RF shield assembly

1. An electronic device comprising:

an outer casing;

a printed circuit board within the outer casing;

a radiofrequency shield on the printed circuit board that surrounds an interior part of an electronic component or that surrounds the electronic component, the radiofrequency shield having walls, in which the walls have ridges or indents;

a shield cover disposed on the radiofrequency shield, the shield cover having a top portion and side portions that extend downward from the top portion, the side portions being parallel to the walls; and

for at least one side portion of the side portions, at least one attachment spring extending from the at least one side portion, the at least one attachment spring having an upper bend part that extends outward from the at least one side portion to a peak and a middle bend part that extends inward from the peak to a contact part, the contact part engaging the ridges or indents to secure the shield cover to the radiofrequency shield.

2. The electronic device of claim 1 wherein the side portions are at a distance to the walls less than a thickness of the side portions.

3. The electronic device of claim 1 further comprising at least one interior wall that forms interior closed rooms with at least one other interior wall or at least one of the walls.

4. The electronic device of claim 2 wherein the interior part of an electronic component or the electronic component is an F-connector.

5. The electronic device of claim 4 wherein:

one of the walls is a back wall of the radiofrequency shield and is parallel to a chassis rear wall of the outer casing; and

the F-connector extends from within the radiofrequency shield through the back wall of the radiofrequency shield and through the chassis rear wall.

6. The electronic device of claim 5 wherein the at least one attachment spring is positioned adjacent the F-connector along the back wall and extends down to and contacts a ground on the printed circuit board.

7. The electronic device of claim 5 wherein the at least one attachment spring is positioned adjacent the F-connector along the back wall and has distal ends that contact the chassis rear wall.

8. The electronic device of claim 5 wherein the at least one attachment spring is positioned adjacent the F-connector along the back wall and extends down to distal ends past the contact part, the distal ends contacting a ground on the printed circuit board and the chassis rear wall.

9. The electronic device of claim 7 wherein the at least one attachment spring extends down further than another at least one attachment spring positioned along another of the walls.

10. An electronic device comprising:

a chassis wall having an aperture;

a circuit board that extends toward the chassis wall;

an F-connector connected to the circuit board and extending out of the chassis wall through the aperture;

an inner shield mounted on the circuit board on an interior side of the chassis wall and connected to the F-connector, wherein the inner shield comprises a series of peripheral walls and the series of peripheral walls have ridges;

a shield cover that covers the inner shield, wherein the shield cover comprises a top portion and side portions that extend from a periphery of the top portion and downward along the series of peripheral walls, the side portions contacting the peripheral walls or being at a distance to the peripheral walls less than a depth or a dimension protrusion of the ridges; and

attachment springs extending from the side portions, the attachment springs having an upper bend part that extends outward from the side portion to a peak, a middle bend part that extends inward from the peak to a contact part, the contact part engaging the ridges to secure the shield cover to the inner shield.

11. The electronic device of claim 10 wherein the attachment springs are positioned adjacent the F-connector along one of the peripheral walls and extend down to and contact a ground on the circuit board.

12. The electronic device of claim 10 wherein the attachment springs are positioned adjacent the F-connector along one of the peripheral walls and have distal ends that contact the chassis wall.

13. The electronic device of claim 10 wherein the attachment springs are positioned adjacent the F-connector along one of the peripheral walls and extend down to distal ends past the contact part, the distal ends contacting a ground on the circuit board and the chassis wall.

14. The electronic device of claim 13 wherein the attachment springs are positioned adjacent the F-connector and extend down further than the attachment springs positioned along others of the peripheral walls.

15. The electronic device of claim 10 wherein one attachment spring of the attachment springs is positioned adjacent the F-connector along one of the peripheral walls and extends down to a curved distal end past the contact part, the curved distal end having a convex side contacting a ground on the printed circuit board and the chassis wall.

16. The electronic device of claim 15 wherein the one attachment spring extends down further than the attachment springs positioned along others of the peripheral walls.

17. The electronic device of claim 10 wherein one attachment spring of the attachment springs is positioned adjacent the F-connector along one of the peripheral walls and extends down to a curved distal end past the contact part; and

the ridge to which the attachment spring is positioned adjacent the F-connector engages is positioned closer to the circuit board than the top portion.

18. The electronic device of claim 10 wherein one attachment spring of the attachment springs is positioned adjacent the F-connector along one of the peripheral walls and extends down to a distal end past the contact part; and

the ridge to which the attachment spring is positioned adjacent the F-connector engages is positioned closer to the circuit board than the top portion and the ridges on others of the peripheral walls are closer to the top portion than the printed circuit board.

19. A method of constructing a electronic device comprising the steps of:

providing or forming a tuner shield in which the tuner shield has exterior walls and attachment ridges on the exterior walls;

positioning the tuner shield on a printed circuit board having at least one first electronic component and at least one second electronic component such that the at least one first electronic component is contained in the tuner shield;

attaching the tuner shield to the printed circuit board;

providing or forming a shield cover having attachment springs for engaging to the attachment ridges, the shield cover having a top portion from which side portions extend downward, the attachment springs extend down from side portions, the attachment springs having an upper bend part that extends outward from the side portion to a peak, a middle bend part that extends inward from the peak to a contact part for engaging the attachment ridges to secure the shield cover to the radiofrequency shield;

pressing the shield cover onto the tuner shield to engage the attachment springs with the attachment ridges; and

closing a chassis that contains the tuner shield on the printed circuit board.