IP Library Granted Patent US 9,389,378
Granted Patent B2
US 9,389,378 · App. 14/612,416 · Granted Jul 12, 2016

Method and system for optical power monitoring of a light source assembly coupled to a silicon photonically-enabled integrated circuit

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Quick Facts
Patent No.
US 9,389,378
App. No.
14/612,416
Granted
Jul 12, 2016
Kind
B2
Abstract

Methods and systems for optical power monitoring of a light source assembly coupled to a silicon photonically-enabled integrated circuit (chip) are disclosed and may include, in a system comprising an optical source assembly coupled to the chip: emitting a primary beam from a front facet of a laser in the optical source assembly and a secondary beam from a back facet of the laser, directing the primary beam to an optical coupler in the chip, directing the secondary beam to a surface-illuminated photodiode in the chip, and monitoring an output power of the laser utilizing an output signal from the photodiode. The primary beam may comprise an optical source for a photonics transceiver in the chip. The focused primary beam and the secondary beam may be directed to the chip using reflectors in a lid of the optical source assembly.

Claims (43)

1. A method for communication, the method comprising:

in a system comprising an optical source assembly coupled to a photonically-enabled integrated circuit:

emitting a primary beam from a front facet of a laser in the optical source assembly and a secondary beam from a back facet of the laser;

directing the primary beam to an optical coupler in the photonically-enabled integrated circuit, wherein the optical coupler comprises a grating coupler;

coupling the primary beam directed to the grating coupler to a waveguide in the photonically-enabled integrated circuit;

directing the secondary beam to a surface-illuminated photodiode in the photonically-enabled integrated circuit; and

monitoring an output power of the laser utilizing an output signal from the surface-illuminated photodiode.

2. The method according to claim 1 , wherein the primary beam is an optical source for a photonics transceiver in the photonically-enabled integrated circuit.

3. The method according to claim 1 , wherein the photonically-enabled integrated circuit comprises a silicon complementary metal-oxide semiconductor (CMOS) chip.

4. The method according to claim 1 , wherein the surface-illuminated photodiode comprises a silicon, silicon-germanium, or germanium photodiode.

5. The method according to claim 1 , comprising focusing the primary beam utilizing a ball lens.

6. The method according to claim 5 , comprising directing the focused primary beam to the optical coupler using a first reflector in a lid of the optical source assembly.

7. The method according to claim 6 , comprising directing the secondary beam to the surface-illuminated photodiode utilizing a second reflector in the lid of the optical source assembly.

8. The method according to claim 6 , comprising directing a portion of the secondary and/or primary beam to the surface-illuminated photodiode utilizing specular and/or diffuse reflectors.

9. The method according to claim 1 , comprising monitoring of the power coupled to the photonically-enabled circuit by tapping off a portion of the primary beam's already coupled power and directing through a waveguide to a second photodiode.

10. A system for communication, the system comprising:

an optical source assembly coupled to a photonically-enabled integrated circuit, said system being operable to:

emit a primary beam from a front facet of a laser in the optical source assembly and a secondary beam from a back facet of the laser;

direct the primary beam to an optical coupler in the photonically-enabled integrated circuit, wherein the optical coupler comprises a grating coupler;

couple the primary beam directed to the grating coupler to a waveguide in the photonically-enabled integrated circuit;

monitor a power of the coupled primary beam by tapping off a portion of the already coupled power and directing through a waveguide to a second photodiode;

direct the secondary beam to a surface-illuminated photodiode in the photonically-enabled integrated circuit; and

monitor an output power of the laser utilizing an output signal from the surface-illuminated photodiode.

11. The system according to claim 10 , wherein the primary beam is an optical source for a photonics transceiver in the photonically-enabled integrated circuit.

12. The system according to claim 10 , wherein the photonically-enabled integrated circuit comprises a silicon complementary metal-oxide semiconductor (CMOS) chip.

13. The system according to claim 10 , wherein the surface-illuminated photodiode comprises a silicon, silicon-germanium or germanium photodiode.

14. The system according to claim 10 , wherein the system is operable to focus the primary beam utilizing a ball lens.

15. The system according to claim 14 , wherein the system is operable to direct the focused primary beam to the optical coupler using a first reflector in a lid of the optical source assembly.

16. The system according to claim 14 , wherein the system is operable to direct a portion of the secondary and/or primary beam to the surface-illuminated photodiode using specular and/or diffuse reflectors.

17. The system according to claim 14 , wherein the system is operable to direct the secondary beam to the surface-illuminated photodiode utilizing a second reflector in the lid of the optical source assembly.

18. A system for communication, the system comprising:

an optical source assembly coupled to a CMOS photonic chip, said system being operable to:

emit a primary beam from a front facet of a laser in the optical source assembly and a secondary beam from a back facet of the laser;

reflect the primary beam to a grating coupler in the CMOS photonic chip;

couple the primary beam directed to the grating coupler to a waveguide in the CMOS photonic chip;

reflect the secondary beam to a surface-illuminated photodiode in the CMOS photonic chip; and

monitor an output power of the laser utilizing an output signal from the surface-illuminated photodiode.

19. The system according to claim 18 , wherein the primary beam is an optical source for a photonics transceiver in the CMOS photonic chip.

20. The system according to claim 18 , wherein the surface-illuminated photodiode comprises a silicon, silicon-germanium or germanium photodiode.

21. The system according to claim 18 , wherein the system is operable to focus the primary beam utilizing a ball lens.

22. The system according to claim 21 , wherein the system is operable to direct the focused primary beam to the optical coupler using a first reflector in a lid of the optical source assembly.

23. The system according to claim 21 , wherein the system is operable to direct a portion of the secondary and/or primary beam to the surface-illuminated photodiode using specular and/or diffuse reflectors.

24. The system according to claim 21 , wherein the system is operable to direct the secondary beam to the surface-illuminated photodiode utilizing a second reflector in the lid of the optical source assembly.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL: 058979 FRAME: 0027. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 24, 2022
From: LUXTERA LLC
To: CISCO TECHNOLOGY, INC.
Reel/Frame 059496/0803 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2022
From: CISCO SYSTEMS, INC.
To: CISCO TECHNOLOGY, INC.
Reel/Frame 058979/0027 →
RELEASE OF SECURITY INTEREST Recorded Dec 24, 2020
From: SILICON VALLEY BANK
To: LUXTERA, LLC
Reel/Frame 054855/0838 →
CHANGE OF NAME Recorded Feb 6, 2020
From: LUXTERA, INC.
To: LUXTERA LLC
Reel/Frame 052019/0811 →
SECURITY INTEREST Recorded Mar 29, 2017
From: LUXTERA, INC.
To: SILICON VALLEY BANK
Reel/Frame 042109/0140 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2016
From: MACK, MICHAEL; SAHNI, SUBAL; GLOECKNER, STEFFEN
To: LUXTERA INC.
Reel/Frame 038911/0222 →