IP Library Granted Patent US 9,590,619
Granted Patent B2
US 9,590,619 · App. 14/631,362 · Granted Mar 7, 2017

Gate drive circuit with a voltage stabilizer and a method

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Quick Facts
Patent No.
US 9,590,619
App. No.
14/631,362
Granted
Mar 7, 2017
Kind
B2
Abstract

A gate drive circuit creates a bipolar voltage to a gate of an IGB power transistor, and compensates for Miller currents of the IGB power transistor. The compensating is performed by a switching element connected in series with a capacitor between the gate (X 4 ) and a supply voltage.

Claims (32)

1. A gate drive circuit with an active gate voltage stabilizer, comprising:

means for creating a bipolar voltage to a gate of an IGB power transistor; and

means for compensating for Miller currents of the IGB power transistor, the means for compensating being formed by a switching element connected in series with a capacitor between the gate and a supply voltage input;

wherein a switching voltage of the switching element is controlled by two resistances; and

wherein one of the two resistances is connected between a source and gate of the switching element, and is an NTC-resistor.

2. The gate drive circuit according to claim 1 , wherein the means for compensating comprises:

a ceramic capacitor as the capacitor, and a power MOSFET as the switching element connected in series.

3. The gate drive circuit according to claim 1 , wherein the means for compensating is connected between a positive supply voltage and the gate of the IGB transistor.

4. The gate drive circuit according to claim 1 , wherein the switching element is a varistor or transient suppressor.

5. A method for controlling an IGB power transistor with a gate drive circuit, which method comprises:

creating a bipolar voltage to a gate of the IGB power transistor;

compensating for Miller currents of the IGB power transistor with a switching element connected in series with a capacitor between the gate and supply voltage input; and

controlling a switching voltage of the switching element by two resistances;

wherein one of the two resistances is a resistor connected between a source and gate of the switching element, and is an NTC-resistor.

6. The method according to claim 5 , whereby the compensating is performed by a ceramic capacitor as the capacitor, and a power MOSFET as the switching element connected in series.

7. The method according to claim 6 , wherein the switching element and capacitor are connected between a positive supply voltage of the supply voltage input and the gate of the IGB transistor.

8. The method according to claim 5 , wherein the switching element is a varistor or transient suppressor.

9. The method according to claim 5 , wherein the compensating is performed after an actual switching event, when a temperature load of a chip housing the IGB power transistor has started to decrease and the chip is recovering from the switching event.

10. The method according to claim 9 , wherein a decreasing edge of a temperature load curve is adjusted such that a decreasing edge of at least a heated portion of the chip decreases faster than a corresponding edge of an unheated cold module.

11. The method according to claim 9 , comprising:

compensating thermal cycling by changing voltage losses in a conducting state of the IGBT power transistor even though control occurs during a state change of the IGBT power transistor.

12. The gate drive circuit according to claim 2 , wherein the means for compensating is connected between a positive supply voltage and the gate of the IGB transistor.

13. The gate drive circuit according to claim 12 , wherein the switching element is a varistor or transient suppressor.

14. The method according to claim 5 , wherein the compensating is performed after an actual switching event, when a temperature load of a chip housing the IGB power transistor has started to decrease and the chip is recovering from the switching event.

15. The method according to claim 10 , comprising:

compensating thermal cycling by changing voltage losses in a conducting state of the IGBT power transistor even though control occurs during a state change of the IGBT power transistor.

16. The method according to claim 5 , wherein the switching element and capacitor are connected between a positive supply voltage of the supply voltage input and the gate of the IGB transistor.

17. The method according to claim 6 , wherein the switching element is a varistor or transient suppressor.

18. The method according to claim 6 , wherein the compensating is performed after an actual switching event, when a temperature load of a chip housing the IGB power transistor has started to decrease and the chip is recovering from the switching event.

19. The method according to claim 18 , wherein a decreasing edge of a temperature load curve is adjusted such that a decreasing edge of at least a heated portion of the chip decreases faster than a corresponding edge of an unheated cold module.

20. The method according to claim 19 , comprising:

compensating thermal cycling by changing voltage losses in a conducting state of the IGBT power transistor even though control occurs during a state change of the IGBT power transistor.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2018
From: ABB OY
To: ABB SCHWEIZ AG
Reel/Frame 047801/0174 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 18, 2015
From: KITTILA, JUKKA-PEKKA; NIEMI, MIKA; SAARINEN, MIKKO
To: ABB OY
Reel/Frame 036347/0296 →