IP Library Granted Patent US 9,596,772
Granted Patent B2
US 9,596,772 · App. 14/597,939 · Granted Mar 14, 2017

Stackable switch cooling system

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Quick Facts
Patent No.
US 9,596,772
App. No.
14/597,939
Granted
Mar 14, 2017
Kind
B2
Abstract

A switch includes a switch chassis that houses a heat producing component. A plurality of side walls are located on the switch chassis and define a chassis perimeter. A top wall extends between the plurality of side walls and defines a top wall perimeter vent adjacent the chassis perimeter. A bottom wall extends between the plurality of side walls, is located opposite the switch chassis from the top wall, and defines a bottom wall perimeter vent adjacent the chassis perimeter. A plurality of feet are located on the bottom wall and provide an air gap between the switch chassis and a support surface when the plurality of feet engage the support surface. In response to the heat producing component generating heat, fresh air is drawn in through the air gap and the bottom wall perimeter vent, and heated air flows through the top wall perimeter vent.

Claims (73)

1. A switch system, comprising:

a first switch, comprising:

a first switch side wall member that is provided by a single extruded piece of material;

a first switch top wall that extends between the first switch side wall member and that defines a first switch top wall perimeter vent that is located between the first switch side wall member and a first switch top wall center portion that is free of venting;

a first switch bottom wall that is located opposite the first switch from the first switch top wall, that extends between the first switch side wall member, and that defines a first switch bottom wall perimeter vent that is located between the first switch side wall member and a first switch bottom wall center portion that is free of venting;

a first switch housing that is defined between the first switch side wall member, the first switch top wall, and the first switch bottom wall; and

a first switch heat producing component that is centrally located in the first switch housing between the first switch top wall center portion and the first switch bottom wall center portion; and

a second switch that is positioned in a stacked configuration with the first switch, wherein the second switch comprises:

a second switch side wall member that is provided by a single extruded piece of material;

a second switch top wall that extends between the second switch side wall member, that defines a second switch top wall perimeter vent that is located between the second switch side wall member and a second switch top wall center portion that is free of venting, and that is positioned adjacent the first switch bottom wall perimeter vent on the first switch such that a first air gap is provided between the second switch top wall and the first switch bottom wall;

a second switch bottom wall that is located opposite the second switch from the second switch top wall, that extends between the second switch side wall member, and that defines a second switch bottom wall perimeter vent that is located between the second switch side wall member and a second switch bottom wall center portion that is free of venting;

a second switch housing that is defined between the second switch side wall member, the second switch top wall, and the second switch bottom wall; and

a second switch heat producing component that is centrally located in the second switch housing between the second switch top wall center portion and the second switch bottom wall center portion;

wherein, in response to operation of the first switch and the second switch in the stacked orientation, a perimeter airflow is created by:

drawing first fresh air in through the second switch bottom wall perimeter vent such that the first fresh air flows throughout a first airflow perimeter between the second switch heat producing component and the second switch side wall member;

heating the first fresh air using the second switch heat producing component to provide first heated air;

exhausting the first heated air through the second switch top wall perimeter vent;

drawing the first heated air that was exhausted through the second switch top wall perimeter vent through the first air gap and the first switch bottom wall perimeter vent such that the first heated air flows throughout a second airflow perimeter between the first switch heat producing component and the first switch side wall member;

heating the first heated air using the first switch heat producing component to provide second heated air; and

exhausting the second heated air through the first switch top wall perimeter vent.

2. The switch system of claim 1 , further comprising:

a second switch board that is located in the second switch housing and that includes the second switch heat producing component, wherein the fresh air flows throughout the first airflow perimeter between the second switch board and the second switch side wall member when the perimeter airflow is created; and

a first switch board that is located in the first switch housing and that includes the first switch heat producing component, wherein the first heated air flows throughout the second airflow perimeter between the first switch board and the first switch side wall member when the perimeter airflow is created.

3. The switch system of claim 1 , further comprising:

a second switch heat transfer device engaging each of the second switch heat producing component and the second switch side wall member, wherein the second switch heat transfer device transfers heat generated by the second switch heat producing component to the second switch side wall member such that the second switch side wall member radiates at least some of the heat generated by the second switch heat producing component, and wherein the first heated air is heated using at least some of the heat transferred by the second switch heat transfer device; and

a first switch heat transfer device engaging each of the first switch heat producing component and the first switch side wall member, wherein the first switch heat transfer device transfers heat generated by the first switch heat producing component to the first switch side wall member such that the first switch side wall member radiates at least some of the heat generated by the first switch heat producing component, and wherein the second heated air is heated using at least some of the heat transferred by the first switch heat transfer device.

