IP Library Granted Patent US 9,276,086
Granted Patent B2
US 9,276,086 · App. 14/623,693 · Granted Mar 1, 2016

Thin film transistor substrate and method of manufacturing the same

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Quick Facts
Patent No.
US 9,276,086
App. No.
14/623,693
Granted
Mar 1, 2016
Kind
B2
Abstract

A thin film transistor substrate includes a base substrate, an active pattern disposed on the base substrate, a gate insulation pattern disposed on the active pattern, a gate electrode disposed on the gate insulation pattern and overlapping the channel, and a light-blocking pattern disposed between the base substrate and the active pattern and having a size greater than the active pattern. The active pattern includes a source electrode, a drain electrode, and a channel disposed between the source electrode and the drain electrode.

Claims (15)

1. A method of manufacturing a thin film transistor substrate, the method comprising:

providing a light-blocking layer on a base substrate;

providing a semiconductor layer on the light-blocking layer;

patterning the semiconductor layer to form a semiconductor pattern;

sequentially providing a gate insulation layer and a gate metal layer on the semiconductor pattern;

patterning the gate metal layer to form a gate electrode;

patterning the gate insulation layer to form a gate insulation pattern; and

patterning the light-blocking layer by using the gate electrode and the semiconductor pattern as a mask, to form a light-blocking pattern having a planar size greater than a planar size of the semiconductor pattern.

2. The method of claim 1 , wherein the forming the gate insulation pattern exposes portions of the semiconductor pattern;

further comprising providing a plasma to the exposed portions of the semiconductor pattern to form a source electrode and a drain electrode.

3. The method of claim 2 , further comprising:

providing a data line on the base substrate before the providing the light-blocking layer; and

providing a data insulation layer covering the data line.

4. The method of claim 2 , further comprising:

providing a buffer layer on the light-blocking layer, before the providing the semiconductor layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2026
From: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
To: LONESTAR CRYSTAL DISPLAY LLC
Reel/Frame 074944/0730 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2022
From: SAMSUNG DISPLAY CO., LTD.
To: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 060778/0543 →