IP Library › Patent Application 14592117
Patent Application
App. No. 14/592,117

Semiconductor Device Having Metal Lines with Slits

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Quick Facts
Patent No.
US None
App. No.
14/592,117
Abstract

A semiconductor device including a semiconductor substrate, an integrated circuit on the semiconductor substrate, an insulation layer covering the integrated circuit, and a plurality of metal line patterns on the insulation layer. First and second adjacent metal line patterns of the plurality of metal line patterns are spaced apart from each other by a space, and each of the first and second adjacent metal line patterns has at least one slit.

Claims (5)

1 . A semiconductor device, comprising:

a semiconductor substrate;

an integrated circuit on the semiconductor substrate;

an insulation layer covering the integrated circuit; and

a plurality of metal line patterns on the insulation layer, wherein first and second adjacent metal line patterns of the plurality of metal line patterns are spaced apart from each other by a space, and each of the first and second adjacent metal line patterns has at least one slit.