Magnet wire for 3D electronic circuitry
A method of and device for making a three dimensional electronic circuit. The method comprises coupling one or more magnet wires with a substrate along a surface contour of the substrate, immobilizing the one or more magnet wires on the substrate, and forming the electronic circuit by electrically coupling the one or more magnet wires with an integrated circuit chip.
1. A method of forming an electronic circuit comprising:
a) coupling one or more magnet wires with a substrate along a surface contour of the substrate;
b) immobilizing the one or more magnet wires on the substrate;
c) melting an insulating coating of the magnet wires to form a protecting layer over a conducting wire; and
d) forming the electronic circuit by electrically coupling the one or more magnet wires with an integrated circuit chip.
2. The method of claim 1 , wherein the contour comprises a non-flat surface.
3. The method of claim 1 , further comprising applying an amount of adhesive on the substrate.
4. The method of claim 1 , further comprising applying an amount of adhesive on the one or more magnet wires.
5. The method of claim 1 , wherein the one or more magnet wires comprise a self bonding magnet wire.
6. The method of claim 5 , further comprising applying an amount of alcohol to the magnet wires.
7. The method of claim 5 , further comprising bonding in an oven.
8. The method of claim 5 , further comprising bonding by generating an electric current.
9. The method of claim 1 , further comprising removing a portion of an insulating layer by using a laser pulse.
10. The method of claim 9 , further comprising covering the portion with an insulating material.
11. A method of forming a three dimensional electronic circuit comprising:
a) shaping a magnet wire according to a surface shape of a substrate;
b) immobilizing the magnet wire on the surface;
c) melting an insulating coating of the magnet wires to form a protecting layer over a conducting wire; and
d) coupling the magnet wire with an electronic component.
12. The method of claim 11 , wherein the three dimensional electronic circuit is part of a circuit board.
13. The method of claim 11 , wherein the circuit board is coupled with a microwave oven.
14. The method of claim 11 , wherein the circuit board is coupled with an electric motor.