Method of manufacturing an intermediate product for an interposer and intermediate product for an interposer
View Patent ↗A method of manufacturing an intermediate product for an interposer including a glass substrate having a plurality of through holes is provided. The method includes a step of forming a resin layer on a support substrate, and a step of forming a laminated body by adhering the glass substrate having the plurality of through holes on the resin layer. The glass substrate having the plurality of through holes has a thickness within a range of 0.05 mm to 0.3 mm.
1. A method of manufacturing an intermediate product for an interposer, the method comprising:
forming a resin layer on a support substrate comprising glass or a metal; and
adhering a glass substrate having a plurality of through holes on the resin layer,
wherein the glass substrate has a thickness of from 0.05 mm to 0.3 mm.
2. The method according to claim 1 , wherein the through holes are formed by irradiating laser light on a glass substrate.
3. The method according to claim 1 , wherein a maximum size of an opening of at least one of the through holes at a surface of the glass substrate on an opposite side of the resin layer is of from 5 μm to 100 μm.
4. The method according to claim 1 , wherein the through holes are formed on the glass substrate at a pitch of from 10 μm to 500 μm.
5. The method according to claim 1 , wherein the forming of the resin layer comprises applying a resin composition on the support substrate and solidifying the resin composition.
6. The method according to claim 1 , wherein the resin layer has release characteristics with respect to the glass substrate.
7. The method according to claim 1 , wherein the resin layer comprises at least one of a curable silicone resin and an acrylic resin that develops release characteristics upon irradiation with ultraviolet light.
8. The method according to claim 1 , further comprising:
filling at least one of the through holes of the glass substrate with a conductive material after the adhering of the glass substrate on the resin layer.
9. The method according to claim 8 , further comprising:
forming a conductive wiring pattern on a surface of the glass substrate on an opposite side of the resin layer,
wherein the conductive wiring pattern is electrically connected to the conductive material filled in the at least one of the through holes.
10. The method according to claim 8 , further comprising:
separating the resin layer and the glass substrate from each other.
11. The method according to claim 1 , wherein the interposer is the glass substrate having the through holes.
separating the resin layer and the glass substrate from each other.
12. An intermediate product for an interposer, comprising:
a glass substrate having a plurality of through holes;
a support substrate comprising glass or a metal; and
a resin layer formed between the support substrate and the glass substrate,
wherein the glass substrate has a thickness of from 0.05 mm to 0.3 mm.
13. The intermediate product according to claim 12 , wherein a maximum size of an opening of at least one of the through holes at a surface of the glass substrate on an opposite side of the resin layer is of from 5 μm to 100 μm.
14. The intermediate product according to claim 12 , wherein the through holes are formed on the glass substrate at a pitch of from 10 μm to 500 μm.
15. The intermediate product according to claim 12 , wherein the resin layer has release characteristics with respect to the glass substrate.
16. The intermediate product according to claim 12 , wherein the resin layer includes at least one of a curable silicone resin and an acrylic resin that develops release characteristics upon being irradiated with ultraviolet light.
17. The intermediate product according to claim 12 , wherein the resin layer has a thickness of from 1 μm to 50 μm.
18. The intermediate product according to claim 12 , wherein the through holes of the glass substrate are filled with a conductive material.
19. The intermediate product according to claim 18 , further comprising:
a conductive wiring pattern formed on a surface of the glass substrate on an opposite side of the resin layer and is electrically connected to the conductive material filled in at least one of the through holes.
20. The intermediate product according to claim 12 , wherein the support substrate has a thickness of from 0.3 mm to 1.1 mm.
21. The intermediate product according to claim 12 , wherein the glass substrate has a thermal expansion coefficient of from 3×10 −6 /K to 1×10 −5 K.