Solder-Mask-Related Safety Accommodation Arrangement for LED Lighting Modules
An LED apparatus which includes (a) an electrical circuit board having an electrically-insulated substrate with conductive zones laminated thereon, (b) a selectively-applied dielectric layer, such as a solder-mask layer, deposited or otherwise adhered to portions of the circuit board, the dielectric layer having a thickness and material composition sufficient such that the fire and electrical enclosure requirements of UL8750, UL746E and UL746C are met, and (c) one or more LEDs connected to the circuit board at designated connection sites thereon.
1 . An LED apparatus including:
an electrical circuit board having an electrically-insulated substrate with conductive zones laminated thereon;
a selectively-applied dielectric layer adhered to portions of the circuit board, the dielectric layer having a thickness and material composition sufficient such that the fire and electrical enclosure requirements of UL8750, UL746E and UL746C are met; and
one or more LEDs connected to the circuit board at designated connection sites thereon.
2 . An LED apparatus of claim 1 wherein the selectively-applied dielectric layer is a solder mask.
3 . The LED apparatus of claim 2 wherein the solder-mask layer comprises Taiyo PSR4000 LEW3.
4 . The LED apparatus of claim 2 wherein the solder-mask layer has a thickness in excess of about 60 microns.
5 . The LED apparatus of claim 2 wherein the solder mask is applied by a silk-screening process.
6 . The LED apparatus of claim 2 wherein the region of the circuit board surrounding the LEDs is a lighting region, and the circuit board further includes non-LED electrical components on one or more areas of the circuit board outside of the lighting region.
7 . The LED apparatus of claim 6 wherein the one or more areas outside of the lighting region of the circuit board include a solder-mask layer having a thickness of not more than one-third that of the solder-mask layer on the lighting region.
8 . The LED apparatus of claim 7 wherein the solder mask is applied by a silk-screening process.
9 . The LED apparatus of claim 6 wherein the lighting region includes one or more subregions which do not include conductive zones, and the subregions include a solder-mask layer having a thickness of not more than one-third that of the solder-mask layer on the lighting region.
10 . The LED apparatus of claim 9 wherein the solder mask is applied by a silk-screening process.
11 . The LED apparatus of claim 1 wherein the selectively-applied dielectric layer is of a single material.