RFID transponder chip modules
View Patent ↗The planar antenna (PA) of a transponder chip module (TCM) may have a U-shaped portion so that an outer end (OE) of the antenna may be positioned close to an RFID chip (IC) disposed at a central area of a module tape (MT) for the transponder chip module. A module tape (MT 2 ) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT 1 ) having a planar antenna (PA). Metal of a conductive layer (CL) within a conductive element such as a coupling frame (CF) or a planar antenna (PA) may be scribed to have many small segments. A metal sheet may be stamped to have contact side metallization, and joined with a module tape (MT) having a planar antenna (PA).
1. A method of making at least one connection through a substrate, comprising:
providing at least one through-hole extending through the substrate; and
deforming a portion of a first conductive layer (CL 1 ) which spans the through-hole on one side of the substrate so that it extends through the through-hole and at least to the opposite side of the substrate whereat it may contact and be joined with a second conductive layer (CL 2 ) on the opposite side of the substrate.
2. The method of claim 1 , wherein:
the first conductive layer (CL 1 ) is deformed with the second conductive layer disposed on the substrate.
3. The method of claim 1 , wherein:
the second conductive layer is disposed on the substrate after the first conductive layer is deformed.
4. The method of claim 1 , further comprising:
prior to deforming the portion of the first conductive layer, cutting or slitting it at the location of the through-hole, then bending it to come into contact with the conductive layer on the top, face-up side of the substrate.
5. The method of claim 1 , wherein:
the substrate comprises an epoxy-glass module tape.
6. The method of claim 1 , wherein:
the substrate has a thickness of approximately 70 μm - 100 μm.
7. The method of claim 1 , wherein:
the at least one through-hole has a cross-dimensions of approximately 400 μm-600 μm.
8. The method of claim 1 , wherein:
the first conductive layer comprises a copper foil.
9. The method of claim 8 , wherein:
the copper foil has a thickness of approximately 18 μm-35 mm.
10. The method of claim 8 , further comprising:
securing the copper foil to the substrate using an adhesive.
11. The method of claim 10 , wherein:
the adhesive has a thickness of approximately 20 μm.
12. The method of claim 10 , further comprising:
applying the adhesive so that it does not enter the through-hole.
13. The method of claim 1 , wherein:
the second conductive layer comprises a copper foil.
14. The method of claim 13 , wherein:
the copper foil has a thickness of approximately 18 μm-35mm.
15. The method of claim 13 , further comprising:
securing the copper foil to the substrate using an adhesive.
16. The method of claim 15 , wherein:
the adhesive has a thickness of approximately 20 μm.
17. The method of claim 15 , further comprising:
applying the adhesive so that it does not enter the through-hole.