IP Library Granted Patent US 9,296,930
Granted Patent B2
US 9,296,930 · App. 14/620,540 · Granted Mar 29, 2016

Low temperature hot melt adhesives for disposable articles with high creep resistance

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,296,930
App. No.
14/620,540
Granted
Mar 29, 2016
Kind
B2
Abstract

The present invention is directed to adhesives suitable for application using a hot melt process at a relatively low temperature in the range of about 110° C. to about 130° C. Such adhesives exhibit desirable viscoelastic properties and are suitable for bonding an elastic attachment in the manufacture of disposable articles, such as disposable diapers.

Claims (21)

1. A method of forming an article comprising:

(a) applying a low application temperature hot melt adhesive onto a substrate at a temperature in the range of from about 110° C. to about 130° C. at an add-on-level of about 20 to about 100 mg/m/strand;

(b) cooling the adhesive to room temperature;

wherein the low application temperature hot melt adhesive comprises:

i. 5 to 20 wt % of the styrenic block copolymer that (1) has a melt flow index greater than 33, measured in accordance with ASTM D 1238, and (2) has a styrene content greater than 40%;

ii. 0.5 to 5% wt % of the wax;

iii. 30-70 wt % of a tackifier that has a ring and ball softening point less than about 105° C.;

iv. 0.1-2 wt % of an antioxidant; and

v. optionally, up to 30 wt % of an oil; and

wherein the cooled adhesive has a creep performance of less than about 15% after 300% strain is applied on the cooled adhesive at 38° C. for four hours.

2. The method of claim 1 wherein the adhesive is applied by strand coating.

3. A method of forming an article comprising:

(a) applying the low application temperature hot melt adhesive onto a substrate at a temperature in the range of from about 110° C. to about 130° C. at an add-on-level of about 3 to about 30 mg/in; and

(b) cooling the adhesive to room temperature;

i. 5 to 20 wt % of the styrenic block copolymer that (1) has a melt flow index greater than 33, measured in accordance with ASTM D 1238, and (2) has a styrene content greater than 40%;

ii. 0.5 to 5% wt % of the wax;

iii. 30-70 wt % of a tackifier that has a ring and ball softening point less than about 105° C.;

iv. 0.1-2 wt % of an antioxidant; and

v. optionally, up to 30 wt % of an oil; and

wherein the cooled adhesive has a creep performance of less than about 25% after 300% strain is applied on the cooled adhesive at 38° C. for four hours.

4. The method of claim 3 wherein the adhesive is applied by spiral coating.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2015
From: HU, YUHONG; XENIDOU, MARIA
To: HENKEL CORPORATION
Reel/Frame 036246/0422 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2015
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 036264/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 036264/0047 →