Light emitting device package
Embodiments include a light emitting device package. The light emitting device package comprises a housing including a cavity; a light emitting device positioned in the cavity; a lead frame including a first section electrically connected to the light emitting device in the cavity, a second section, which penetrates the housing, extending from the first section and a third section, which is exposed to outside air, extending from the second section; and a metal layer positioned on an area defined by a distance which is distant from the housing in the second section of the lead frame.
1. A light emitting device package comprising:
a housing including a cavity, an upper section, and a lower section disposed under the upper section and the cavity;
a lead frame including a first lead frame and a second lead frame spaced apart from the first lead frame in the cavity;
a first gap provided between a bottom surface of the upper section and at least one of a top surface of the first lead frame and a top surface of the second lead frame, a width of the first gap being less than a width of a bottom surface of the upper section; and
a light emitting device disposed on the lead frame and provided in the cavity,
wherein a portion of the first gap overlaps with a top surface of the lower section.
2. The light emitting device package according to claim 1 , wherein at least one of the first lead frame and the second lead frame includes a first section provided in the cavity, a second section extended from the first section and disposed between the upper section and the lower section, and a third section extended from the second section and protruding from a side surface of the housing.
3. The light emitting device package according to claim 1 , wherein the first lead frame includes a first portion exposed in the cavity,
wherein the second lead frame includes a second portion exposed in the cavity,
wherein a width of the second portion is greater than a width of the first portion, and
wherein the light emitting device is disposed on the second portion.
4. The light emitting device package according to claim 1 , wherein the lower section includes a first portion and a second portion, a height of the second portion being greater than a height of the first portion.
5. The light emitting device package according to claim 4 , wherein the first portion of the lower section is disposed under the cavity.
6. The light emitting device package according to claim 4 , wherein the first portion of the lower section is disposed under the light emitting device.
7. The light emitting device package according to claim 4 , wherein the first portion of the lower section is provided a to central region of the lower section.
8. The light emitting device package according to claim 1 , wherein a bottom surface of the lower section includes an inclined surface.
9. The light emitting device package according to claim 8 , wherein the inclined surface is disposed under the cavity.
10. The light emitting device package according to claim 8 , wherein an angle between the inclined surface and a lowermost surface of the lower section is an obtuse angle.
11. The light emitting device package according to claim 1 , wherein a first region and a second region of the lead frame have a different thickness.
12. The light emitting device package according to claim 1 , wherein the lead frame is bent to contact a side surface and a bottom surface of the lower section.
13. The light emitting device package according to claim 1 , further comprising a second gap provided between the lower section and at least one of the first lead frame and the second lead frame.
14. The light emitting device package according to claim 12 , wherein a length of a first part of the lead frame disposed on the top surface of the lower section is longer than a length of a second part of the lead frame disposed under a bottom surface of the lower section.
15. The light emitting device package according to claim 1 , wherein a surrounding surface forming the cavity of the housing includes an inclined surface with reference to the top surface of the lower section.
16. The light emitting device package according to claim 1 , wherein the lead frame includes a metal layer and a plating layer disposed on a surface of the metal layer, and
wherein the plating layer includes at least one of Ni layer, Au layer, or Ag layer.
17. The light emitting device package according to claim 1 , wherein the top surface of the lower section and the top surface of one of the first lead frame and the second lead frame are substantially flat.
18. A light emitting device package comprising:
a housing including a cavity, an upper section, and a lower section disposed under the upper section and the cavity;
a lead frame including a first section disposed under the cavity, a second section extended from the first section and disposed between the lower section and the upper section, and a third section extended from the second section and protruding from a side surface of the housing;
a first gap provided between a top surface of the second section of the lead frame and a bottom surface of the upper section of the housing; and
a light emitting device disposed on the first section of the lead frame,
wherein a width of the first gap is less than a width of a bottom surface of the upper section, and
wherein a portion of the first gap overlaps with a top surface of the lower section.
19. The light emitting device package according to claim 18 , wherein the width of the first gap is less than a length of the second section of the lead frame.
20. The light emitting device package according to claim 18 , wherein the lower section includes a first portion and a second portion thicker than the first portion.
21. The light emitting device package according to claim 20 , wherein the first portion of the lower section is disposed under the cavity.
22. The light emitting device package according to claim 20 , wherein the first portion of the lower section is provided around a central region of the lower section.
23. The light emitting device package according to claim 18 , wherein a bottom surface of the lower section includes an inclined surface.
24. The light emitting device package according to claim 23 , wherein the inclined surface is disposed under the cavity.
25. The light emitting device package according to claim 23 , wherein an angle between the inclined surface and a lowermost surface of the lower section is an obtuse angle.
26. The light emitting device package according to claim 18 , wherein a first region and a second region of the lead frame have a different thickness.
27. The light emitting device package according to claim 18 , wherein the lead frame is bent to contact a side surface and a bottom surface of the lower section of the housing.
28. The light emitting device package according to claim 18 , further comprising a second gap provided between the lower section and the lead frame.
29. The light emitting device package according to claim 27 , wherein a length of a first part of the lead frame disposed on the lower section is longer than a length of a second part of the lead frame disposed under a bottom surface of the lower section.
30. The light emitting device package according to claim 18 , wherein a surrounding surface forming the cavity of the housing includes a vertical surface or an inclined surface with reference to a top surface of the lower section.
31. The light emitting device package according to claim 18 , wherein the lead frame includes a metal layer and a plating layer disposed on a surface of the metal layer, and
wherein the plating layer includes at least one of Ni layer, Au layer, or Ag layer.
32. The light emitting device package according to claim 18 , wherein a top surface of the lower section and a top surface of the lead frame are substantially flat.
33. The light emitting device package according to claim 18 , wherein a bottom surface of the lower section includes a concave portion, the concave portion being disposed under the cavity.
34. The light emitting device package according to claim 1 , wherein a bottom surface of the lower section includes a concave portion, the concave portion being disposed under the cavity.
35. The light emitting device package according to claim 34 , wherein a height of the lower section at the concave portion is less than a height of the lower section under the upper section.
36. The light emitting device package according to claim 34 , wherein the height of the lower section is the least at the concave portion.
37. The light emitting device package according to claim 13 , wherein the second gap is provided below the first gap, the first gap and the second gap vertically overlapping each other.
38. The light emitting device package according to claim 1 , wherein a height of the first gap between the upper section and the first or second lead frame increases toward an outer side of the upper section.
39. The light emitting device package according to claim 1 , wherein the first gap extends to an outer edge of the upper section of the housing.