Granted Patent B2

US 9,814,145 · App. 14/631,192 · Granted Nov 7, 2017

Abstract

Claims (12)

1. A method for forming a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:

filling a first cavity having a tapered surface with a body material to form a tapered end portion of the Z-directed component;

providing a first layer of a constraining material on top of the first cavity, the first layer of the constraining material having a second cavity having a width that is smaller than a width of the first cavity;

filling the second cavity with the body material;

providing successive layers of the constraining material on top of the first layer of the constraining material, each of the successive layers of the constraining material having an additional cavity defining an outer shape of a corresponding layer of a main body portion of the Z-directed component;

selectively filling the additional cavities of the successive layers of the constraining material with at least the body material to form the corresponding layers of the main body portion of the Z-directed component;

dissipating the constraining material to release the Z-directed component from the constraining material; and

firing the Z-directed component.

2. The method of claim 1 , wherein the first cavity includes a protrusion on a bottom surface thereof that forms a corresponding indentation in an end surface of the tapered end portion of the Z-directed component for engaging a tool for removing the tapered end portion of the Z-directed component.

3. The method of claim 1 , further comprising forming the first cavity in a substrate that supports the layers of the constraining material.

4. The method of claim 1 , further comprising forming the first cavity in a release layer coated on a substrate that supports the layers of the constraining material.

5. The method of claim 4 , further comprising forming the first cavity in the release layer by gray scale lithography.

Assignments (8)