Semiconductor memory

1. A semiconductor memory comprising:

a first memory string including a first selection transistor above a semiconductor substrate, a second selection transistor above the first selection transistor, first memory cells above the second selection transistor, and a third selection transistor above the first memory cells;

a second memory string including a fourth selection transistor, a fifth selection transistor above the fourth selection transistor, second memory cells above the fifth selection transistor, and a sixth selection transistor above the second memory cells;

a first line connected to gate electrodes of the first selection transistor and the fourth selection transistor;

a second line connected to a gate electrode of the second selection transistor;

a third line, different from the second line, connected to a gate electrode of the fifth selection transistor;

a first voltage generation circuit configured to generate a first voltage to the first line;

a second voltage generation circuit configured to generate a second voltage to the second line;

a control circuit configured to independently control the application of the first and second voltages; and

a row decoder including a block decoder and a plurality of transfer transistors, the transfer transistors including a first transistor, a second transistor, a third transistor, and a fourth transistor, one ends of the first and second transistors being connected to the first line, one ends of the third and fourth transistors being connected to the second line, a gate of the first transistor being connected to a gate of the third transistor, and a gate of the second transistor being connected to a gate of the fourth transistor.

2. The memory according to claim 1 , wherein, during a read operation of a first memory cell, the control circuit is configured to apply a first voltage to the first line, and apply a second voltage to the second line, the first voltage being higher than the second voltage.

3. The memory according to claim 2 , further comprising:

a source line connected to first ends of the memory strings;

a first bit line connected to a second end of the first memory string;

a second bit line connected to a second end of the second memory string; and

multiple word lines, each of which is commonly connected to a gate electrode of one of the first memory cells and a gate electrode of one of the second memory cells.

4. The memory according to claim 1 , wherein, during a write operation of a first memory cell, the control circuit is configured to apply a zero voltage to the first line and the second line.

5. The memory according to claim 1 , wherein, during an erase operation, the control circuit is configured to apply a third voltage to the first line and to apply a fourth voltage to the second line, the third voltage and the fourth voltage being different from the zero voltage.

6. The memory according to claim 1 , further comprising:

a substrate contact formed in a diffusion region of the semiconductor substrate of a first conductivity type; and

a source line contact formed in a diffusion region of the semiconductor substrate of a second conductivity type, between the first and second memory strings, wherein

during an erasing operation, the control circuit applies an erasing voltage to the substrate contact and the source line contact, applies the first voltage to the first line, and applies the second voltage to the second line.

7. The memory according to claim 6 , wherein the second voltage is different from the first voltage and is lower than the erasing voltage.

8. The memory according to claim 1 , wherein

the first selection transistor has a first channel region in the semiconductor substrate and a second channel region in a first semiconductor pillar, the first semiconductor pillar extending above the semiconductor substrate, and

the second selection transistor has a channel region in the first semiconductor pillar.

9. A semiconductor memory comprising:

first and second semiconductor pillars extending above a semiconductor substrate;

a first memory string including a first selection gate transistor having a first channel region in the semiconductor substrate and a second channel region in the first semiconductor pillar, a second selection gate transistor above the first selection gate transistor having a channel region in the first semiconductor pillar, memory cells above the second selection gate transistor having channel regions in the first semiconductor pillar, and a third selection gate transistor above the multiple memory cells having a channel region in the first semiconductor pillar;

a second memory string including a first selection gate transistor having a first channel region in the semiconductor substrate and a second channel region in the second semiconductor pillar, a second selection gate transistor above the first selection gate transistor having a channel region in the second semiconductor pillar, memory cells above the second selection gate transistor having channel regions in the second semiconductor pillar, and a third selection gate transistor above the multiple memory cells having a channel region in the second semiconductor pillar;

a first source side selection gate line connected to a gate electrode of the first selection gate transistor of the first memory string;

a second source side selection gate line connected to a gate electrode of the first selection gate transistor of the second memory string;

a third source side selection gate line connected to a gate electrode of the second selection gate transistor of the first memory string;

a fourth source side selection gate line connected to a gate electrode of the second selection gate transistor of the second memory string;

a first drain side selection gate line connected to a gate electrode of the third selection gate transistor of the first memory string;

a second drain side selection gate line connected to a gate electrode of the third selection gate transistor of the second memory string;

a first voltage generation circuit configured to generate a first voltage to be applied in common to the first and second source side selection gate lines; and

a second voltage generation circuit configured to generate a second voltage to be applied to the third and fourth source side selection gate lines.

10. The memory according to claim 9 , further comprising:

a control circuit configured to independently control the application of the first and second voltages.

11. The memory according to claim 10 , wherein, during a read operation of a memory cell in the first memory string, the control circuit causes the first selection gate transistor of the first and second memory strings to turn ON, the second selection gate transistor of the first memory string to turn ON, and the second selection gate transistor of the second memory string to turn OFF.

12. The memory according to claim 11 , further comprising:

a source line contact above the semiconductor substrate between the first and second memory strings;

a source line connected to first ends of the memory strings through the source line contact and diffusion regions in the semiconductor substrate;

a first bit line connected to a second end of the first memory string through the first semiconductor pillar;

a second bit line connected to a second end of the second memory string through the second semiconductor pillar; and

multiple word lines, each of which is commonly connected to a gate electrode of one of the memory cells in the first string and a gate electrode of one of the memory cells in the second string, wherein

during the read operation of the memory cell in the first memory string, a current flows through the source line contact, the semiconductor substrate, and the first semiconductor pillar.

13. The memory according to claim 9 , further comprising:

a substrate contact formed in a diffusion region of the semiconductor substrate of a first conductivity type; and

a source line contact formed in a diffusion region of the semiconductor substrate of a second conductivity type, between the first and second memory strings, wherein

during an erasing operation, the control circuit applies an erasing voltage to the substrate contact and the source line contact, applies the first voltage from the first voltage circuit to the first and second source side selection gate lines, and applies the second voltage from the second voltage circuit to the third and fourth selection gate lines.

14. The memory according to claim 13 , wherein the second voltage is different from the first voltage and is lower than the erasing voltage.

15. A semiconductor memory comprising:

a first memory string including a first selection transistor above a semiconductor substrate, a second selection transistor above the first selection transistor, first memory cells above the second selection transistor, and a third selection transistor above the first memory cells;

a second memory string including a fourth selection transistor, a fifth selection transistor above the fourth selection transistor, second memory cells above the fifth selection transistor, and a sixth selection transistor above the second memory cells;

a first line connected to gate electrodes of the first selection transistor and the fourth selection transistor;

a second line connected to a gate electrode of the second selection transistor;

a third line, different from the second line, connected to a gate electrode of the fifth selection transistor;

a first voltage generation circuit configured to generate a first voltage to the first line; and

a second voltage generation circuit configured to generate a second voltage to the second line, wherein

the first selection transistor has a first channel region in the semiconductor substrate and a second channel region in a first semiconductor pillar, the first semiconductor pillar extending above the semiconductor substrate, and

the second selection transistor has a channel region in the first semiconductor pillar.