Systems and methods for loading of a component

1. A component loading system, comprising:

a circuit board comprising:

a socket;

a first plurality of holes; and

a second plurality of holes;

a frame comprising:

two opposing sidewalls each substantially perpendicular to a surface of the circuit board and coupled to one another via a plate;

a plurality of threaded channels, each channel adjacent to one of the two opposing sidewalls and located between the two opposing sidewalls; and

a third plurality of holes;

a backing plate comprising:

a plurality of heat dissipater mounting posts; and

a fourth plurality of holes;

a plurality of first fasteners each mechanically engaged to a respective heat dissipater mounting post passing through a respective one of the third plurality of holes and a respective one of the first plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board; and

a plurality of second fasteners each mechanically engaged to a respective one of the plurality of threaded channels and passing through a respective one of the second plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board.

2. The component loading system of claim 1 , the sidewalls arranged in relation to each other and the socket in order to mechanically guide a package comprising a processor into the component loading system.

3. The component loading system of claim 2 , wherein the package comprises a processor/heat dissipater module comprising a processor mechanically coupled to a heat dissipater.

4. The component loading system of claim 1 , wherein each of the plurality of heat dissipater mounting posts are configured to engage with a respective fastener of a heat dissipater.

5. The component loading system of claim 1 , further comprising a heat dissipater comprising a plurality of spring-loaded fasteners each mechanically coupled to a respective one of the plurality of heat dissipater mounting posts, the spring-loaded fasteners each having a spring force providing mechanical loading for thermally coupling the heat dissipater to a processor electrically coupled to the socket.

6. The component loading system of claim 5 , the heat dissipater integral to a processor/heat dissipater module further comprising a processor mechanically coupled to the heat dissipater, and the spring-loaded fasteners each having a spring force providing mechanical loading for electrically mating the processor to the socket.

7. The component loading system of claim 5 , wherein the processor is mechanically secured to the socket by a wire bale retention mechanism.

8. A method comprising:

providing a circuit board comprising:

a socket;

a first plurality of holes; and

a second plurality of holes;

providing a frame comprising:

two opposing sidewalls each substantially perpendicular to a surface of the circuit board and coupled to one another via a plate;

a plurality of threaded channels, each channel adjacent to one of the two opposing sidewalls and located between the two opposing sidewalls; and

a third plurality of holes;

providing a backing plate comprising:

a plurality of heat dissipater mounting posts; and

a fourth plurality of holes; and

mechanically securing the frame and the backplate on opposite sides of the circuit board via:

a plurality of first fasteners each mechanically engaged to a respective heat dissipater mounting post passing through a respective one of the third plurality of holes and a respective one of the first plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board; and

a plurality of second fasteners each mechanically engaged to a respective one of the plurality of threaded channels and passing through a respective one of the second plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board.

9. The method of claim 8 , further comprising guiding a package comprising a processor into the component loading system.

10. The component loading system of claim 9 , wherein the package comprises a processor/heat dissipater module comprising a processor mechanically coupled to a heat dissipater.

11. The method of claim 8 , further comprising mechanically coupling a heat dissipater to the plurality of heat dissipater mounting posts, each heat dissipater comprising a plurality of spring-loaded fasteners each mechanically coupled to a respective one of the plurality of heat dissipater mounting posts, the spring-loaded fasteners each having a spring force providing mechanical loading for thermally coupling the heat dissipater to a processor electrically coupled to the socket.

12. The method of claim 11 , further comprising mechanically securing the processor to the socket by a wire bale retention mechanism.

13. The method of claim 8 , further comprising mechanically coupling a processor/heat dissipater module to the plurality of heat dissipater mounting posts, each heat dissipater comprising a plurality of spring-loaded fasteners each mechanically coupled to a respective one of the plurality of heat dissipater mounting posts, the spring-loaded fasteners each having a spring force providing mechanical loading for electrically mating a processor to the socket.

14. An information handling system comprising:

a circuit board comprising:

a socket;

a first plurality of holes; and

a second plurality of holes;

a memory communicatively coupled to the socket;

a frame comprising:

two opposing sidewalls each substantially perpendicular to a surface of the circuit board coupled to one another via a plate;

a plurality of threaded channels, each channel adjacent to one of the two opposing sidewalls and located between the two opposing sidewalls; and

a third plurality of holes;

a backing plate comprising:

a plurality of heat dissipater mounting posts; and

a fourth plurality of holes;

a plurality of first fasteners each mechanically engaged to a respective heat dissipater mounting post passing through a respective one of the third plurality of holes and a respective one of the first plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board; and

a plurality of second fasteners each mechanically engaged to a respective one of the plurality of threaded channels and passing through a respective one of the second plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board.

15. The information handling system of claim 14 , the sidewalls arranged in relation to each other and the socket in order to mechanically guide a package comprising a processor into the component loading system.

16. The information handling system of claim 15 , wherein the package comprises a processor/heat dissipater module comprising a processor mechanically coupled to a heat dissipater.

17. The information handling system of claim 14 , wherein each of the plurality of heat dissipater mounting posts are configured to engage with a respective fastener of a heat dissipater.

18. The information handling system of claim 14 , further comprising a heat dissipater comprising a plurality of spring-loaded fasteners each mechanically coupled to a respective one of the plurality of heat dissipater mounting posts, the spring-loaded fasteners each having a spring force providing mechanical loading for thermally coupling the heat dissipater to a processor electrically coupled to the socket.

19. The information handling system of claim 18 , the heat dissipater integral to a processor/heat dissipater module further comprising a processor mechanically coupled to the heat dissipater, and the spring-loaded fasteners each having a spring force providing mechanical loading for electrically mating the processor to the socket.

20. The information handling system of claim 18 , wherein the processor is mechanically secured to the socket by a wire bale retention mechanism.