Pattern forming method
View Patent ↗A pattern is formed by forming a first pattern on a first film, forming a block copolymer layer including a first block chain and a second block chain on the first pattern, forming a second pattern, forming a second film on the second pattern, selectively removing the second film until the second pattern is exposed, forming a third pattern, and processing the first film using the third pattern as a mask. The second pattern is formed by microphase-separating the block copolymer layer, and removing the first block chain or the second block chain. The second film is formed by applying a material having an etch rate that is less than an etch rate of a material of the first pattern and the second pattern. The third pattern is formed by selectively removing the second pattern and the first pattern using the second film as a mask.
1. A pattern forming method comprising:
forming a first pattern of a first material on a first film;
forming a block copolymer layer including a first block polymer chain and a second block polymer chain, on the first pattern;
forming a second pattern by microphase-separating the block copolymer layer, and removing one of the separated first block polymer chain or the second block polymer chain;
forming a second film that covers the second pattern by applying a second material having an etch rate that is less than an etch rate of a material of the first pattern and the second pattern;
selectively removing the second film until the second pattern is exposed;
forming a third pattern by selectively removing portions of the first pattern exposed in openings of the third pattern using the second pattern as a mask, the third pattern including a first portion that includes a portion of the first pattern and the second film on the first pattern, and a second portion that includes the second film which is formed directly on the first film, wherein the second portion has a film thickness that is greater than a thickness of the second film of the first portion by a thickness of the first pattern; and
processing the first film using the third pattern as a mask.
2. The method according to claim 1 ,
wherein the first material has an affinity to both of the first block polymer chain and the second block polymer chain.
3. The method according to claim 2 , wherein the first block polymer chain or the second block polymer chain is removed by at least one of wet etching and dry etching.
4. The method according to claim 2 ,
wherein the second material is selected from a resin containing silicon, and a resin containing a metal.
5. The method according to claim 4 ,
wherein the resin containing a metal is a silsesquioxane.
6. The method according to claim 4 ,
wherein the first block polymer chain or the second block polymer chain is removed by at least one of wet etching and dry etching.
7. The method according to claim 1 ,
wherein the second material is selected from a resin containing silicon, and a resin containing a metal.
8. The method according to claim 1 ,
wherein the first block polymer chain or the second block polymer chain is removed by at least one of wet etching and dry etching.
9. A pattern forming method comprising:
forming a first pattern of a first material on a first film;
forming a block copolymer layer including a first block polymer chain and a second block polymer chain, on the first pattern, wherein the first material has an affinity to both of the first block polymer chain and the second block polymer chain;
forming a second pattern by microphase-separating the block copolymer layer, and removing one of the first block polymer chain or the second block polymer chain;
forming a second film that covers the second pattern by applying a second material having an etch rate that is less than an etch rate of a material of the first pattern and the second pattern;
selectively removing the second film until the second pattern is exposed;
forming a third pattern by selectively removing the first pattern using the second film as a mask, the third pattern including a first portion that includes the first pattern and the second film on the first pattern, and a second portion that includes the second film which is formed directly on the first film, wherein the second portion includes a film thickness that is greater than a thickness of the second film of the first portion by a thickness of the first pattern;
removing the second pattern using the second film as a mask; and
processing the first film using the third pattern as a mask.
10. The method according to claim 9 , wherein the first block polymer chain or the second block polymer chain is removed by at least one of wet etching and dry etching.
11. The method according to claim 10 ,
wherein the second material is selected from a resin containing silicon, and a resin containing a metal.
12. The method according to claim 11 ,
wherein the resin containing a metal is a silsesquioxane.
13. The method according to claim 11 ,
wherein the first block polymer chain or the second block polymer chain is removed by at least one of wet etching and dry etching.
14. The method according to claim 9 ,
wherein the second material is selected from a resin containing silicon, and a resin containing a metal.
15. The method according to claim 14 ,
wherein the first block polymer chain or the second block polymer chain is removed by at least one of wet etching and dry etching.
16. A pattern forming method comprising:
forming a first pattern of a first material on a first film;
forming a block copolymer layer including a first block polymer chain and a second block polymer chain, on the first pattern, wherein the first material has an affinity to both of the first block polymer chain and the second block polymer chain;
forming a second pattern by microphase-separating the block copolymer layer, and removing one of the first block polymer chain or the second block polymer chain, wherein the first block polymer chain or the second block polymer chain is removed by at least one of wet etching and dry etching;
forming a second film that covers the second pattern by applying a second material having an etch rate that is less than an etch rate of a material of the first pattern and the second pattern;
selectively removing the second film until the second pattern is exposed;
forming a third pattern by selectively removing the first pattern using the second film as a mask, the third pattern including a first portion that includes the first pattern and the second film on the first pattern, and a second portion that includes the second film which is formed directly on the first film, wherein the second portion includes a film thickness that is greater than a thickness of the second film of the first portion by a thickness of the first pattern;
removing the second pattern using the second film as a mask; and
processing the first film using the third pattern as a mask.
17. The method according to claim 16 ,
wherein the second material is selected from a resin containing silicon, and a resin containing a metal.
18. The method according to claim 17 ,
wherein the metal comprises titanium.
19. The method according to claim 16 ,
wherein the resin containing a metal is a silsesquioxane.
20. The method according to claim 19 ,
wherein the metal comprises titanium.