Modular cooling system
View Patent ↗An exemplary modular cooling system for cooling a plurality of electronic components is provided. The cooling system includes a plurality of cooling modules and a clamping arrangement. Each cooling module includes an evaporator unit, a condenser, a first pipe system, and a second pipe system. The clamping arrangement is adapted for holding and pressing an alternation stack in which the evaporator units are stacked in alternation with the power electronic components.
1. A modular cooling system for cooling a plurality of power electronic components, the cooling system comprising:
a plurality of cooling modules, wherein each of the cooling modules includes:
an evaporator unit adapted for receiving heat from a corresponding one of the power electronic components, the evaporator unit having an inlet for receiving a liquid cooling fluid, an evaporator body for evaporating the cooling fluid by the heat, and an outlet for output of the vaporized cooling fluid;
a condenser having an inlet for receiving the vaporized cooling fluid, a condenser body for condensing the cooling fluid, and an outlet for output of the condensed liquid cooling fluid;
a first pipe system connecting the outlet of the evaporator unit with the inlet of the condenser; and
a second pipe system connecting the outlet of the condenser with the inlet of the evaporator unit,
wherein each of the cooling modules forms a respective individual cooling fluid circuit separate from the cooling fluid circuits of the other cooling modules of the cooling system, with adjacent condensers of the cooling modules being electrically insulated from one another,
wherein the condenser of each cooling module includes at least one coolant medium passageway for an external coolant medium, wherein the at least one coolant medium passageway defines a flow direction for the external coolant medium transverse to the stacking direction of the alternating stack, and
wherein the evaporator units are stacked alternately with the power electronic components in a stacking direction in an alternating stack.
2. The modular cooling system according to claim 1 , comprising:
ventilation means for forcing the external coolant medium along the flow direction.
3. The modular cooling system according to claim 1 , wherein the flow direction for the external coolant medium is perpendicular to the stacking direction of the alternating stack.
4. The modular cooling system according to claim 1 , wherein the first and second pipe system of each cooling module includes flexible portions that allow a relative movement between the evaporator units and the corresponding condensers in the stacking direction.
5. The modular cooling system according to claim 1 , wherein the condenser of each cooling module has a coolant medium-intake side and a coolant medium-exit side, and wherein a portion of the first pipe system of each cooling module is disposed to pass along the coolant medium-exit side of the corresponding condenser.
6. The modular cooling system according to claim 1 , comprising:
a condenser-connection arrangement for mechanically connecting the condensers to one another such that the condensers are lined up in the stacking direction and arranged in a common plane.
7. The modular cooling system according to claim 1 , wherein the condenser-connection arrangement includes an electrically insulated frame structure configured for attaching the condensers removably thereto.
8. The modular cooling system according to claim 1 , wherein a length, in the stacking direction, of the electrically insulated frame structure is adjustable to fit a preselected number of cooling modules.
9. The modular cooling system according to claim 1 , wherein a width of the evaporator unit as measured in the stacking direction is less than a width of the corresponding condenser as measured in a direction parallel to the stacking direction, and wherein a clamping arrangement is adapted for the power electronic component having a width such that a combined width of the evaporator unit and the power electronic component equals the displacement between the corresponding condenser and a neighbouring condenser.
10. The modular cooling system according to claim 2 , wherein the condenser of each cooling module has a coolant medium-intake side and a coolant medium-exit side, and wherein a portion of the first pipe system of each cooling module is disposed to pass along the coolant medium-exit side of the corresponding condenser.
11. The modular cooling system according to claim 2 , comprising:
a condenser-connection arrangement for mechanically connecting the condensers to one another such that the condensers are lined up in the stacking direction and arranged in a common plane.
12. The modular cooling system according to claim 2 , wherein the condenser-connection arrangement includes an electrically insulated frame structure configured for attaching the condensers removably thereto.
13. The modular cooling system according to claim 2 , wherein a length, in the stacking direction, of the electrically insulated frame structure is adjustable to fit a preselected number of cooling modules.
14. The modular cooling system according to claim 2 , wherein a width of the evaporator unit as measured in the stacking direction is less than a width of the corresponding condenser as measured in a direction parallel to the stacking direction, and wherein a clamping arrangement is adapted for the power electronic component having a width such that a combined width of the evaporator unit and the power electronic component equals the displacement between the corresponding condenser and a neighbouring condenser.
15. The modular cooling system according to claim 1 , wherein the system is arranged for passing an external coolant medium through the at least one coolant medium passageway of at least one of the condensers, thereby transferring heat from the respective condenser to the external coolant medium in an operating state of the modular cooling system, and thereafter passing the heated external coolant medium along a portion of the first pipe system disposed downstream of a corresponding condenser.
16. The modular cooling system according to claim 4 , comprising:
a condenser-connection arrangement for mechanically connecting the condensers to one another such that the condensers are lined up in the stacking direction and arranged in a common plane.
17. The modular cooling system according to claim 4 , wherein the condenser-connection arrangement includes an electrically insulated frame structure configured for attaching the condensers removably thereto.
18. The modular cooling system according to claim 4 , wherein a length, in the stacking direction, of the electrically insulated frame structure is adjustable to fit a preselected number of cooling modules.
19. The modular cooling system according to claim 4 , wherein a width of the evaporator unit as measured in the stacking direction is less than a width of the corresponding condenser as measured in a direction parallel to the stacking direction, and wherein a clamping arrangement is adapted for the power electronic component having a width such that a combined width of the evaporator unit and the power electronic component equals the displacement between the corresponding condenser and a neighbouring condenser.
20. A power electronic unit comprising:
the modular cooling system according to claim 1 ; and
a plurality of power electronic components,
wherein a clamping arrangement holds and presses the alternating stack in which the evaporator units are alternately stacked with the power electronic components in the stacking direction.