Channel bonding with distributed marker packets
View Patent ↗Different data communication architectures receive a wide variety of content, including audio and video content, for consumers. The architectures employ channel bonding to deliver more bandwidth than any single communication channel can carry. In some implementations, the communication architectures receive distributed video programming in the form of MPEG2 TS packets, flagged by marker packets. Channel bonding synchronization information may be present in packets defined above the data-link layer or received in fields within data-link layer frames.
1. A device comprising:
interfaces to communications channels; and
channel bonding circuitry in communication with the interfaces, the channel bonding circuitry configured to:
receive data over the communication channels as a bonded channel group;
extract channel bonding information for the bonded channel group from marker packets within the data, the marker packets distributed over the communication channels in a round-robin sequence; and
receive program data in communication units preceded by the marker packets, the communication units distributed over the communication channels in the same round-robin sequence.
2. The device of claim 1 , where the communication units comprise multiple program data packets.
3. The device of claim 1 , where the channel bonding circuitry is configured to receive location information from the marker packets for the marker packets within the bonded channel group.
4. The device of claim 3 , where:
the marker packets comprise marker information for a first layer of a communication protocol; and
the location information is configured to indicate that the marker packets are framed at a second layer of the communication protocol.
5. The device of claim 4 , where:
the first layer comprises a layer at or above a transport layer of a pre-defined communication protocol; and
the second layer comprises a layer below the transport layer of the pre-defined communication protocol.
6. The device of claim 1 , where the channel bonding circuitry is configured to filter the program data.
7. The device of claim 6 , where the channel bonding circuitry is configured to filter the program data responsive to a program identifier.
8. The device of claim 1 , where the channel bonding circuitry is configured to receive configuration information indicating a size of the communication units.
9. The device of claim 1 , where the channel bonding circuitry is configured to receive configuration information arrives on a specific channel outside of the bonded channel group.
10. The device of claim 1 , where the channel bonding circuitry is configured to synchronize the program data from the bonded channel group.
11. The device of claim 10 , where the channel bonding circuitry is configured to correct for jitter, skew, or any combination thereof to synchronize the program data.
12. The device of claim 10 , where the channel bonding circuitry is configured to pad packets, truncate packets, insert packets, drop packets, or any combination thereof to synchronize the program data.
13. A product comprising:
a machine-readable medium other than a transitory signal;
instructions stored on the machine-readable medium, the instructions configured to, when executed by the machine:
receive data over communication channels as a bonded channel group;
extract channel bonding information for the bonded channel group from marker packets within the data, the marker packets distributed over the communication channels in a round-robin sequence; and
receive program data in communication units preceded by the marker packets, the communication units distributed over the communication channels in the same round-robin sequence.
14. The product of claim 13 , where the instructions are configured to synchronize the program data from the bonded channel group.
15. The product of claim 14 , where the instructions are configured to correct for jitter, skew, or any combination thereof to synchronize the program data.
16. A device comprising:
network interface circuitry configured to establish a configuration link; and
bonding circuitry in communication with network interface circuitry, the bonding circuitry configured to:
determine which of multiple communication channels to include in a bonded channel group; and
send configuration information for extracting marker information for the bonded channel group over the configuration link, the configuration information configured to indicate that the marker information from a first layer of a network protocol stack is included in frames defined at a second layer of the network protocol stack.
17. The device of claim 16 , where:
the first layer comprises a layer at or above a transport layer; and
the second layer comprises a layer below the transport layer.
18. The device of claim 17 , where the first layer comprises the transport layer.
19. The device of claim 17 , where the second layer comprises a data-link layer.
20. The device of claim 16 , where network interface circuitry is configured to establish the configuration link on one of the multiple communication channels outside of the bonded channel group.