RFID transponder chip modules
View Patent ↗The planar antenna (PA) of a transponder chip module (TCM) may have a U-shaped portion so that an outer end (OE) of the antenna may be positioned close to an RFID chip (IC) disposed at a central area of a module tape (MT) for the transponder chip module. A module tape (MT 2 ) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT 1 ) having a planar antenna (PA). Metal of a conductive layer (CL) within a conductive element such as a coupling frame (CF) or a planar antenna (PA) may be scribed to have many small segments. A metal sheet may be stamped to have contact side metallization, and joined with a module tape (MT) having a planar antenna (PA).
1. A transponder chip module (TCM) comprising:
a first module tape (MT 1 ) comprising a first substrate having two opposite top and bottom surfaces and having an antenna structure (AS) disposed on the bottom surface thereof; and
a second module tape (MT 2 ) comprising a second substrate having two opposite top and bottom surfaces and having contact pads (CP) disposed on the top surface thereof and a connection bridge (CBR) on the bottom surface thereof;
wherein the second module tape (MT 2 ) is joined to the first module tape (MT 1 );
wherein the top of the first module tape (MT 1 ) is joined to the bottom of the second module tape (MT 2 ).
2. The transponder chip module of claim 1 , further comprising:
conductive elements extending through the second module tape and aligned with at least some of the contact pads.
3. The transponder chip module of claim 2 , further comprising:
through holes (TH) extending through the first module tape and aligned with the conductive elements extending through the second module tape.
4. The transponder chip module of claim 1 , further comprising:
through holes (TH) extending through the first module tape and aligned with outer and inner portions of the connection bridge.
5. The transponder chip module of claim 1 , further comprising:
an RFID chip (IC) disposed through an opening (OP) extending through the first module tape allowing mounting of the RFID chip on the second module tape.
6. A method of making a transponder chip module (TCM) comprising:
providing a first module tape (MT 1 ) comprising a first substrate having two opposite top and bottom surfaces and having an antenna structure (AS) disposed on the bottom surface thereof;
providing a second module tape (MT 2 ) comprising a second substrate having two opposite top and bottom surfaces and having contact pads (CP) disposed on the top surface thereof and a connection bridge (CBR) on the bottom surface thereof; and
joining the second module tape (MT 2 ) to the first module tape (MT 1 );
wherein the top of the first module tape (MT 1 ) is joined to the bottom of the second module tape (MT 2 ).
7. The method of claim 6 , further comprising:
providing conductive elements extending through the second module tape and aligned with at least some of the contact pads.
8. The method of claim of claim 7 , further comprising:
providing through holes (TH) extending through the first module tape and aligned with the conductive elements extending through the second module tape.
9. The method of claim of claim 6 , further comprising:
providing through holes (TH) extending through the first module tape (MT 1 ) and aligned with outer and inner portions of the connection bridge.
10. The method of claim 6 , further comprising:
providing an opening (OP) extending through the first module tape allowing mounting of an RFID chip (IC) on the second module tape.