Flip chip scheme and method of forming flip chip scheme
View Patent ↗The present invention provides a flip chip scheme and a method of forming the flip chip scheme. The flip chip scheme comprises: a plurality of bumps, some of the bumps arranged in a first pattern, respectively, and some of the bumps arranged in a second pattern different from the first pattern, respectively; wherein the first pattern is an equilateral triangle arranged by three bumps, and the second pattern is a square arranged by four bumps. The method comprises: arranging some of the bumps in a first pattern, respectively, and arranging some of the bumps in a second pattern different from the first pattern, respectively; wherein the first pattern is an equilateral triangle arranged by three bumps, and the second pattern is a square arranged by four bumps.
1. A flip chip scheme, comprising:
a plurality of bumps, some of the bumps arranged in a first pattern, respectively, and some of the bumps arranged in a second pattern different from the first pattern, respectively;
wherein the first pattern is an equilateral triangle arranged by three bumps, and the second pattern is a square arranged by four bumps.
2. The flip chip scheme of claim 1 , further comprising:
a bump map, formed by a plurality of first patterns and a plurality of second patterns.
3. The flip chip scheme of claim 2 , wherein bump map comprises at least a pattern combining one of the first patterns and one of the second patterns, which combines the equilateral triangle and the square.
4. The flip chip scheme of claim 1 , wherein at least one of the bumps is deleted when there is no enough bump spacing.
5. The flip chip scheme of claim 1 , wherein at least one of the bumps is shifted when there is a signal routing near the shifted bump.
6. A flip chip scheme, comprising:
a non-uniform power domain; and
a non-uniform bump map, formed by a plurality of bumps to fit the non-uniform power domain.
7. The flip chip scheme of claim 6 , wherein some of the bumps are arranged in a first pattern, respectively, and some of the bumps are arranged in a second pattern different from the first pattern, respectively.
8. The flip chip scheme of claim 7 , wherein the first pattern is an equilateral triangle arranged by three bumps, and the second pattern is a square arranged by four bumps.
9. The flip chip scheme of claim 8 , wherein the bump map is formed by a plurality of first patterns and a plurality of second patterns.
10. The flip chip scheme of claim 9 , wherein bump map comprises at least a pattern combining one of the first patterns and one of the second patterns, which combines the equilateral triangle and the square.
11. The flip chip scheme of claim 6 , wherein at least one of the bumps is deleted when there is no enough bump spacing.
12. The flip chip scheme of claim 6 , wherein at least one of the bumps is shifted when there is a signal routing near the shifted bump.
13. A method of forming a flip chip scheme comprising a plurality of bumps, the method comprising:
arranging some of the bumps in a first pattern, respectively, and
arranging some of the bumps in a second pattern different from the first pattern, respectively;
wherein the first pattern is an equilateral triangle arranged by three bumps, and the second pattern is a square arranged by four bumps.
14. The method of claim 13 , further comprising:
forming a bump map by a plurality of first patterns and a plurality of second patterns.
15. The method of claim 14 , wherein bump map comprises at least a pattern combining one of the first patterns and one of the second patterns, which combines the equilateral triangle and the square.
16. The method of claim 13 , further comprising:
deleting at least one of the bumps when there is no enough bump spacing.
17. The method of claim 13 , further comprising:
shifting at least one of the bumps when there is a signal routing near the shifted bump.
18. A method of forming a flip chip scheme, comprising:
forming a non-uniform power domain; and
forming a non-uniform bump map by a plurality of bumps to fit the non-uniform power domain.
19. The method of claim 18 , further comprising:
arranging some of the bumps in a first pattern, respectively, and
arranging some of the bumps in a second pattern different from the first pattern, respectively.
20. The method of claim 19 , wherein the first pattern is an equilateral triangle arranged by three bumps, and the second pattern is a square arranged by four bumps.
21. The method of claim 20 , further comprising:
forming a bump map by a plurality of first patterns and a plurality of second patterns.
22. The method of claim 21 , wherein bump map comprises at least a pattern combining one of the first patterns and one of the second patterns, which combines the equilateral triangle and the square.
23. The method of claim 18 , further comprising:
deleting at least one of the bumps when there is no enough bump spacing.
24. The method of claim 18 , further comprising:
shifting at least one of the bumps when there is a signal routing near the shifted bump.