4. The switch system of claim 3 , wherein the first switch heat transfer device includes heat transfer members that are orientated in an L-shaped configuration, and wherein the second switch heat transfer device includes heat transfer members that are orientated in an L-shaped configuration.

5. The switch system of claim 1 , wherein the perimeter airflow is created by:

drawing second fresh air through the first air gap;

directing the second fresh air in through the first switch bottom wall perimeter vent such that the second fresh air flows in the first airflow perimeter between the first switch heat producing component and the first switch side wall member;

heating the second fresh air using the first switch heat producing component to provide third heated air; and

exhausting the third heated air through the first switch top wall perimeter vent.

6. The switch system of claim 1 , further comprising:

a plurality of first switch feet on the first switch that engage the second switch top wall to provide the first air gap when the second switch is positioned in the stacked configuration with the first switch; and

a plurality of second switch feet on the second switch that engage a support surface to provide a second air gap between the second switch and the support surface, wherein the first fresh air is drawn in through the second bottom wall perimeter vent via the second air gap.

7. The switch system of claim 1 , wherein each of the first switch and the second switch do not include a fan system.

8. An information handling system (IHS), comprising

a chassis;

a chassis side wall member that is included on the chassis, that defines a chassis perimeter, and that is provided by a single piece of extruded material;

a chassis top wall that extends between the chassis side wall member and that defines a top wall perimeter vent that is located between the chassis perimeter and a top wall center portion that is free of venting;

a chassis bottom wall that extends between the chassis side wall member, that is located opposite the chassis from the chassis top wall, and that defines a bottom wall perimeter vent that is located between the chassis perimeter and a bottom wall center portion that is free of venting;

a chassis housing that is defined between the chassis side wall member, the chassis to wall, and the chassis bottom wall;

a heat producing component that is centrally located in the chassis housing between the to wall center portion and the bottom wall center portion; and

a plurality of feet that are located on the chassis bottom wall and that are configured to provide an air gap between the chassis bottom wall and a support surface when the plurality of feet engage the support surface;

wherein, in response to the heat producing component generating heat, a perimeter airflow is created by:

drawing fresh air in through the air gap and the bottom wall perimeter vent such that the fresh air flows throughout an airflow perimeter between the heat producing component and the chassis side wall member;

heating the fresh air using the heat generated by the heat producing component to provide heated air; and

exhausting the heated air through the top wall perimeter vent.

9. The IHS of claim 8 , further comprising:

a first heat transfer device engaging each of the heat producing component and the chassis side wall member, wherein the first heat transfer device is configured to transfer heat generated by the heat producing component to the chassis side wall member such that the chassis side wall member radiates at least some of the heat generated by the heat producing component, and wherein the heated air is heated using at least some of the heat transferred by the first heat transfer device.

10. The IHS of claim 9 , wherein the first heat transfer device includes a first heat transfer member and a second heat transfer member that are orientated in an L-shaped configuration, and wherein the first heat transfer member engages the heat producing component and the second heat transfer member engages the chassis side wall member.

11. The IHS of claim 9 , further comprising:

a second heat transfer device engaging each of the heat producing component and the chassis side wall member, wherein the second heat transfer device is configured to transfer heat generated by the heat producing component to the chassis side wall member such that the chassis side wall member radiates at least some of the heat generated by the heat producing component, and wherein the heated air is heated using at least some of the heat transferred by the second heat transfer device.

12. The IHS of claim 8 , wherein the single piece of extruded material is an aluminum material.

13. The IHS of claim 8 , wherein the heat producing component is located on a circuit board that is housed in the chassis, and wherein the circuit board is oriented in the chassis to provide an air channel that allows the perimeter airflow from the bottom wall perimeter vent, through the air channel, and to the top wall perimeter vent when the heat producing component is generating heat.

