Resistive random access memory device and method for manufacturing the same
According to one embodiment, a resistive random access memory device includes a first electrode and a second electrode. The resistive random access memory device also includes a resistance change layer connected between the first electrode and the second electrode. The resistive random access memory device also includes a conductive layer connected in series to the resistance change layer between the first electrode and the second electrode. The resistive random access memory device in which the conductive layer includes a plurality of first material layers including a first material and a plurality of second material layers including a second material which is different from the first material.
1. A resistive random access memory device, comprising:
a first interconnection extending in a first direction;
a barrier metal layer of tungsten nitride provided on the first interconnection;
a stacked body layer provided on the barrier metal layer, the stacked body layer comprising
a first material layer including a first material, the first material layer being different from a material of the barrier metal layer, and
a second material layer including a second material which is different from the first material and the material of the barrier metal layer;
a first layer provided directly on the stacked body layer, the first layer including tungsten;
a resistance change layer provided on the first layer and comprising a germanium tellurium antimony;
a second interconnection provided above the resistance change layer and extending in a second direction intersecting the first direction; and
a second layer including tungsten being disposed between the resistance change layer and the second interconnection,
a length of the first interconnection in the first direction being longer than a length of the resistance change layer in the first direction,
a length of the second interconnection in the second direction being longer than a length of the resistance change layer in the second direction, and
the stacked body layer being disposed between the barrier metal layer and the first layer in a third direction, the third direction being orthogonal to the first direction and the second direction,
wherein the first layer completely covers a lower surface of the resistance change layer and the second layer completely covers an upper surface of the resistance change layer.
2. The device according to claim 1 , wherein the stacked body layer has resistivity higher than the resistivity of the first interconnection.
3. The device according to claim 1 , wherein the first material includes a metal element.
4. The device according to claim 1 , wherein the first material includes nitrogen.
5. The device according to claim 1 , wherein the first material includes one or more selected from the group consisting of silicon, titanium, tantalum, zirconium, aluminum, hafnium, molybdenum, tungsten, and vanadium, and
the second material includes a nitride or an oxide of one or more selected from the group consisting of silicon, titanium, tantalum, zirconium, aluminum, hafnium, molybdenum, tungsten, and vanadium.
6. The device according to claim 1 , wherein the first material includes silicon.
7. The device according to claim 1 , wherein the first material includes aluminum, and the second material comprises an aluminum nitride.
8. The device according to claim 1 , wherein the resistance change layer comprises:
a metal layer including a germanium tellurium antimony; and
a variable resistance layer, which has resistivity higher than resistivity of the metal layer, and in which the metal element included in the metal layer can move.
9. The device according to claim 1 , further comprising another second material layer and another first material layer, and wherein one of the first material layers is in contact with two of the second material layers and is disposed between the two of the second material layers.
10. The device according to claim 1 , wherein the stacked body layer, the first layer, the resistance change layer, and the second layer form a pillar.
11. The device according to claim 1 , wherein the barrier metal layer directly contacts the first interconnection.
12. A resistive random access memory device, comprising:
a first interconnection extending in a first direction;
a barrier metal layer provided on the first interconnection, the barrier metal layer including a first material, the first material being tungsten nitride;
a first material layer provided on the barrier metal layer, the first material layer including a second material different from the first material;
a second material layer provided on the first material layer including a third material different from the first material and the second material;
a first layer provided above the second material layer, the first layer including the first material;
a resistance change layer provided on the first layer and including a germanium tellurium antimony;
a second interconnection provided above the resistance change layer and extending in a second direction intersecting the first direction;
and
a second layer including tungsten being disposed between the resistance change layer and the second interconnection,
a length of the first interconnection in the first direction being longer than a length of the resistance change layer in the first direction,
a length of the second interconnection in the second direction being longer than a length of the resistance change layer in the second direction,
wherein the first layer completely covers a lower surface of the resistance change layer and the second layer completely covers an upper surface of the resistance change layer.
13. The device according to claim 12 , wherein the first material is tungsten.
14. The device according to claim 12 , wherein the barrier metal layer and the first layer include tungsten nitride.
15. The device according to claim 12 further comprising: a third material layer provided on the second material layer including the second material.
16. The device according to claim 15 wherein the first layer is provided on the third material layer.
17. The device according to claim 15 , wherein the first material layer, the second material layer, and the third material layer, the first layer, the resistance change layer, and the second layer form a pillar.
18. The device according to claim 15 , wherein the first material layer, the second material layer and the third material layer consist of a stacked body layer, and the second material layer has resistivity higher than the resistivity of the first interconnection.
19. The device according to claim 12 , wherein the second material layer has resistivity higher than the resistivity of the first interconnection.
20. The device according to claim 12 , wherein the first material includes a metal element.
21. The device according to claim 12 , wherein the first material includes one or more selected from the group consisting of silicon, titanium, tantalum, zirconium, aluminum, hafnium, molybdenum, tungsten, and vanadium, and
the third material comprises a nitride or an oxide of one or more selected from the group consisting of silicon, titanium, tantalum, zirconium, aluminum, hafnium, molybdenum, tungsten, and vanadium.
22. The device according to claim 12 , wherein the second material includes silicon.
23. The device according to claim 12 , wherein the second material include aluminum, and
the third material includes an aluminum nitride.
24. The device according to claim 23 , wherein the resistance change layer comprises:
a metal layer including a germanium tellurium antimony; and
a variable resistance layer, which has resistivity higher than resistivity of the metal layer, and in which the metal element included in the metal layer can move.
25. The device according to claim 12 , wherein the barrier metal layer directly contacts the first interconnection.