Systems and methods for serviceable EMI shielding

1. An electronics device, the device comprising:

a circuit board;

at least one component mounted to the circuit board;

an electro-magnetic interference (EMI) shield that encloses the at least one component within a volume of space, wherein the EMI shield comprises:

a sheet of shielding material shaped to define a shield fence and a shield cover, wherein the shield fence is mechanically attached to a surface of the circuit board and extends away from the surface; and

a kiss-cut feature in the sheet of shielding material between the shield fence and the shield cover; wherein the kiss-cut feature comprises a partial cut through the top surface of the sheet of shielding material along a path that facilitates detachment of the shield cover from the shield fence.

2. The device of claim 1 , wherein the shield fence is positioned around a periphery of an area on the surface of the circuit board that includes the at least one component.

3. The device of claim 2 , wherein the shield fence is discontinuous.

4. The device of claim 1 , wherein the shielding material comprises a conducting material.

5. The device of claim 4 , wherein the conducting material comprises aluminum or copper.

6. The device of claim 1 , wherein the shield fence comprises one or more dimples protruding out from the shield fence.

7. An electronics device, the device comprising:

a circuit board;

at least one component mounted to the circuit board;

an electro-magnetic interference (EMI) shield that encloses the at least one component within a volume of space, wherein the EMI shield comprises:

a shield fence positioned around a periphery of an area on a surface of the circuit board that includes the at least one component, wherein the shield fence is mechanically attached to a surface of the circuit board and extends away from the surface; and

a shielding film cover attached to the shield fence by an electrically conducting adhesive, wherein the shielding film cover comprises one or more tabs that fold down around a lip of the shield fence and adheres to an external side of the shield fence.

8. The device of claim 7 , wherein the shield fence is discontinuous.

9. The device of claim 7 , wherein the shield fence comprises a conducting material.

10. The device of claim 9 , wherein the conducting material comprises aluminum or copper.

11. The device of claim 7 , wherein the shielding film cover comprises:

a film material coated with one or more metallization layers; and

a layer of the electrically conducting adhesive applied to the one or more metallization layers.

12. The device of claim 11 , wherein the film material comprises a Polyethylene Terephthalate (PET) film.

13. The device of claim 11 , wherein the one or more metallization layers comprise tin, aluminum, copper, or a metallic alloy.

14. A method for accessing shielded components on an electronics device, the method comprising:

applying a mechanical force to a shield cover of an electro-magnetic interference (EMI) shield, wherein the EMI shield comprises a shield fence mechanically attached to a circuit board and the shield cover is mechanically attached to the shield fence by a kiss-cut feature;

tearing the shield cover from the shield fence along the kiss-cut feature; and

removing the shield cover from the shield fence;

wherein the kiss-cut feature comprises a partial cut through a top surface of the EMI shield along a path that facilitates detachment of the shield cover from the shield fence.

15. The method of claim 14 , further comprising:

restoring EMI shielding by applying a shielding film cover over the shield fence.

16. The method of claim 15 , wherein the shielding film cover comprises:

a film material coated with one or more metallization layers; and

a layer of electrically conducting adhesive applied to the one or more metallization layers.

17. The method of claim 16 , wherein the film material comprises a Polyethylene Terephthalate (PET) film.

18. The method of claim 16 , wherein the one or more metallization layers comprise tin, aluminum, copper, or a metallic alloy.