IP Library Granted Patent US 10,155,301
Granted Patent B1
US 10,155,301 · App. 14/621,019 · Granted Dec 18, 2018

Methods of manufacturing a polycrystalline diamond compact including a polycrystalline diamond table containing aluminum carbide therein

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Quick Facts
Patent No.
US 10,155,301
App. No.
14/621,019
Granted
Dec 18, 2018
Kind
B1
Abstract

Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) comprising a polycrystalline diamond (“PCD”) table including at least a portion having aluminum carbide disposed interstitially between bonded-together diamond grains thereof, and methods of fabricating such PDCs. In an embodiment, a PDC includes a substrate, and a PCD table bonded to the substrate. The PCD table includes a plurality of bonded-together diamond grains defining a plurality of interstitial regions. The PCD table further includes aluminum carbide disposed in at least a portion of the plurality of interstitial regions.

Claims (23)

1. A method of manufacturing a polycrystalline diamond compact, the method comprising:

forming an assembly including an at least partially leached polycrystalline diamond table including a plurality of interstitial regions therein positioned at least proximate to a substrate and at least proximate to an aluminum-material layer, wherein the aluminum-material layer exhibits a thickness of about 10 μm to about 750 μm; and

while subjecting the assembly to a high-pressure/high-temperature process exhibiting a pressure of at least 4.0 GPa, infiltrating aluminum material from the aluminum-material layer into at least a portion of the interstitial regions of a selected region of the at least partially leached polycrystalline diamond table.

2. The method of claim 1 wherein the at least partially leached polycrystalline diamond table is disposed between the aluminum-material layer and the substrate.

3. The method of claim 1 wherein the aluminum-material layer is disposed between the at least partially leached polycrystalline diamond table and the substrate.

4. The method of claim 1 wherein the aluminum-material layer exhibits an annular geometry, and wherein the thickness is about 60 μm to about 100 μm.

5. The method of claim 1 , further comprising infiltrating a metallic infiltrant into a portion of the interstitial regions of the at least partially leached polycrystalline diamond table.

6. The method of claim 5 wherein infiltrating aluminum material from the aluminum-material layer into at least a portion of the interstitial regions of a selected region of the at least partially leached polycrystalline diamond table and infiltrating a metallic infiltrant into a portion of the interstitial regions of the at least partially leached polycrystalline diamond table occurs during subjecting the assembly to a high-pressure/high-temperature process.

7. The method of claim 1 , further comprising infiltrating a metallic infiltrant from the substrate into a portion of the interstitial regions of the at least partially leached polycrystalline diamond table.

8. The method of claim 1 wherein the infiltrated aluminum material reacts with at least some of the plurality of diamond grains to form aluminum carbide.

9. A method of manufacturing a polycrystalline diamond compact, the method comprising:

forming an assembly including an at least partially leached polycrystalline diamond table including a plurality of interstitial regions therein positioned between a substrate and an aluminum-material layer;

subjecting the assembly to a high-pressure/high-temperature process at a pressure of at least 4.0 GPa, wherein subjecting the assembly to the high-pressure/high-temperature process includes:

infiltrating aluminum material from the aluminum-material layer into at least a portion of the interstitial regions of a first region of the at least partially leached polycrystalline diamond table, wherein the infiltrated aluminum material reacts with at least some of the plurality of diamond grains to form aluminum carbide that occupies substantially all of the plurality of interstitial regions of the first region; and

infiltrating a metallic infiltrant into at least a portion of the interstitial regions of a second region of the at least partially leached polycrystalline diamond table, wherein the second region exhibits a coercivity of about 115 Oe to about 250 Oe and a specific magnetic saturation of greater than 0 G·cm 3 /g to about 15 G·cm 3 /g; and

bonding the infiltrated polycrystalline diamond table to the substrate.

10. The method of claim 9 wherein the at least partially leached polycrystalline diamond table includes an upper surface from which the first region extends and a back surface from which the second region extends.

11. The method of claim 9 wherein the first region includes a residual amount of metallic catalyst present in an amount of about 0.8 weight % to about 1.5 weight %.

12. The method of claim 9 wherein the first region is spaced from the substrate by a standoff.

13. The method of claim 9 wherein the first region extends about the second region.

14. The method of claim 13 wherein the first region is generally annular.

15. The method of claim 9 wherein the coercivity is about 115 Oe to about 175 Oe and the specific magnetic saturation is about 5 G·cm 3 /g to about 15 G·cm 3 /g.

16. The method of claim 9 wherein the coercivity is about 155 Oe to about 175 Oe and the specific magnetic saturation is about 10 G·cm 3 /g to about 15 G·cm 3 /g.

Assignments (6)
SECURITY INTEREST Recorded Jul 18, 2025
From: US SYNTHETIC CORPORATION
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 074973/0089 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 17, 2025
From: JPMORGAN CHASE BANK, N.A.
To: CHAMPIONX LLC; APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP; HARBISON-FISCHER, INC.; NORRIS RODS, INC.,; NORRIS RODS, INC.,; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; US SYNTHETIC CORPORATION
Reel/Frame 072004/0019 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 12, 2025
From: JONES, PAUL DOUGLAS; BERTAGNOLLI, KENNETH E.; MUKHOPADHYAY, DEBKUMAR
To: US SYNTHETIC CORPORATION
Reel/Frame 070489/0193 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
SECURITY AGREEMENT Recorded Nov 6, 2019
From: APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 050941/0695 →