a plate. During construction, an annular region of the plate is magnetized with a circumferential magnetization. Magnetic field sensors are placed near this magnetized band at locations where the magnetization direction is non-parallel and non-perpendicular to the axis of tension. The strain-induced magnetic anisotropy caused by tension or compression then produces a shift in the magnetization direction in the plate regions near the field sensors, thereby causing magnetic field changes which are detected by the magnetic field sensors. The magnetic field sensors are connected to an electronic circuit which outputs a voltage signal which indicates the tension or compression in the plate.

Claims (30)

1. A tension sensor for sensing a tension force comprising:

a plate comprising a magnetoelastic region;

at least one pair of sensors disposed on a same side of the plate above the magnetoelastic region, the at least one pair of sensors configured to sense a magnetic field produced by the magnetoelastic region due to a strain in the plate imposed by the tension force applied to the plate; and

at least one pair of sensor platforms on which each of the at least one pair of sensors are respectively disposed, wherein the at least one pair of sensors are disposed between the respective at least one pair of sensor platforms and the magnetoelastic region.

2. The tension sensor of claim 1 , wherein the magnetoelastic region is symmetrical about a centerpoint of the magnetoelastic region.

3. The tension sensor of claim 1 , where the at least one pair of sensors are symmetrically disposed above the magnetoelastic region about a centerpoint of the magnetoelastic region.

4. The tension sensor of claim 1 , further comprising a second pair of sensors respectively disposed on the at least one pair of sensor platforms on a side of the respective at least one pair of sensor platforms opposite the respective at least one pair of sensors.

5. The tension sensor of claim 4 , wherein the second pair of sensors are radially inset relative to the at least one pair of sensors.

6. The tension sensor of claim 1 , wherein the magnetoelastic region is annular.

7. The tension sensor of claim 6 , wherein each of the at least one pair of sensors is bisected laterally by the magnetoelastic region.

8. The tension sensor of claim 7 , wherein each of the at least one pair of sensors are disposed above the magnetoelastic region in a direction perpendicular to the magnetic field produced by magnetoelastic region and neither parallel nor perpendicular to a direction of the tension.

9. A compression sensor for sensing a compression force comprising:

a plate comprising a magnetoelastic region;

at least one pair of sensors disposed on a same side of the plate above the magnetoelastic region, the at least one pair of sensors configured to sense a magnetic field produced by the magnetoelastic region due to a strain in the plate imposed by the compression force applied to the plate; and

at least one pair of sensor platforms on which each of the at least one pair of sensors are respectively disposed, wherein the at least one pair of sensors are disposed between the respective at least one pair of sensor platforms and the magnetoelastic region.

10. The compression sensor of claim 9 , wherein the magnetoelastic region is symmetrical about a centerpoint of the magnetoelastic region.

11. The compression sensor of claim 9 , where the at least one pair of sensors are symmetrically disposed above the magnetoelastic region about a centerpoint of the magnetoelastic region.

12. The compression sensor of claim 9 , further comprising a second pair of sensors respectively disposed on the at least one pair of sensor platforms on a side of the respective at least one pair of sensor platforms opposite the respective at least one pair of sensors.

13. The compression sensor of claim 12 , wherein the second pair of sensors are radially inset relative to the at least one pair of sensors.

14. The compression sensor of claim 9 , wherein the magnetoelastic region is annular.

15. The compression sensor of claim 14 , wherein each of the at least one pair of sensors is bisected laterally by the magnetoelastic region.

16. The compression sensor of claim 15 , wherein each of the at least one pair of sensors are disposed above the magnetoelastic region in a direction perpendicular to the magnetic field produced by magnetoelastic region and neither parallel nor perpendicular to a direction of the compression.

17. A method of manufacturing a magnetoelastic sensor for sensing a tension or a compression force comprising:

forming a plate from an austenetic non-magnetic stainless steel alloy;

cold-working an area of the plate to convert the austenetic non-magnetic stainless steel alloy in the area of the plate to martensite;

rotating the plate;

bringing a magnet near a surface of the plate and near the area of the plate converted to martensite to magnetize the area; and

mounting at least one pair of magnetic field sensors on a same side of the plate above the surface of the plate near the magnetized area to sense a magnetic field produced by the magnetized area due to a strain in the plate imposed by a tension or a compression force applied to the plate; and

mounting at least one pair of sensor platforms on which each of the at least one pair of sensors are respectively disposed, wherein the at least one pair of sensors are disposed between the respective at least one pair of sensor platforms and the magnetoelastic region.

18. The method of claim 17 , wherein the step of mounting comprises disposing the at least one pair of magnetic field sensors symmetrically above the surface of the plate near the magnetized area.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 13, 2024
From: MORAN, TIMOTHY J.; URSETTA, FRANK
To: METHODE ELECTRONICS, INC.
Reel/Frame 069577/0610 →
SECURITY INTEREST Recorded Jul 11, 2024
From: METHODE ELECTRONICS, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 068275/0875 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 8, 2015
From: MORAN, TIMOTHY J.; URSETTA, FRANK
To: METHOD ELECTRONICS, INC.
Reel/Frame 035362/0843 →