Atomic layer deposition apparatus
A thin film deposition system for depositing a thin film on a moveable substrate using atmospheric pressure atomic-layer deposition includes a chamber and a moveable substrate having a levitation stabilizing structure located on the moveable substrate that defines an enclosed interior impingement area of the moveable substrate. A stationary support, located in the chamber, supports the moveable substrate. The stationary support extends beyond the enclosed interior impingement area. A pressurized-fluid source provides a fluid flow through the stationary support that impinges on the moveable substrate within the enclosed interior impingement area of the moveable substrate sufficient to levitate the moveable substrate and expose the moveable substrate to the fluid while restricting the lateral motion of the moveable substrate with the levitation stabilizing structure.
1. A thin film deposition system for depositing a thin film on a moveable substrate using atmospheric pressure atomic-layer deposition, comprising:
a chamber;
a moveable substrate having a levitation stabilizing structure attached to and protruding from the moveable substrate that defines an enclosed interior impingement area of the moveable substrate;
a stationary support located in the chamber proximate to the moveable substrate, the stationary support extending beyond the enclosed interior impingement area; and
a pressurized-fluid source that provides a fluid flow through the stationary support that impinges on the moveable substrate within the enclosed interior impingement area of the moveable substrate sufficient to levitate the moveable substrate away from the stationary support due to a Bernoulli lift force caused by the impingement of the fluid flow onto the moveable substrate and expose the moveable substrate to the fluid, wherein fluid flow impinging on the levitation stabilizing structure restricts the lateral motion of the moveable substrate during levitation.
2. The system of claim 1 , wherein the fluid flow provided through the stationary support impinges proximate to a centroid of a surface of the moveable substrate.
3. The system of claim 1 , wherein the fluid flow provided through the stationary support impinges proximate to a centroid of the enclosed interior impingement area of the moveable substrate.
4. The system of claim 1 , wherein the stationary support is located beneath the moveable substrate.
5. The system of claim 1 , wherein the stationary support is located above the moveable substrate.
6. The system of claim 1 , further comprising a temperature-control mechanism that controls the temperature of at least one of the fluid and the moveable substrate.
7. The system of claim 1 , further comprising an exhaust port that exhausts the fluid flow from the chamber.
8. The system of claim 1 , the stationary support including a fluid collimating conduit through which the fluid flows, wherein the fluid collimating conduit has a cross sectional area that is less than or equal to ¼ of the area enclosed by the levitation stabilizing structure.
9. The system of claim 1 , the stationary support including a fluid collimating conduit through which the fluid flows, wherein the fluid collimating conduit has a cross sectional area that is less than or equal to ¼ of the area of the surface of the moveable substrate on which levitation stabilizing structure is located.
10. The system of claim 1 , the stationary support including a fluid collimating conduit through which the fluid flows, wherein the fluid collimating conduit has a cross section that is circular, oval, or polygonal.
11. The system of claim 1 , wherein the levitation stabilizing structure has a height extending away from the moveable substrate that is less than ⅔ of the distance between the moveable substrate and the stationary support when the moveable substrate is levitated.
12. The system of claim 1 , wherein the levitation stabilizing structure has a constant height.
13. The system of claim 1 , further comprising a flow control structure positioned in the chamber proximate to the stationary support that controls the exhaust of fluid.
14. The system of claim 1 , wherein the stationary support extends beyond the moveable substrate.
15. The system of claim 1 , wherein the stationary support through which the fluid flows is porous.
16. The system of claim 1 , the stationary support including a fluid collimating conduit through which the fluid flows, wherein a surface of the stationary support through which the fluid flows is made of a non-porous material.
17. A thin film deposition system for depositing a thin film on a moveable substrate using atmospheric pressure atomic-layer deposition, comprising:
a chamber;
a moveable substrate having a levitation stabilizing structure attached to and protruding from the moveable substrate that defines an enclosed interior impingement area of the moveable substrate;
a stationary support located in the chamber proximate to the moveable substrate, the stationary support extending beyond the enclosed interior impingement area; and
a pressurized-fluid source that provides a fluid flow through the stationary support that impinges on the moveable substrate within the enclosed interior impingement area of the moveable substrate sufficient to levitate the moveable substrate and expose the moveable substrate to the fluid while restricting the lateral motion of the moveable substrate with the levitation stabilizing structure;
wherein the moveable substrate further includes an additional structure located within the enclosed interior impingement area of the levitation stabilizing structure.
18. The system of claim 17 , wherein the additional structure has a height that is less than the height of the levitation stabilizing structure.
19. The system of claim 17 , wherein the additional structure is solid.
20. The system of claim 17 , wherein the additional structure forms a closed curve.