IP Library Granted Patent US 9,318,872
Granted Patent B2
US 9,318,872 · App. 14/589,392 · Granted Apr 19, 2016

VCSEL with integrated electrically modulated intra-cavity graphene absorber

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Quick Facts
Patent No.
US 9,318,872
App. No.
14/589,392
Granted
Apr 19, 2016
Kind
B2
Abstract

A VCSEL can include a graphene intra-cavity absorber having at least one graphene region and at least one dielectric region adjacent to the graphene region. The VCSEL can also include a graphene electrode electronically coupled with at least one graphene region. The VCSEL can also include a contact region adjacent with at least one dielectric region. The VCSEL can also include a contact electrode electronically coupled with the contact region. The VCSEL can also include a base electrode electronically coupled with a base of a semiconductor region of the VCSEL. The graphene intra-cavity absorber can include at least two graphene regions sandwiching at least one dielectric region therebetween.

Claims (63)

1. A VCSEL comprising:

a bottom electrode;

a bottom mirror stack electrically coupled to and over the bottom electrode;

an active region having a lasing region over the bottom mirror stack;

a top mirror stack over the active region;

an oxide aperture over the active region;

a contact region over the top mirror stack;

a contact electrode electrically coupled with the contact region;

a graphene intra-cavity absorber having at least one graphene region and at least one dielectric region adjacent to the graphene region and between the graphene region and lasing region such that the dielectric region isolates the graphene region from the lasing region, the graphene intra-cavity absorber including a bottom graphene region over the contact region, a dielectric region over the contact region, and a top graphene region over the dielectric region;

a graphene electrode electronically coupled with the top graphene region; and

a dielectric mirror over the graphene region.

2. The VCSEL of claim 1 , wherein the graphene electrode provides modulation voltage to modulate absorption of the graphene intra-cavity absorber.

3. The VCSEL of claim 1 , comprising the contact region being adjacent with and in contact with at least one dielectric region.

4. The VCSEL of claim 3 , wherein the contact electrode provides an E-field to the graphene intra-cavity absorber.

5. The VCSEL of claim 1 , comprising:

at least two graphene regions sandwiching at least one dielectric region therebetween, the at least two graphene regions including the bottom graphene region and top graphene region;

a first graphene electrode electronically coupled with a first graphene region; and

a second graphene electrode electronically coupled with a second graphene region.

6. The VCSEL of claim 1 , wherein the graphene intra-cavity absorber is in a top mirror.

7. The VCSEL of claim 5 , wherein the graphene intra-cavity absorber is over a contact region with an insulating region therebetween.

8. The VCSEL of claim 1 , comprising:

the bottom mirror stack is a bottom semiconductor mirror stack electrically coupled to and over the bottom electrode;

the top mirror stack is a top semiconductor mirror stack over the active region;

the contact electrode being an annular contact electrode electrically coupled with the contact region;

an electrically insulating region over the contact region;

the bottom graphene region over the contact region with the electrically insulating region therebetween;

a bottom graphene electrode electronically coupled with the bottom graphene region;

the dielectric region over the contact region is within an aperture of the annular contact electrode.

9. A method of emitting modulated light, the method comprising, providing the VCSEL of claim 1 ;

operating the VCSEL so as to produce light; and

operating the graphene intra-cavity absorber so as to modulate the light.

10. The method of claim 9 , the operating of the graphene intra-cavity absorber including changing light absorption characteristics thereof with electrical current.

11. The method of claim 10 , comprising providing sufficient electrical current to allow light to pass through the graphene intra-cavity absorber and be emitted from the VCSEL.

12. The VCSEL of claim 1 , the lasing region being configured so that the VCSEL emits a laser having a wavelength of 850 nm to 1.5 microns.

13. The method of claim 9 , the lasing region being configured so that the VCSEL emits a laser having a wavelength of 850 nm to 1.5 microns.

14. A method of manufacturing a VCSEL, the method comprising

forming a VCSEL semiconductor region having a lasing region, and a contact region over the lasing region;

forming a dielectric region over the contact region;

forming a graphene region over the dielectric region such that the dielectric region isolates the graphene region from the lasing region;

forming a graphene electrode so as to be electrically coupled with the graphene region;

forming at least one AlAs region and at least one GaAs region between the graphene region and the VCSEL semiconductor region; and

oxidizing at least one of the AlAs regions to be an insulating aluminum oxide region.

15. The method of claim 14 , comprising forming a dielectric mirror stack over the graphene region.

16. The method of claim 14 , comprising:

forming a bottom graphene region under the dielectric region; and

forming a bottom graphene electrode to be electronically coupled with the bottom graphene region.

17. The method of claim 14 , comprising:

forming a silicon dioxide region under the bottom graphene region; and

forming a conductive oxide region under the silicon dioxide region.

18. The method of claim 17 , comprising forming an electrode to be in electrical contact with the silicon dioxide region and lower conductive oxide region.

19. The method of claim 14 , comprising configuring the lasing region so that the VCSEL emits a laser having a wavelength of 850 nm to 1.5 microns.

20. A VCSEL comprising:

a bottom electrode;

a bottom semiconductor mirror stack electrically coupled to and over the bottom electrode;

an active region having a lasing region over the bottom semiconductor mirror stack;

a top semiconductor mirror stack over the active region;

an oxide aperture over the active region;

a contact region over the top semiconductor mirror stack;

an annular contact electrode electrically coupled with the contact region;

an electrically insulating region over the contact region;

a graphene intra-cavity absorber having at least one graphene region and at least one dielectric region adjacent to the graphene region and between the graphene region and lasing region such that the dielectric region isolates the graphene region from the lasing region, the graphene intra-cavity absorber including a bottom graphene region over the contact region with the electrically insulating region therebetween, a bottom graphene electrode electronically coupled with the bottom graphene region; a dielectric region over the contact region and within an aperture of the annular contact electrode, and a top graphene region over the dielectric region;

a top graphene electrode electronically coupled with the top graphene region; and

a dielectric mirror over the graphene region.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2015
From: GRAHAM, LUKE A.; JOHNSON, RALPH H.; GUENTER, JAMES K.
To: FINISAR CORPORATION
Reel/Frame 034635/0718 →