Polishing composition
View Patent ↗A polishing composition comprising abrasive particles, a compound having hexavalent molybdenum or pentavalent vanadium, an anionic additive, a halogen oxides compound or salts thereof, and a carrier solvent is provided herein. The polishing composition is suitable for chemical mechanical polishing process of SiGe, Si and SiO 2 substrates. The compound having hexavalent molybdenum or pentavalent can effectively raise the removal rate for SiGe and Si substrates, and increase the polishing selectivity of SiGe and Si relative to SiO 2 , simultaneously.
1. A polishing composition for polishing a silicon-germanium alloy substrate, comprising:
abrasive particles;
a compound selected from the group consisting of vanadium pentoxide and sodium metavanadate, for carrying out a catalytic reaction and an oxidation reaction directly to the silicon-germanium alloy substrate; and
a carrier solvent, wherein a content of the abrasive particles is in a range from 0.01 wt % to 5 wt %, and a content of the compound having hexavalent molybdenum or pentavalent vanadium is in a range from 0.01 wt % to 1.0 wt %;
wherein the polishing composition further comprises an anionic additive, and a content of which is in a range from 0.01 wt % to 0.2 wt %;
wherein the polishing composition further comprises a halogen oxides compound of salts thereof, and a content of the halogen oxides compound or salts thereof is in a range from 0.05 wt % to 5 wt %; and
wherein a static etching rate of the silicon-germanium substrate is 0 Å/min.
2. The polishing composition as claimed in claim 1 , wherein the abrasive particles are selected from colloidal silica or fumed silica.
3. The polishing composition as claimed in claim 1 , wherein the anionic additive is selected from the group consisting of potassium fluoride, sodium fluoride, trifluoroacetic acid, potassium trifluoroacetate, and sodium trifluoroacetate.
4. The polishing composition as claimed in claim 1 , wherein the halogen oxides compound or salts thereof is selected from the group consisting of potassium perchlorate, sodium perchlorate, potassium chlorate, and sodium chlorate.
5. The polishing composition as claimed in claim 1 , wherein the carrier solvent comprises water.
6. The polishing composition as claimed in claim 1 , wherein the polishing composition has a pH value in a range of 7 to 12.
7. The polishing composition as claimed in claim 1 , wherein the polishing composition is used for a chemical mechanical polishing to a silicon-germanium substrate, a silicon substrate, and a silicon dioxide substrate.
8. The polishing composition as claimed in claim 7 , wherein a content of germanium in the silicon-germanium substrate is in a range from 10% to 80%.
9. A polishing composition for polishing a silicon-germanium alloy substrate, consisting essentially of: abrasive particles; a compound selected from the group consisting of vanadium pentoxide and sodium metavanadate, for carrying out a catalytic reaction and an oxidation reaction directly to the silicon-germanium alloy substrate; and a carrier solvent, wherein a content of the abrasive particles is in a range from 0.01 wt % to 5 wt %, and a content of the compound having hexavalent molybdenum or pentavalent vanadium is in a range from 0.01 wt % to 1.0 wt %; wherein the polishing composition further comprises an anionic additive, and a content of which is in a range from 0.1 wt % to 0.2 wt %; wherein the polishing composition further comprises a halogen oxides compound or salts thereof, and a content of the halogen oxides compound or salts thereof is in a range from 0.05 wt % to 5 wt %.