Electronic device
View Patent ↗An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.
1. An electronic device, comprising:
a base body, which has a top side and an underside lying opposite the top side, wherein the base body has connection locations at its underside; and
an electronic component arranged at the top side of the base body;
wherein the base body has at least one side area having at least one point of inspection with a first region and a second region;
wherein the second region is embodied as an indentation in the first region;
wherein the first region and the second region contain different materials;
wherein the base body has a metallic carrier and the metallic carrier is covered by a radiation-opaque housing body in places so that the metallic carrier together with the housing body forms the base body; and
wherein no parts of the point of inspection are concealed or covered by the housing body or by other components of the base body.
2. The electronic device according to claim 1 , wherein the second region is configured to be wetted with a connection material to a greater extent than the first region.
3. The electronic device according to claim 1 , wherein the housing body mechanically connects the metallic carrier and the at least one point of inspection to one another.
4. The electronic device according to claim 1 , wherein at least one of the metallic carrier and the at least one point of inspection are at least partly embedded into the housing body.
5. The electronic device according to claim 1 , wherein the connection locations and the at least one point of inspection are formed with the same material.
6. The electronic device according to claim 1 , wherein the at least one side area of the base body is produced by singulation in places.
7. The electronic device according to claim 1 , wherein the first region of the at least one point of inspection comprises a metal.
8. The electronic device according to claim 1 , wherein the first region of the at least one point of inspection comprises a ceramic material.
9. The electronic device according to claim 1 , wherein the second region of the at least one point of inspection has a metallic coating.
10. An optoelectronic apparatus, comprising:
the electronic device according to claim 1 ; and
a contact carrier in electrical contact with the electronic device, wherein at least one mounting region is formed at a surface of the contact carrier;
wherein the second region of the at least one point of inspection is cohesively connected to the mounting region by a connection material; and
wherein the at least one point of inspection is freely visible from the surface of the contact carrier.
11. The optoelectronic apparatus according to claim 10 , wherein the connection material comprises a solder.
12. The electronic device according to claim 1 , wherein the electronic component is arranged at a chip mounting region at the top side of the base body.
13. The electronic device according to claim 1 , wherein the electronic component is a radiation-receiving or a radiation-emitting semiconductor chip.
14. An electronic device, comprising:
a base body, which has a top side and an underside lying opposite the top side, wherein the base body has connection locations at its underside; and
an electronic component arranged at the top side of the base body;
wherein the base body has at least one side area having at least one point of inspection having a first region and a second region;
wherein the second region is embodied as an indentation in the first region;
wherein the first region and the second region contain different materials;
wherein the first region of the at least one point of inspection comprises a metal or ceramic material;
wherein the second region of the at least one point of inspection has a coating, and wherein a material of the coating is different from the material of the first region;
wherein the coating is a thin layer on the second region so that the second region together with the coating forms an indentation in the first region;
wherein the second region is configured to be wetted with a connection material to a greater extent than the first region;
wherein the base body has a metallic carrier and the metallic carrier is covered by a radiation-opaque housing body in places so that the metallic carrier together with the housing body forms the base body;
wherein the material of the coating is different from the material of the housing body;
wherein the point of inspection is part of the side area of the base body so that the point of inspection is externally accessible and freely visible without parts of the point of inspection being concealed or covered by the housing body; and
wherein the first region of the at least one point of inspection and the housing body terminate flush at the side area of the base body.
15. The electronic device according to claim 14 , wherein the housing body mechanically connects the metallic carrier and the at least one point of inspection to one another.
16. The electronic device according to claim 14 , wherein at least one of the metallic carrier and the at least one point of inspection are at least partly embedded into the housing body.
17. The electronic device according to claim 14 , wherein the connection locations and the at least one point of inspection are formed with the same material.