IP Library › Granted Patent US 9,678,271

Granted Patent B2

US 9,678,271 · App. 14/605,650 · Granted Jun 13, 2017

Packaged opto-electronic module

Inventors: Hiren D. Thacker (San Diego, CA); Ashok V. Krishnamoorthy (San Diego, CA); Xuezhe Zheng (San Diego, CA); John E. Cunningham (San Diego, CA)

Assignee: ORACLE INTERNATIONAL CORPORATION

G02B6/12004 G02B6/30 G02B6/32 G02B6/4219 G02B6/4257 G02B6/4274 H01L23/49827 H01L23/49838 H01L23/49894 H01L25/167 H04B10/803 G02B2006/12061 G02B2006/12142 H01L2224/16225 H01L2924/0002 H01L2924/15311

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Quick Facts

Patent No.: US 9,678,271
App. No.: 14/605,650
Granted: Jun 13, 2017
Kind: B2

External Links

USPTO Patent Center↗ Full Patent PDF↗

Abstract

A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits that modulate data, communicate data, and serialize/deserialize data, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and a top surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit. Furthermore, a bottom surface of the optical integrated circuit faces the top surface of the interposer, and the front surface of the optical integrated circuit is optically coupled to an optical-fiber receptacle, which in turn is optically coupled to an optical-fiber connector.

Claims (58)

1. A chip package, comprising:

an integrated circuit having a front surface with first integrated-circuit connector pads and second integrated-circuit connector pads, wherein the integrated circuit is configured to: modulate data, communicate data, and serialize/deserialize data;

first integrated-circuit electrical connectors electrically coupled to the first integrated-circuit connector pads;

an interposer having a bottom surface and a top surface, facing the front surface of the integrated circuit, with first interposer connector pads electrically coupled to the first integrated-circuit electrical connectors;

second integrated-circuit electrical connectors electrically coupled to the second integrated-circuit connector pads;

an optical integrated circuit having a bottom surface, facing the top surface of the interposer, and a top surface, facing the front surface of the integrated circuit, with first optical-integrated-circuit connector pads electrically coupled to the second integrated-circuit electrical connectors, wherein the optical integrated circuit is configured to communicate optical signals;

an optical-fiber receptacle having a first surface and a second surface, wherein the first surface is mechanically and optically coupled to the top surface of the optical integrated circuit; and

an optical-fiber connector mechanically and optically coupled to the second surface of the optical-fiber receptacle.

2. The chip package of claim 1 , wherein the optical integrated circuit includes second optical-integrated-circuit connector pads on the bottom surface of the optical integrated circuit;

wherein the interposer includes second interposer connector pads on the top surface of the interposer; and

wherein the chip package further includes optical-integrated-circuit electrical connectors electrically coupled to the second optical-integrated-circuit connector pads and the second interposer connector pads.

3. The chip package of claim 1 , wherein the interposer includes a cavity defined by a surface; and

wherein the optical integrated circuit is at least partially included in the cavity.

4. The chip package of claim 1 , wherein the optical-fiber receptacle includes a lens on at least one of: the first surface, and the second surface.

5. The chip package of claim 1 , wherein the optical-fiber receptacle includes first alignment features on the first surface to facilitate alignment between the optical-fiber receptacle and the top surface of the optical integrated circuit; and

wherein the optical-fiber receptacle includes second alignment features on the second surface to facilitate alignment between the optical-fiber receptacle and the optical-fiber connector.

6. The chip package of claim 1 , wherein the optical-fiber connector includes a vertical optical-fiber connector configured to mechanically and optically couple to an optical fiber along a direction perpendicular to a plane of the interposer.

7. The chip package of claim 1 , wherein the optical-fiber connector includes a horizontal optical-fiber connector configured to mechanically and optically couple to an optical fiber along a direction in a plane of the interposer.

8. The chip package of claim 1 , wherein the integrated circuit is configured to perform one of: transmitting data, receiving data, and transmitting and receiving data.

9. The chip package of claim 1 , wherein the first integrated circuit is configured to transmit data; and

wherein the chip package includes:

a second integrated circuit having a front surface with third integrated-circuit connector pads and fourth integrated-circuit connector pads, wherein the second integrated circuit is configured to receive data;

third integrated-circuit electrical connectors electrically coupled to the third integrated-circuit connector pads and second interposer connector pads on the top surface of the interposer; and

fourth integrated-circuit electrical connectors electrically coupled to the fourth integrated-circuit connector pads and second optical-integrated-circuit connector pads on the top surface of the optical integrated circuit.

10. The chip package of claim 1 , wherein the chip package further comprises a substrate thermally and electrically coupled to the bottom surface of the interposer.

11. The chip package of claim 10 , wherein the interposer includes through-interposer vias electrically coupling the bottom surface of the interposer and the top surface of the interposer.

12. The chip package of claim 1 , wherein the optical integrated circuit is implemented using silicon-on-insulator technology.

13. The chip package of claim 1 , wherein the interposer includes one of: an organic material, a ceramic, glass, and a semiconductor.

14. The chip package of claim 1 , wherein, with the exception of the optical fiber connector, the chip package is solder-reflow compatible up to 260 C.

15. A system, comprising:

a processor;

a memory coupled to the processor; and

a chip package, wherein the chip package includes:

first integrated-circuit electrical connectors electrically coupled to the first integrated-circuit connector pads;

second integrated-circuit electrical connectors electrically coupled to the second integrated-circuit connector pads;

an optical-fiber receptacle having a first surface and a second surface, wherein the first surface is mechanically and optically coupled to the top surface of the optical integrated circuit; and

an optical-fiber connector mechanically and optically coupled to the second surface of the optical-fiber receptacle.

16. The system of claim 15 , wherein the optical integrated circuit includes second optical-integrated-circuit connector pads on the bottom surface of the optical integrated circuit;

wherein the interposer includes second interposer connector pads on the top surface of the interposer; and

17. The system of claim 15 , wherein the interposer includes a cavity defined by a surface; and

wherein the optical integrated circuit is at least partially included in the cavity.

18. The system of claim 15 , wherein the first integrated circuit is configured to transmit data;

wherein the chip package includes:

third integrated-circuit electrical connectors electrically coupled to the third integrated-circuit connector pads and second interposer connector pads on the top surface of the interposer; and

19. The system of claim 15 , wherein the chip package further comprises a substrate thermally and electrically coupled to the bottom surface of the interposer.

20. A method for communicating data between an integrated circuit and an optical integrated circuit, wherein the method comprises:

coupling digital electrical signals from interposer connection pads on a top surface of an interposer to first integrated-circuit connector pads on a front surface of the integrated circuit;

converting the digital electrical signals to analog electrical signals;

coupling the analog electrical signals from second integrated-circuit connector pads on the front surface of the integrated circuit to optical-integrated-circuit connector pads on a top surface of the optical integrated circuit;

generating optical signals based on the analog electrical signals;

communicating the optical signals to an optical fiber via an optical-fiber receptacle and an optical-fiber connector; and

coupling additional electrical signals from second interposer connection pads on the top surface of the interposer to second optical-integrated-circuit connector pads on a front surface of the optical integrated circuit.

Assignments (1)

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2015

From: THACKER, HIREN D.; KRISHNAMOORTHY, ASHOK V.; ZHENG, XUEZHE; CUNNINGHAM, JOHN E.

To: ORACLE INTERNATIONAL CORPORATION

Reel/Frame 034994/0524 →

Continuity (1)

Related Publication 20160216445A1 · Jul 28, 2016