IP Library › Granted Patent US 10,022,909
Granted Patent B2
US 10,022,909 · App. 14/592,066 · Granted Jul 17, 2018

Systems and methods for manufacturing structural materials

Inventors: Nicholas D. Abbatiello (Round Rock, TX); Chuan Beng Sim (Shanghai, CN); Xin Hua Tian (Shanghai, CN)
Assignee: Dell Products L.P.
B29C65/70B29C43/18B29C43/184B29C37/0025B29C2037/0042B29K2101/10B29L2009/00B29L2031/3481
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Quick Facts
Patent No.
US 10,022,909
App. No.
14/592,066
Filed
Jan 8, 2015
Granted
Jul 17, 2018
Kind
B2
Examiner
WU, VICKI H
Art Unit
1745
USPC
156/244.23
Abstract

In accordance with embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and compression molding an in-mold decoration film to a side of the sheet of structural material. In accordance with these and other embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and adhesively bonding a chassis attachment frame to the sheet of structural material, the chassis attachment frame having one or more attachment features for mechanically coupling the structural member to other one or more other components. In accordance with these and other embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and molding a chassis attachment frame comprising sheet molding compound to the structural material.

Claims (21)

1. A method for forming a structural member, comprising:

providing:

a sheet of structural material between a top mold and a bottom mold, wherein a substantially rectangular perimeter of the sheet of structural material includes:

a first edge, comprising a first side of the substantially rectangular boundary; and

a second edge, comprising a second side of the substantially rectangular boundary, wherein the second side is substantially perpendicular to the first side;

a top release film between the top mold and the sheet of structural material;

a bottom release film between the bottom mold and the sheet of structural material; and

an in-mold decoration film between the bottom release film and a bottom surface of the sheet of structural material; and

compression molding the in-mold decoration film to the bottom surface of the sheet of structural material, wherein the in-mold decoration film extends to the first edge and includes a decoration film edge substantially parallel to the second edge of the sheet of structural material, wherein the decoration film edge defines a border of un-decorated structural material between the decoration film edge and the second edge.

2. The method of claim 1 , further comprising molding a chassis attachment frame comprising sheet molding compound to the sheet of structural material.

3. The method of claim 2 , further comprising forming attachment features to the chassis attachment frame after molding of the chassis attachment frame to the sheet of structural material.

4. The method of claim 3 , wherein forming the attachment features comprises forming the attachment features using computer numerical control.

5. The method of claim 1 , wherein the sheet of structural material comprises a fiber-reinforced polymer.

6. The method of claim 1 , wherein the sheet of structural material comprises a thermoset polymer.

7. The method of claim 1 , wherein the sheet of structural material comprises a layered composite structural material.

8. The method of claim 1 , wherein an upper side of the in-mold decoration film comprises an adhesive for bonding to the lower surface of the sheet of structural material.

9. The method of claim 1 , wherein the sheet of structural material includes a rounded second sidewall defining a convex curve terminating at the second edge.

10. The method of claim 9 , wherein the sheet of structural material includes a rounded first sidewall, substantially perpendicular to the rounded second sidewall, wherein the rounded first sidewall defines a convex curve terminating at the first edge.

11. The method of claim 9 , wherein the rounded second sidewall lies entirely within the border of un-decorated structural material between the decoration film edge and the second edge.

12. The method of claim 11 , wherein the sheet of structural material includes a rounded first sidewall, substantially perpendicular to the rounded second sidewall, wherein the rounded first sidewall defines a convex curve terminating at the first edge.

13. The method of claim 1 , wherein the sheet of structural material includes a rounded first sidewall defining a convex curve terminating at the first edge.

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
RELEASE OF REEL 035104 FRAME 0043 (NOTE) Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; COMPELLENT TECHNOLOGIES, INC.
Reel/Frame 040027/0123 →
RELEASE OF REEL 035103 FRAME 0809 (TL) Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; COMPELLENT TECHNOLOGIES, INC.
Reel/Frame 040027/0934 →
RELEASE OF REEL 035103 FRAME 0536 (ABL) Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; COMPELLENT TECHNOLOGIES, INC.
Reel/Frame 040016/0864 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (ABL) Recorded Feb 26, 2015
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; COMPELLENT TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035103/0536 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (NOTES) Recorded Feb 26, 2015
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; COMPELLENT TECHNOLOGIES, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035104/0043 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Feb 26, 2015
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; COMPELLENT TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 035103/0809 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 8, 2015
From: ABBATIELLO, NICHOLAS D.; SIM, CHUAN BENG; TIAN, XIN HUA
To: DELL PRODUCTS L.P.
Reel/Frame 034662/0814 →
Continuity (1)
Related Publication 20160200037A1 · Jul 14, 2016