Electronic modules having grounded electromagnetic shields
View Patent ↗In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
1. An electronic module comprising:
a substrate comprising a component portion including a component area on a surface of the substrate and a plurality of metallic layers each extending along a periphery of the component portion below the surface of the substrate such that the plurality of metallic layers surround the component portion and are coupled to one another;
an electronic component on the component area;
an overmold formed over the component area; and
an electromagnetic shield formed over the overmold and covering the component area, the electromagnetic shield being coupled along the periphery of the component portion to at least a first metallic layer in the plurality of metallic layers.
2. The electronic module of claim 1 , further comprising a plurality of conductive vias that couple the plurality of metallic layers.
3. The electronic module of claim 1 , wherein the plurality of metallic layers further comprises:
wherein the first metallic layer is on the surface of the substrate and extends along a perimeter of the component area; and
a second metallic layer within the substrate that is positioned below the first metallic layer.
4. The electronic module of claim 3 , further comprising:
wherein the first metallic layer substantially surrounds the perimeter of the component area, and the second metallic layer substantially surrounds the periphery of the component portion; and
a first plurality of conductive vias positioned between the first and second metallic layers and substantially surrounding the periphery of the component portion.
5. The electronic module of claim 4 , further comprising:
the plurality of metallic layers further comprising a third metallic layer that extends along the periphery of the component portion and is below the first and second metallic layers; and
a second plurality of conductive vias positioned between the second and third metallic layers and substantially surrounding the periphery of the component portion.
6. The electronic module of claim 1 , wherein the plurality of metallic layers further comprise:
wherein the first metallic layer is below the component area; and
a second metallic layer within the substrate that is positioned below the first metallic layer.
7. The electronic module of claim 6 , further comprising:
wherein the first metallic layer substantially surrounds the periphery of the component portion;
wherein the second metallic layer substantially surrounds the periphery of the component portion; and
a first plurality of conductive vias positioned between the first and second metallic layer and substantially surrounding the periphery of the component portion.
8. The electronic module of claim 1 , further comprising:
the plurality of metallic layers including a second metallic layer within the substrate wherein the second metallic layer is positioned below the first metallic layer and each of the first and second metallic layers have an extended section that extends from the periphery and into the component portion; and
at least one conductive vias that couples each of the extended sections of the first and second metallic layers.