IP Library Granted Patent US 9,368,211
Granted Patent B2
US 9,368,211 · App. 14/596,639 · Granted Jun 14, 2016

Semiconductor memory device having a memory string that includes a transistor having a charge stored therein to indicate the memory string is defective

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Quick Facts
Patent No.
US 9,368,211
App. No.
14/596,639
Granted
Jun 14, 2016
Kind
B2
Abstract

A semiconductor memory device includes a memory string having first and second selective transistors, each of which includes a charge storage layer and a control gate, a back gate transistor which includes a charge storage layer and a control gate, and memory cell transistors connected to each other and to the back gate transistor in series between the first and second selective transistors. In case any of the memory cell transistors is defective, the defect is indicated by storing a charge in the charge storage layer of at least one of the first and second selective transistors and the back gate transistor.

Claims (26)

1. A semiconductor memory device, comprising a memory string that includes:

a plurality of memory cell transistors connected in series; and

a first transistor having a charge storage layer and a control gate and connected in series with the memory cell transistors,

wherein a charge is stored in the charge storage layer of the first transistor to indicate that the memory string is defective.

2. The semiconductor memory device according to claim 1 , wherein a threshold voltage of the first transistor is increased to be greater than a standard read/write voltage to indicate that the memory string is defective.

3. The semiconductor memory device according to claim 1 , wherein the first transistor does not hold data but functions as a current path when data are written, read out, and erased to or from the memory cell transistors.

4. The semiconductor memory device according to claim 1 , further comprising:

first and second selective transistors, each including a charge storage layer and a control gate;

wherein the first and second selective transistors are defective and a charge is stored in the charge storage layer of the first transistor to indicate that the memory string is defective.

5. The semiconductor memory device according to claim 4 , wherein the first transistor is connected in series between a first group of the memory cell transistors and a second group of the memory cell transistors.

6. The semiconductor memory device according to claim 1 , further comprising:

erasable memory blocks,

wherein one of the memory blocks includes, in addition to the memory string, other memory strings.

7. A memory system comprising:

a non-volatile semiconductor memory including erasable blocks, each of the erasable blocks including a plurality of memory strings; and

a memory controller configured to issue read, write, and erase instructions to the non-volatile semiconductor memory in response to commands from a host,

wherein each of the memory strings includes a plurality of memory cell transistors connected in series, and a first transistor having a charge storage layer and a control gate and connected in series with the memory cell transistors, and

wherein a charge is stored in the charge storage layer of the first transistor to indicate that the memory string is defective.

8. The memory system according to claim 7 , wherein a threshold voltage of the first transistor is increased to be greater than a standard read/write voltage to indicate that the memory string is defective.

9. The memory system according to claim 7 , wherein the first transistor does not hold data but functions as a current path when data are written, read out, and erased to or from the memory cell transistors.

10. The memory system according to claim 7 , wherein each of the memory strings includes first and second selective transistors, each including a charge storage layer and a control gate;

wherein the first and second selective transistors are defective and a charge is stored in the charge storage layer of the first transistor to indicate that the memory string is defective.

11. The memory system according to claim 10 , wherein the first transistor is connected in series between a first group of the memory cell transistors and a second group of the memory cell transistors.

12. The memory system according to claim 7 , further comprising:

erasable memory blocks,

wherein one of the memory blocks includes, in addition to the memory string, other memory strings.

Assignments (4)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043194/0647 →