Flexible device and fabrication method of flexible device
According to embodiments of the disclosure, a flexible device and a fabrication method thereof are provided. The flexible device has a first area and a second area, and the stiffness of a portion of the first area is greater than the stiffness of the second area. The flexible device may include a flexible substrate and a rigid element. The flexible substrate includes a first surface and a second surface opposite to each other. The second surface has a coarse structure. The surface roughness of the second surface is greater in the first area than in the second area. The rigid element is disposed on the first surface of the flexible substrate and located in the first area. The stiffness of the rigid element is greater than the stiffness of the flexible substrate. A projection area of the coarse structure on the flexible substrate overlaps an area of the rigid element.
1. A flexible device having a first area and a second area, wherein a stiffness of a portion of the first area is greater than a stiffness of the second area, the flexible device comprising:
a flexible substrate comprising a first surface and a second surface opposite to each other, and the second surface of the flexible substrate has a coarse structure in the first area, such that a surface roughness of the second surface in the first area is greater than a surface roughness of the second surface in the second area; and
a rigid element disposed on the first surface of the flexible substrate and located in the first area, wherein a stiffness of the rigid element is greater than a stiffness of the flexible substrate and a projection area of the coarse structure on the flexible substrate overlaps an area of the rigid element.
2. The flexible device of claim 1 , further comprising a functional element disposed on the first surface of the flexible substrate and located in the second area, wherein the stiffness of the rigid element is greater than a stiffness of the functional element.
3. The flexible device of claim 2 , wherein the functional element comprises an organic light-emitting element, an inorganic light-emitting element, a sensing element, a display element, a battery element, or a combination thereof.
4. The flexible device of claim 2 , wherein the rigid element is electrically connected to the functional element.
5. The flexible device of claim 2 , wherein the rigid element is located in a periphery of the functional element.
6. The flexible device of claim 1 , wherein the flexible substrate has at least one via defining one end of the first area.
7. The flexible device of claim 1 , wherein the flexible substrate has at least one via located in the first area.
8. The flexible device of claim 1 , wherein the first area is extended from a first side of the flexible substrate to a second side of the flexible substrate, and the first side and the second side are opposite sides.
9. The flexible device of claim 1 , wherein the coarse structure covers the first area.
10. The flexible device of claim 1 , wherein the coarse structure is distributed along a trajectory in the first area and distributed in a partial area of the first area.
11. A fabrication method of a flexible device, comprising:
temporarily adhering a flexible substrate on a carrier via a release layer, wherein the flexible substrate has a first surface and a second surface, and the second surface is in contact with the release layer;
forming at least one element on the first surface of the flexible substrate to form a flexible device, wherein the flexible device has a first area and a second area, and a stiffness of a portion of the first area is greater than a stiffness of the second area; and
irradiating a laser beam from the carrier toward the release layer located in the first area, and an irradiation path of the laser beam falls in the first area.
12. The method of claim 11 , further comprising, after the irradiation of the laser beam is complete, removing the flexible device from the carrier, such that the flexible substrate and the carrier are separated.
13. The method of claim 11 , further comprising, before the irradiation of the laser beam is performed, performing a processing step to form at least one via on the flexible substrate to expose the release layer or the carrier.
14. The method of claim 13 , wherein the at least one via comprises a first via and a second via respectively defining two opposite ends of the first area, and the irradiation path of the laser beam starts from a location of the first via and ends at a location of the second via.
15. The method of claim 11 , wherein the irradiation path of the laser beam starts from a first side of the flexible substrate and travels toward a second side of the flexible substrate, and the first side and the second side are opposite sides.
16. The method of claim 11 , wherein an irradiation area of the laser beam covers the first area.
17. The method of claim 11 , wherein an irradiation area of the laser beam accounts for a portion of the first area.
18. The method of claim 11 , wherein an irradiation direction of the laser beam is not perpendicular to the flexible substrate.
19. The method of claim 11 , wherein an area of the release layer is less than the flexible substrate and a portion of the flexible substrate is in contact with the carrier.
20. The method of claim 19 , further comprising, before the irradiation of the laser beam is performed, performing a processing step on the flexible substrate to form a cut opening, and the cut opening surrounds the release layer and exposes the release layer or the carrier.