14. The IHS of claim 8 , wherein the chassis does not house a fan system.

15. A method for cooling an information handling system (IHS), comprising:

operating a first heat producing component housed in a first chassis housing that is defined by a first chassis between a first chassis side wall member that is provided by a single piece of extruded material, a first chassis to wall that extends between the first chassis side wall member, and a first chassis bottom wall that extends between the first chassis side wall member and that is located opposite the first chassis side wall member from the first chassis top wall, wherein the operating of the first heat producing component generates heat; and

creating a perimeter airflow by:

drawing, in response to operating the first heat producing component to generate heat, first fresh air into the first chassis housing through a first chassis bottom wall perimeter vent that is defined by the first chassis bottom wall between the first chassis side wall member and a first chassis bottom wall center portion that is free of venting, wherein the drawing the first fresh air into the first chassis housing results in the first fresh air flowing throughout a first airflow perimeter between the first heat producing component and the first chassis side wall member;

heating the fresh air using the heat generated by the first heat producing component to produce first heated air; and

exhausting the first heated air from the first chassis housing through a first chassis top wall perimeter vent that is defined by the first chassis top wall between the first chassis side wall member and a first chassis top wall center portion that is free of venting.

16. The method of claim 15 , further comprising:

transferring heat generated by the first heat producing component to the first chassis side wall member using a heat transfer device that extends between the heat producing component and the first chassis side wall member such that the first chassis side wall member radiates at least some of the heat generated by the first heat producing component, wherein the heated air is heated using at least some of the heat transferred by the heat transfer device.

17. The method of claim 16 , wherein the heat transfer device includes a first heat transfer member and a second heat transfer member that are orientated in an L-shaped configuration, and wherein the first heat transfer member engages the heat producing component and the second heat transfer member engages the first chassis side wall member.

18. The method of claim 15 , wherein the first chassis includes a plurality of feet that are located on the first chassis bottom wall and that engage a support surface to provide an air gap, and wherein the perimeter airflow is created by drawing the fresh air through the air gap.

19. The method of claim 15 , wherein the first chassis does not include a fan system.

20. The method of claim 15 , further comprising:

positioning a second chassis in a stacked orientation with the first chassis, wherein the second chassis includes a plurality of feet that engage the first chassis top wall to provide an air gap is between the first chassis and the second chassis in the stacked orientation;

operating a second heat producing component housed in a second chassis housing that is defined by the second chassis between a second chassis side wall member that is provided by a single piece of extruded material, a second chassis to wall that extends between the second chassis side wall member, and a second chassis bottom wall that extends between the second chassis side wall member and that is located opposite the second chassis side wall member from the second chassis top wall, wherein the operating of the second heat producing component generates heat;

drawing, in response to operating the second heat producing component to generate heat, the first air exhausting from the first chassis housing through the first chassis top wall perimeter vent into the second chassis housing through the air gap and a second chassis bottom wall perimeter vent that is defined by the second chassis bottom wall between the second chassis side wall member and a second chassis bottom wall center portion that is free of venting, wherein the drawing the first heated air into the second chassis housing results in the first heated air flowing throughout a second airflow perimeter between the second heat producing component and the second chassis side wall member;

heating the first heated air using the heat generated by the second heat producing component to produce second heated air; and

exhausting the second heated air from the second chassis housing through a second chassis top wall perimeter vent that is defined by the second chassis to wall between the second chassis side wall member and a second chassis to wall center portion that is free of venting.

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
RELEASE OF REEL 035104 FRAME 0043 (NOTE) Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; COMPELLENT TECHNOLOGIES, INC.
Reel/Frame 040027/0123 →
RELEASE OF REEL 035103 FRAME 0809 (TL) Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; COMPELLENT TECHNOLOGIES, INC.
Reel/Frame 040027/0934 →
RELEASE OF REEL 035103 FRAME 0536 (ABL) Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; COMPELLENT TECHNOLOGIES, INC.
Reel/Frame 040016/0864 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (NOTES) Recorded Feb 26, 2015
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; COMPELLENT TECHNOLOGIES, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035104/0043 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (ABL) Recorded Feb 26, 2015
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; COMPELLENT TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035103/0536 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Feb 26, 2015
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; COMPELLENT TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 035103/0809 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2015
From: RUBERTO, THOMAS; PHELPS, CRAIG WARREN; DONACHY, JOHN CHARLES
To: DELL PRODUCTS L.P.
Reel/Frame 034730/0451 →